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1.发明授权Ignition exciter circuit with thyristors having high di/dt and high voltage blockage 失效具有高di / dt和高电压阻塞的晶闸管的点火激励器电路
公开(公告)号：US5592118A
公开(公告)日：1997-01-07
申请号：US207717
申请日：1994-03-09
CPC分类号： F02P7/035 , F02P15/003 , H01L29/0661 , H01L29/0839 , H01L29/74 , F02P17/12
摘要： An improved turbine engine ignition exciter circuit. Energy stored in an exciter tank capacitor is subsequently switched to the load (igniter plug) through a novel thyristor switching device specifically designed for pulse power applications. The switching device is designed and constructed to include, for example, a highly interdigitated cathode/gate structure. The semiconductor switching device is periodically activated by a trigger circuit which may be comprised of either electromagnetic or optoelectronic triggering circuitry to initiate discharge of energy stored in exciter tank capacitor to mating ignition lead and igniter plug. Likewise, the present invention allows new flexibility in the output PFN (Pulse Forming Network) stage, eliminating need for specialized protective output devices such as saturable output inductors. Due to considerably higher di/dt performance of the device, true high voltage output pulse networks may be utilized without damage to the semiconductor switching device. An exemplary embodiment of invention contains a novel feedback network which causes thyristor timing (trigger) and DC-DC converter circuits to compensate for varying igniter plug wear and dynamic engine combustor conditions, tailoring exciter spark rate, output voltage and energy to account for dynamic load conditions.
摘要翻译： 改进的涡轮发动机点火激励器电路。 存储在励磁机电容器中的能量随后通过专为脉冲功率应用专门设计的新型晶闸管开关器件切换到负载（点火器插头）。 开关器件被设计和构造为包括例如高度交错的阴极/栅极结构。 半导体开关器件由触发电路周期性地激活，该触发电路可以由电磁或光电触发电路组成，以启动存储在激励器箱电容器中的能量以配合点火引线和点火塞。 同样，本发明允许在输出PFN（脉冲形成网络）阶段中具有新的灵活性，消除了对诸如饱和输出电感器之类的专用保护输出装置的需要。 由于器件的di / dt性能相当高，可以利用真正的高电压输出脉冲网络而不损坏半导体开关器件。 本发明的一个示例性实施例包含一种新颖的反馈网络，其使晶闸管定时（触发）和DC-DC转换器电路补偿变化的点火器插头磨损和动态发动机燃烧器条件，调整激励器火花率，输出电压和能量以解释动态负载 条件。
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2.发明授权Solid state turbine engine ignition exciter having elevated temperature operational capability 有权固态涡轮发动机点火激励器具有升高的运行能力公开(公告)号：US07355300B2
公开(公告)日：2008-04-08
申请号：US10868621
申请日：2004-06-15
CPC分类号： F02P15/003 , H01L29/749
摘要： A turbine engine ignition exciter circuit applies energy stored in the exciter tank capacitor to the load (igniter plug) through a thyristor type semiconductor switching device that minimizes leakage current at elevated operating temperatures. The semiconductor switching device is periodically activated by a trigger circuit to initiate discharge of energy stored in exciter tank capacitor to mating ignition lead and igniter plug. The circuit operates at a modest, for example, approximately 1.8 kV, tank circuit voltage to further reduce switching device leakage current related stresses at elevated temperatures allowing relatively long capacitor charge cycles, increased upper operating temperature capability and improved reliability. The circuit uses a low side switch circuit topology for releasing energy from said capacitor to ground whereby negative polarity energy is applied to the exciter.
摘要翻译： 涡轮发动机点火激励器电路通过晶闸管型半导体开关装置将存储在励磁机电容器中的能量施加到负载（点火器插头），该晶闸管型半导体开关器件使升高的工作温度下的漏电流最小化。 半导体开关器件由触发电路周期性地激活，以启动储存在励磁机电容器中的能量，以配合点火引线和点火塞。 该电路以适度的方式工作，例如约1.8kV的电路电压，以进一步降低高温下的开关器件泄漏电流相关应力，从而允许相对长的电容器充电循环，增加上部工作温度能力和改进的可靠性。 该电路使用低侧开关电路拓扑，用于将能量从所述电容器释放到地，由此负极性能量施加到励磁机。
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3.发明授权Method and apparatus for fabricating and connecting a semiconductor power switching device 有权用于制造和连接半导体功率开关器件的方法和装置公开(公告)号：US07658614B2
公开(公告)日：2010-02-09
申请号：US11599103
申请日：2006-11-14
IPC分类号： H01R9/05
CPC分类号： B28D1/121 , B28D5/022 , H01L21/78 , H01L2924/0002 , H01L2924/10158 , H01L2924/00
摘要： Fabrication processes for manufacturing and connecting a semiconductor switching device are disclosed, including an embodiment for dicing a wafer into individual circuit die by sawing the interface between adjacent die with a saw blade that has an angled configuration across its width, preferably in a generally V-shape so that the adjacent die are severed from one another while simultaneously providing a beveled surface on the sides of each separated die. Another embodiment relates to the manner in which damage to a beveled side surface of the individual die can be smoothed by a chemical etching process. Another embodiment relates to the manner in which the device can be easily mounted on a printed circuit board by providing conductive lands on the printed circuit board that are coextensive with metallized electrodes on the device and which can be placed on the printed circuit board and soldered in place and a unique lead frame which can be soldered to another electrode metallization on the opposite side of the chip and the printed circuit board in a manner which substantially reduces if not eliminates harmful thermal stress and which assures secure bonding notwithstanding elevation differences between the electrode metallization and the printed circuit board the lead frame is attached to. Another embodiment relates to an output connector for interconnecting an exciter circuit product with a spark producing device wherein the output connector utilizes a configuration that includes a sealing structure that is reliable and easily installed.
摘要翻译： 公开了用于制造和连接半导体开关器件的制造工艺，包括用于通过锯切具有横向宽度的成角度构造的锯片的相邻模具之间的界面，优选地以大致V字形切割 使得相邻的模具彼此切断，同时在每个分离的模具的侧面上提供倾斜的表面。 另一个实施例涉及通过化学蚀刻工艺可以平滑各个管芯的倾斜侧表面的损伤的方式。 另一个实施例涉及通过在印刷电路板上设置导电焊盘而将装置容易地安装在印刷电路板上的方法，该导电焊盘与装置上的金属化电极共同延伸并且可以放置在印刷电路板上并焊接在印刷电路板上 位置和独特的引线框架，其可以以如下方式大大降低，即在不消除有害的热应力的情况下，可以将其焊接到芯片和印刷电路板的相对侧上的另一电极金属化，并且即使电极金属化之间的高差也保证了可靠的接合 和引线框架连接的印刷电路板。 另一个实施例涉及一种用于将激励器电路产品与火花产生装置相互连接的输出连接器，其中输出连接器使用包括可靠且容易安装的密封结构的构造。
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4.发明授权Method and apparatus for fabricating and connecting a semiconductor power switching device 有权用于制造和连接半导体功率开关器件的方法和装置公开(公告)号：US07144792B2
公开(公告)日：2006-12-05
申请号：US10975830
申请日：2004-10-28
IPC分类号： H01L21/78 , H01L21/46 , H01L21/301
CPC分类号： B28D1/121 , B28D5/022 , H01L21/78 , H01L2924/0002 , H01L2924/10158 , H01L2924/00
摘要： Fabrication processes for manufacturing and connecting a semiconductor switching device are disclosed, including an embodiment for dicing a wafer into individual circuit die by sawing the interface between adjacent die with a saw blade that has an angled configuration across its width, preferably in a generally V-shape so that the adjacent die are severed from one another while simultaneously providing a beveled surface on the sides of each separated die. Another embodiment relates to the manner in which damage to a beveled side surface of the individual die can be smoothed by a chemical etching process. Another embodiment relates to the manner in which the device can be easily mounted on a printed circuit board by providing conductive lands on the printed circuit board that are coextensive with metallized electrodes on the device and which can be placed on the printed circuit board and soldered in place and a unique lead frame which can be soldered to another electrode metallization on the opposite side of the chip and the printed circuit board in a manner which substantially reduces if not eliminates harmful thermal stress and which assures secure bonding notwithstanding elevation differences between the electrode metallization and the printed circuit board the lead frame is attached to. Another embodiment relates to an output connector for interconnecting an exciter circuit product with a spark producing device wherein the output connector utilizes a configuration that includes a sealing structure that is reliable and easily installed.
摘要翻译： 公开了用于制造和连接半导体开关器件的制造工艺，包括用于通过锯切具有横向宽度的成角度构造的锯片的相邻模具之间的界面，优选地以大致V字形切割 使得相邻的模具彼此切断，同时在每个分离的模具的侧面上提供倾斜的表面。 另一个实施例涉及通过化学蚀刻工艺可以平滑各个管芯的倾斜侧表面的损伤的方式。 另一个实施例涉及通过在印刷电路板上设置导电焊盘而将装置容易地安装在印刷电路板上的方法，该导电焊盘与装置上的金属化电极共同延伸并且可以放置在印刷电路板上并焊接在印刷电路板上 位置和独特的引线框架，其可以以如下方式大大降低，即在不消除有害的热应力的情况下，可以将其焊接到芯片和印刷电路板的相对侧上的另一电极金属化，并且即使电极金属化之间的高差也保证了可靠的接合 和引线框架连接的印刷电路板。 另一个实施例涉及一种用于将激励器电路产品与火花产生装置相互连接的输出连接器，其中输出连接器使用包括可靠且容易安装的密封结构的构造。
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5.发明授权Thermal insulating coating employing microencapsulated phase change material and method 失效使用微胶囊化相变材料和方法的绝热涂层
公开(公告)号：US5804297A
公开(公告)日：1998-09-08
申请号：US498168
申请日：1995-07-05
CPC分类号： C09K5/06 , F28D20/023 , Y02E60/145 , Y10S428/913 , Y10T428/254 , Y10T428/26 , Y10T428/2984 , Y10T428/2985 , Y10T428/2989 , Y10T428/2998
摘要： A method of insulating a substrate from repeated thermal transients and/or thermal impulses applied thereto by proximately absorbing and storing the thermal transients and/or thermal impulses for subsequent removal by radiation. According to the method, a coating is placed in energy absorbing contacting relation with the substrate. The coating includes a base material and a plurality of microcapsules dispersed within the base material. The microcapsules may be dispersed throughout the base material and may be submerged therein so that they are substantially spaced apart from one another. The microcapsules contain a thermal energy absorbing material, for example, a phase change material such a paraffinic hydrocarbons or alternatively, plastic crystals. Articles of manufacture may be produced according to the present invention which employ the above described coating.
摘要翻译： 通过近似吸收和存储热瞬变和/或热脉冲以随后通过辐射去除而将衬底与重复的热瞬态和/或热脉冲绝缘的方法。 根据该方法，将涂层置于与基材的能量吸收接触关系中。 涂层包括基材和分散在基材内的多个微胶囊。 微胶囊可以分散在整个基材中并且可以浸没在其中，使得它们彼此基本间隔开。 微胶囊包含热能吸收材料，例如相变材料，例如链烷烃或可选的塑料晶体。 可以根据使用上述涂层的本发明制造制品。
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