摘要:
Mixtures which can be cured to give moulded materials having technically valuable mechanical and dielectric properties, characterized that they contain(a) polyimides of maleic acid or citraconic acid,(b) derivatives of .beta.-amino-crotonic acid, and optionally(c) polyamines.
摘要:
Mixtures which can be cured to give moulded materials having technically valuable mechanical and dielectric properties, characterized that they contain(a) polyimides of maleic acid or citraconic acid,(b) derivatives of .beta.-amino-crotonic acid, and optionally(c) polyamines.
摘要:
According to the invention, polyaddition products containing imide groups are manufactured by reacting certain polyimides (preferably maleimides) with polyhydric phenols in the presence of basic compounds. The preferred embodiment (A) relates to the use of catalysts as basic compounds. In particular, tertiary, secondary or mixed tertiary-secondary amines can be used. A further embodiment (B) relates to the use of primary polyamines as basic compounds. In the latter case, the polyamine participates in the polyaddition mechanism, that is to say the molecules are incorporated into the polyaddition products. In this latter case, catalysts can also be used additionally.The invention can be utilized particularly in the fields of surface protection, the electrical industry, laminating processes and the manufacture of foamed plastics, and in the building industry.
摘要:
A mixture which can be converted to a heat-resistant foamed plastic and which contains a polyimide of an unsaturated dicarboxylic acid, an azomethine, a solid blowing agent, and optionally a polyamine. On warming, the mixture gives a foamed plastic of high heat resistance and good resistance to chemicals.
摘要:
A mixture which can be converted to a heat-resistant foamed plastic and which contains a solid blowing agent, a thermoplastic prepolymer of a polyimide of an unsaturated acid, an azomethine and a polyamine. On warming, the mixture gives a foamed plastic of high heat resistance and good resistance to chemicals.
摘要:
A process for the preparation of a laminate including the steps(i) preparation of a layer by bringing into contact a fibrous substrate with a curable mixture containing an epoxy resin having on average at least two 1,2-epoxide groups per molecule or a mixture of these epoxy resins and a compound of the formula I ##STR1## or a mixture of these compounds, in which a and b are independent of one another 1 or 2, R.sup.1 is a .pi.-arene, R.sup.2 is a .pi.-arene or an indenyl- or cyclopentadienyl anion, X.sup.- is an anion [LQ.sub.m ].sup.- or an anion of a partly fluorinated or perfluorinated aliphatic or aromatic sulfonic acid, L is P, As or Sb, Q is fluorine or some of the Q substituents may also be hydroxyl groups, and m corresponds to a value which exceeds the valence of L by unity,(ii) preparation of a laminated sequence from at least two layered materials which are to be bonded together(iii) compression moulding of the said laminate sequence at elevated temperature.
摘要:
Heat-curable mixtures containing (a) epoxy compounds having on average more than one 1,2-epoxy group per molecule, (b) monoimides or polyimides of specific unsaturated dicarboxylic acids of the formula I ##STR1## wherein A is an x-valent aromatic or aliphatic radical, R.sup.1 is hydrogen or methyl, and x is 1, 2 or 3, and (c) products of condensing specific phenols, specific amines and aldehydes or ketones in an acid medium.The novel curable mixtures have a long shelf life and give rise to moulded materials which are highly resistant to chemicals and resistant to boiling water.
摘要:
Flexible base materials consisting of a metal foil and a film, firmly adhering thereto without an interlayer, of a polyamide/polyimide block copolymer of the formula I, or of a polyamide/polyimide copolymer prepared from a polyamide acid block of the formula IVa or Va and a dicarboxylic acid dichloride of the formula XI and a diamine of the formula XII.The individual symbols are defined in claim 1.The base materials according to the invention are suitable for the preparation of flexible printed circuits.
摘要:
Heat-curable mixtures of one or more epoxide compounds, which, on average, have more than one epoxide group in the molecule, and one or more .beta.-aminocrotonic acid derivatives, such as .beta.-aminocrotononitrile, .beta.-aminocrotonamide or .beta.-aminocrotonic acid esters, and also, if desired, a polyamine or polycarboxylic acid anhydride or a malenimide. The novel curable mixtures are distinguished by outstanding stability on storage, can be processed easily and give moulded materials with good mechanical properties.
摘要:
Heat-curable mixtures of one or more epoxide compounds, which, on average, have more than one epoxide group in the molecule, and one or more .beta.-aminocrotonic acid derivatives, such as .beta.-aminocrotononitrile, .beta.-aminocrotonamide or .beta.-aminocrotonic acid esters, and also, if desired, a polyamine or polycarboxylic acid anhydride or a maleimide. The novel curable mixtures are distinguished by outstanding stability on storage, can be processed easily and give moulded materials with good mechanical properties.