摘要:
The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.
摘要:
An electronic water faucet is disclosed, including means for detecting the presence of an object near an outlet of said faucet and determining whether or not noise or reflected light is being sensed. The faucet includes a swivelable spout relative to a main body. Position sensing means for sensing the angular position of the spout are included. The angular positions which the spout can assume are designed to various zones, and those zones are programmed to be active or not active in an automatic mode of operation of the faucet. A rotary mixing valve for supplying and mixing hot and cold water using a cam and deformable seal is used to partially seal hot and cold water inlets.