摘要:
The present invention provides a composite electrode and method of manufacturing such a composite electrode, the method comprising the steps of: providing a first substrate layer with an electrically conducting surface; providing a non-conducting curable material; providing a second substrate layer which has a surface relief pattern defining at least one retaining feature corresponding to a desired metal track pattern; forming a line of contact between the conducting carrier layer and at least a part of the surface relief pattern; depositing curable material onto at least part of the surface relief pattern or the electrically conducting surface along the line of contact; advancing the line of contact and curing the curable material through the second substrate layer; releasing the cured material from the surface relief pattern feature so as to leave behind a surface relief pattern on the conducting carrier layer; depositing a first metal layer onto the exposed regions of the electrically conducting surface of the conducting carrier layer and optionally deposition further metal layers on the first metal layer.
摘要:
The present invention provides a composite electrode and method of manufacturing such a composite electrode, the method comprising the steps of: providing a first substrate layer with an electrically conducting surface; providing a non-conducting curable material; providing a second substrate layer which has a surface relief pattern defining at least one retaining feature corresponding to a desired metal track pattern; forming a line of contact between the conducting carrier layer and at least a part of the surface relief pattern; depositing curable material onto at least part of the surface relief pattern or the electrically conducting surface along the line of contact; advancing the line of contact and curing the curable material through the second substrate layer; releasing the cured material from the surface relief pattern feature so as to leave behind a surface relief pattern on the conducting carrier layer; depositing a first metal layer onto the exposed regions of the electrically conducting surface of the conducting carrier layer and optionally deposition further metal layers on the first metal layer.
摘要:
A saucer sled with a seat including a concave saucer-shaped sled having an interior surface, an exterior surface, and a continuous rounded outer rim. A trapezoidal base is medially disposed on the interior surface of the sled proximal a back area. A chair has a seat portion, a seatback portion, a right armrest, and a left armrest. A bottom surface of the seat portion of the chair is disposed atop inside the base. A pair of elongated apertures includes a right aperture and a left aperture. Each of the right aperture and the left aperture is disposed through a right area of the sled and a left area of the sled, respectively, along the outer rim.
摘要:
A cooling system has a cabinet and a plurality of separate cooling stages including an upstream cooling stage and a downstream cooling stage. At least the upstream cooling state is a variable capacity cooling stage. Each cooling stage has a cooling circuit. Evaporators of the cooling circuits are arranged in the cabinet so that air passes over them in serial fashion. A controller when a Call for Cooling first reaches a point where cooling is needed, operating the upstream cooling circuit to provide cooling and not the downstream cooling circuit. When the Call for Cooling has increased to a second point, the controller additionally operates the downstream cooling circuit to provide cooling. The cooling capacity at which the upstream cooling circuit is being operated is less than its full capacity when the Call for Cooling reaches the second point.
摘要:
A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.
摘要:
A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.
摘要:
A modular microfluidic system is described having at least one base board with a plurality of fluidly linked fluid supply apertures, optional intermediate level boards of equivalent construction, a plurality of microfluidic modules adapted to be detachably attached to the base board/intermediate boards, each having one or more fluid inlets and/or outlets, and a plurality of fluid couplings preferably in the form of projecting ferrules to effect releasable fluid connection between a module and a base board/intermediate level board via a supply aperture on the board and an inlet/outlet on the module. A method of providing a microfluidic system as a modular assembly is also described.
摘要:
A cooling system has a cooling circuit that includes an evaporator disposed in a cabinet, a condenser, a compressor, an electronic expansion valve and a liquid pump. a direct expansion mode and a pumped refrigerant economizer mode. When the cooling system is in the pumped refrigerant economizer mode, the controller controls a temperature of the refrigerant to a refrigerant temperature set point by regulating a speed of a fan of the condenser, controls a temperature of air in a room in which the cabinet is disposed to a room air temperature setpoint by regulating a speed of the liquid pump, and maintains a pressure differential across the liquid pump within a given range by regulating an open position of an electronic expansion valve.
摘要:
A cooling system has a cabinet and a plurality of separate cooling stages including an upstream cooling stage and a downstream cooling stage. At least the upstream cooling state is a variable capacity cooling stage. Each cooling stage has a cooling circuit. Evaporators of the cooling circuits are arranged in the cabinet so that air passes over them in serial fashion. A controller when a Call for Cooling first reaches a point where cooling is needed, operating the upstream cooling circuit to provide cooling and not the downstream cooling circuit. When the Call for Cooling has increased to a second point, the controller additionally operates the downstream cooling circuit to provide cooling. The cooling capacity at which the upstream cooling circuit is being operated is less than its full capacity when the Call for Cooling reaches the second point.
摘要:
A computer room air conditioner (“CRAC”) has a cabinet having an air inlet through which return air from an area is drawn and an air outlet through which air cooled by the CRAC is exhausted. An air moving unit is disposed in the cabinet as are a plurality of cooling coils, which are in separate cooling circuits. The cooling coils are arranged so that the air passes through the cooling coils in serial fashion, that is, first through an upstream cooling coil and then through a downstream cooling cool. The upstream cooling coil acts as a pre-cooler to the subsequent downstream cooling coil. The CRAC includes a controller that controls the cooling provided by the cooling circuits. The controller controls the cooling provided by the upstream cooling circuit so that when it is being used to provide cooling, it provides only sensible cooling.