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公开(公告)号：US20110291125A1
公开(公告)日：2011-12-01
申请号：US13147824
申请日：2010-01-25
IPC分类号： H01L33/08
CPC分类号： F21S4/006 , F21S4/24 , F21V31/005 , F21Y2115/10
摘要： A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.
摘要翻译： 照明模块可以包括具有带状柔性衬底的照明带，其中至少一个半导体光源被施加到衬底的顶侧，其中照明模块面对保护层，使得至少一个发射区域 的至少一个半导体光源被暴露。
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公开(公告)号：US08994039B2
公开(公告)日：2015-03-31
申请号：US13147824
申请日：2010-01-25
IPC分类号： H01L29/18 , H01L29/22 , F21S4/00 , F21V31/00 , F21Y101/02
CPC分类号： F21S4/006 , F21S4/24 , F21V31/005 , F21Y2115/10
摘要： A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.
摘要翻译： 照明模块可以包括具有带状柔性衬底的照明带，其中至少一个半导体光源被施加到衬底的顶侧，其中照明模块面对保护层，使得至少一个发射区域 的至少一个半导体光源被暴露。
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公开(公告)号：US20100242519A1
公开(公告)日：2010-09-30
申请号：US12746539
申请日：2007-12-07
CPC分类号： F21V29/83 , F21V29/503 , F21V29/74 , F21V29/75 , F21V29/773 , F21Y2115/10
摘要： A heat sink may include a light source region for mounting a light source; a heat spreading and dissipation structure covering at least part of an exterior of the heat sink; wherein the structure comprises vertically aligned fins; wherein the structure comprises an air flow channel leading from a bottom region to a lateral region, the air flow channel being created by a gap between adjacent fins; wherein the light source region comprises an open cavity formed by a cavity wall comprising a light source mounting region adapted to receive the light source; wherein the fins are integrally connected to the exterior of the cavity wall; wherein the heat sink comprises a solid heat sink base extending from the light source mounting region to the exterior and protruding from the cavity wall; and wherein the structure is in thermal connection with the heat sink base.
摘要翻译： 散热器可以包括用于安装光源的光源区域; 覆盖散热器外部的至少一部分的散热和散热结构; 其中所述结构包括垂直排列的翅片; 其中所述结构包括从底部区域引导到横向区域的空气流动通道，所述空气流动通道由相邻翅片之间的间隙产生; 其中所述光源区域包括由空腔壁形成的开放空腔，所述空腔壁包括适于接收所述光源的光源安装区域; 其中所述翅片一体地连接到所述腔壁的外部; 其中所述散热器包括从所述光源安装区域延伸到外部并从所述空腔壁突出的固体散热器基座; 并且其中所述结构与所述散热器基座热连接。
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公开(公告)号：US08665603B2
公开(公告)日：2014-03-04
申请号：US12745696
申请日：2007-12-03
IPC分类号： H05K5/00
CPC分类号： H05K7/1417
摘要： A housing for electrical components is provided. The housing may include a mouth portion to cooperate with a circuit board in an assembled condition wherein said circuit board is applied against said mouth portion of the housing. The housing may include at least one spring formation located at said mouth portion to cooperate with said circuit board to elastically urge said circuit board away from said mouth portion, and at least one hook-like formation extending from said mouth portion distally of said housing, said hook-like formation adapted to cooperate with said circuit board to retain said circuit board assembled to said housing against the force exerted by said spring formation.
摘要翻译： 提供了用于电气部件的壳体。 壳体可以包括在组装状态下与电路板协作的口部分，其中所述电路板被施加在壳体的所述口部上。 壳体可以包括位于所述嘴部处的至少一个弹簧形式，以与所述电路板配合以弹性地迫使所述电路板远离所述口部;以及至少一个从所述口部向远侧延伸的钩状结构， 所述钩状结构适于与所述电路板配合，以克服所述弹簧形成所施加的力而将组装在所述壳体上的所述电路板保持在一起。
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公开(公告)号：US20090284172A1
公开(公告)日：2009-11-19
申请号：US11989608
申请日：2006-07-27
CPC分类号： H05B33/083 , H05B33/086 , H05B33/0866
摘要： A LED arrangement includes: —a plurality of cells (0, 1, 2, 3) each including at least one respective LED having a binning class as a function of its emission wavelength (L1, L2) and brightness (B1, B2) characteristics, —a plurality of impedance elements (R0, R1, R2, R3) respectively coupled with the cells (0, 1, 2, 3), each impedance element (R0, R1, R2, R3) having an impedance value indicative of the binning class of the at least one LED included in the respective cell (0, 1, 2, 3), and —a controller (5) configured for sensing (6, 80, 81, 82, 83) the impedance values of the impedance elements (R0, R1, R2, R3) and adaptively drive each cell (0, 1, 2, 3) as a function of its binning class as indicated by the impedance element (R0, R1, R2, R3) coupled to the cell.
摘要翻译： LED布置包括： - 多个单元（0,1,2,3），每个单元包括至少一个相应的LED，其具有作为其发射波长（L1，L2）和亮度（B1，B2）特性的函数的合并等级 分别与单元（0,1,2,3）耦合的多个阻抗元件（R0，R1，R2，R3），每个阻抗元件（R0，R1，R2，R3）具有指示 包括在相应单元（0,1,2,3）中的至少一个LED的组合类别，以及 - 被配置为感测（6,80,81,82,83）阻抗的阻抗的控制器（5） 元素（R0，R1，R2，R3），并自适应地驱动每个单元（0,1,2,3）作为其耦合类别的函数，如耦合到单元的阻抗元件（R0，R1，R2，R3）所示 。
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公开(公告)号：US20070290625A1
公开(公告)日：2007-12-20
申请号：US11762381
申请日：2007-06-13
申请人： Xi Yuan HE , Rui Ma , Giovanni Scilla
发明人： Xi Yuan HE , Rui Ma , Giovanni Scilla
IPC分类号： H05B41/16
CPC分类号： H02M3/3385 , H05B33/0815 , Y02B20/347
摘要： A driver arrangement for LED light sources includes a transformer having primary and secondary winding connections. A first electronic switch (SW1) controls current flow through the primary winding, and a sensing resistor is coupled to the primary winding to produce a current sensing signal. A second electronic switch (SW2) is sensitive to the sensing signal to switch off SW1 as current flow through the primary winding reaches a given threshold. SW1 is thus alternatively turned-on and off in alternating turn-on and switch-off phases to power the LED light source via the secondary winding. SW1 is a field effect transistor, preferably a MOSFET. The transformer is SELV-rated. The sensing resistor may be a variable resistor to adjust the duration of the on/off phases to permit controlled dimming.
摘要翻译： 用于LED光源的驱动装置包括具有初级和次级绕组连接的变压器。 第一电子开关（SW 1）控制通过初级绕组的电流，并且感测电阻器耦合到初级绕组以产生电流感测信号。 第二个电子开关（SW 2）对于感测信号敏感，以便通过初级绕组的电流流动达到给定的阈值来关闭SW 1。 SW 1因此在交替的导通和关断阶段中交替地导通和关闭，以通过次级绕组为LED光源供电。 SW 1是场效应晶体管，优选为MOSFET。 变压器额定电压为SELV。 感测电阻器可以是可变电阻器，以调节开/关相位的持续时间以允许受控的调光。
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公开(公告)号：US08602595B2
公开(公告)日：2013-12-10
申请号：US12609024
申请日：2009-10-30
IPC分类号： F21S4/00
CPC分类号： F21V17/107 , F21S2/005 , F21S4/20 , F21V17/164 , F21V19/0055 , F21V21/002 , F21V23/001 , F21V27/00 , F21V29/70 , F21Y2115/10
摘要： A lighting module includes a base plate for fixing to a mounting surface, and a reflector body carrying a printed circuit board with one or more electrical light sources such as high power LEDs. The printed circuit board (includes electrical contact pins to the electrical light sources. The base plate and the reflector body are provided with complementary coupling formations for snap-like coupling the base plate and the reflector body with an electrical line interposed in between for feeding the light sources with the electrical contact pins electrically contacting the electrical line. The module may include force-generating formations to urge the printed circuit board against the base plate to promote heat transfer in between.
摘要翻译： 照明模块包括用于固定到安装表面的基板和携带具有一个或多个电光源（例如大功率LED）的印刷电路板的反射体。 印刷电路板（包括与电光源的电接触销），基板和反射器主体设有互补的耦合结构，用于将基板和反射体本体之间用插入其间的电线进行卡扣式耦合， 具有电接触引脚与电线接触的光源，该模块可以包括力产生结构，以将印刷电路板推靠在基板上以促进两者之间的热传递。
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公开(公告)号：US08585247B2
公开(公告)日：2013-11-19
申请号：US12129058
申请日：2008-05-29
CPC分类号： F21V29/677 , F21K9/00 , F21V5/045 , F21V29/80 , F21V29/89 , F21Y2115/10 , H05K1/021 , H05K2201/09081 , H05K2201/10106
摘要： The lighting device has a stack of functional layers that in turn have at least: an optics layer with at least one optical element; a light source layer with at least one light source that is adapted to radiate light through the optics layer to an exterior; a printed circuit board connected to an electronic driver to drive the lighting device; and a cooling layer with at least one cooling element for cooling at least the at least one light source.
摘要翻译： 照明装置具有堆叠的功能层，其又至少具有：具有至少一个光学元件的光学层; 具有至少一个光源的光源层，其适于将光通过所述光学层辐射到外部; 连接到电子驱动器以驱动照明装置的印刷电路板; 以及具有至少一个用于至少冷却至少一个光源的冷却元件的冷却层。
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公开(公告)号：US08235097B2
公开(公告)日：2012-08-07
申请号：US12129150
申请日：2008-05-29
CPC分类号： F21V29/673 , F21K9/00 , F21V29/02 , F21V29/677 , F21V29/763 , F21V29/80 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , F21Y2115/30
摘要： A cooling apparatus has a heat sink thermally connectable to a heat source an air outlet opening at least two air intake openings, and a fan adapted to draw in air into the cooling apparatus through the air intake openings and to discharge the air from the cooling apparatus through the air outlet opening, wherein, upon operation of said fan, an air flow from at least one of the air intake openings forces an air flow from at least another one of the air intake openings to the heat sink.
摘要翻译： 冷却装置具有可热连接到热源的散热器，至少两个进气口的出气口，以及适于通过进气口将空气吸入冷却装置并将冷却装置排出空气的风扇 通过所述空气出口开口，其中，在所述风扇运行时，来自所述进气口中的至少一个的空气流迫使来自所述进气口中的至少另一个的空气流至所述散热器。
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公开(公告)号：US07800119B2
公开(公告)日：2010-09-21
申请号：US11975984
申请日：2007-10-22
申请人： Xiyuan He , Rui Ma , Wolfgang Georg Pabst , Giovanni Scilla
发明人： Xiyuan He , Rui Ma , Wolfgang Georg Pabst , Giovanni Scilla
IPC分类号： H01L27/15
CPC分类号： F21V29/74 , F21K9/233 , F21V19/0015 , F21V23/002 , F21V29/773 , F21V29/83 , F21V29/89 , F21V31/005 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , Y10S362/80 , H01L2924/00014
摘要： A semiconductor lamp having a light-emitting semiconductor device, the semiconductor device comprising a carrier and at least one light-emitting semiconductor component on the carrier, and a heatsink. The heatsink has a first main face, the semiconductor device is located adjacent to the first main face, and the carrier faces the first main face. The semiconductor device is thermally coupled to the heatsink, and the heatsink has at least one feedthrough for electrical connection of the semiconductor device.
摘要翻译： 一种具有发光半导体器件的半导体灯，所述半导体器件包括载体和载体上的至少一个发光半导体部件和散热器。 散热器具有第一主面，半导体器件位于与第一主面相邻的位置，并且载体面向第一主面。 半导体器件热耦合到散热器，并且散热器具有用于半导体器件的电连接的至少一个馈通。
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