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公开(公告)号：US08413712B2
公开(公告)日：2013-04-09
申请号：US11598497
申请日：2006-11-13
IPC分类号： F28F7/02
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.
摘要翻译： 冷却装置具有大量紧密间隔的冲击射流，邻近冲击间隙，具有平行返回路径，用于使用交叉分支的分级歧管以最小可能的压降为冲击射流提供冷却剂流。 表面增强特征跨越冲击间隙形成单个冲击射流和单个出口之间的U形微通道。
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公开(公告)号：US20130008632A1
公开(公告)日：2013-01-10
申请号：US13613881
申请日：2012-09-13
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , H01L23/4006 , H01L2224/73253
摘要： A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.
摘要翻译： 一种用于冷却电子部件的灵活的，独立的主动多相散热装置，散热器具有密封在两个板之间的流体和泵送机构以致动流体的多相流动。 来自与散热器接触的电子部件的热能从核心区域经由工作流体散发到整个散热器，然后散热到散热器。 位于两个板之间的表面增强特征有助于将热能从第一金属板传递到流体中。
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公开(公告)号：US07282799B2
公开(公告)日：2007-10-16
申请号：US11437084
申请日：2006-05-19
CPC分类号： H01L23/3733 , H01L23/3737 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73253 , H01L2224/83365 , H01L2224/83385 , H01L2224/8385 , H01L2924/01057
摘要： An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
摘要翻译： 通过将图案化的第一表面和第二表面压在一起形成界面，其中颗粒加载的界面材料在其间。 第一表面被制造成具有通道图案，其设计用于在界面形成期间重新分布出现在界面材料中的速度梯度，以便控制在界面形成结束时颗粒的排列，取向和浓度。 该概念适用于热界面和受控放置的纳米微粒和生物分子。
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4.发明授权Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies 失效用于单芯片和多芯片组件的整体适配材料制造表面适配盖的方法公开(公告)号：US07547582B2
公开(公告)日：2009-06-16
申请号：US11535091
申请日：2006-09-26
CPC分类号： H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01322 , H01L2924/10158 , H01L2924/16152 , H01L2224/0401
摘要： A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.
摘要翻译： 在单芯片和多芯片模块上具有集成的适配导热材料的表面适配帽提供了减小的间隙公差，因此提高了半导体器件的更好的热性能，从而提高了半导体器件的可靠性。 在其中一个实施例中，盖被整合的，限制的和高热适应性材料修改。 该系统上的膜非常灵活。 在适合材料的固化温度以下的温度下，将盖预先组装到芯片上。 在这种状态下，由于从盖到芯片的压缩和掩埋材料的限制体积，材料中的静水压力会发展。 这种静水压力导致膜偏转并适应芯片的翘曲和公差。 由于自适应表面，芯片和芯片到芯片的每个位置上的间隙是相同的。
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公开(公告)号：US08327540B2
公开(公告)日：2012-12-11
申请号：US12538797
申请日：2009-08-10
IPC分类号： B21D53/02
CPC分类号： H01L23/42 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.
摘要翻译： 一种制造具有第一面的板的方法，具有由第一和第二槽限定的突起，包括以下步骤：将凹陷区域蚀刻成板; 在所述板上沉积光致抗蚀剂层; 在光致抗蚀剂层上形成钝化层; 去除凹陷区域底部的钝化层; 电镀金属在凹陷区域; 去除钝化层; 去除光致抗蚀剂层; 以及去除所述半导体材料以暴露所述第一和第二凹槽。
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公开(公告)号：US20100037461A1
公开(公告)日：2010-02-18
申请号：US12538797
申请日：2009-08-10
CPC分类号： H01L23/42 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method for producing a plate with a first face with protrusions confined by first and second grooves includes steps of: etching recessed zones into a plate; depositing a photoresist layer on the plate; forming a passivation layer over the photoresist layer; removing the passivation layer at the bottom of the recessed zones; electroplating metal in the recessed zones; removing the passivation layer; removing the photoresist layer; and removing the semiconductor material to expose the first and second grooves.
摘要翻译： 一种制造具有第一面的板的方法，具有由第一和第二槽限定的突起，包括以下步骤：将凹陷区域蚀刻成板; 在所述板上沉积光致抗蚀剂层; 在光致抗蚀剂层上形成钝化层; 去除凹陷区域底部的钝化层; 电镀金属在凹陷区域; 去除钝化层; 去除光致抗蚀剂层; 以及去除所述半导体材料以暴露所述第一和第二凹槽。
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7.发明申请SURFACE ADAPTING CAP WITH INTEGRAL ADAPTING MATERIAL FOR SINGLE AND MULTI CHIP MODULE ASSEMBLY 失效具有整体适配材料的单面和多芯片模块组装表面处理盖公开(公告)号：US20080073775A1
公开(公告)日：2008-03-27
申请号：US11535091
申请日：2006-09-26
IPC分类号： H01L23/12
CPC分类号： H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01322 , H01L2924/10158 , H01L2924/16152 , H01L2224/0401
摘要： A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the semiconductor device which enhances the reliability of the semiconductor device. In one of the embodiments the cap is modified with an integrated, confined, and high thermal adaptive material. The membrane on this system is highly flexible. The cap is preassembled to the chip at a temperature above liquidus below curing temperature of the adaptive material. At this state, a hydrostatic pressure in the material develops due to the compression exerted from the cap to the chip and the confined volume of the buried material. This hydrostatic pressure causes the membrane to deflect and to adapt the warping and tolerances of the chip. Due to the adaptive surface the gap on each position of the chip and from chip to chip is same.
摘要翻译： 在单芯片和多芯片模块上具有集成的适配导热材料的表面适配帽提供了减小的间隙公差，因此提高了半导体器件的更好的热性能，从而提高了半导体器件的可靠性。 在其中一个实施例中，盖被整合的，限制的和高热适应性材料修改。 该系统上的膜非常灵活。 在适合材料的固化温度以下的温度下，将盖预先组装到芯片上。 在这种状态下，由于从盖到芯片的压缩和掩埋材料的限制体积，材料中的静水压力会发展。 这种静水压力导致膜偏转并适应芯片的翘曲和公差。 由于自适应表面，芯片和芯片到芯片的每个位置上的间隙是相同的。
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公开(公告)号：US07748440B2
公开(公告)日：2010-07-06
申请号：US11141932
申请日：2005-06-01
CPC分类号： H01L23/42 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.
摘要翻译： 本发明提供一种通过导热材料彼此接触的第一和第二面的热界面。 第一面包括至少部分地填充有导热材料的凹槽，其中布置至少两种类型的凹槽，即具有比第二凹槽宽的宽度的第一凹槽。 第一面包括具有被第二凹槽限制的突起的阵列，该阵列被第一凹槽划分为子阵列。
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公开(公告)号：US07532475B2
公开(公告)日：2009-05-12
申请号：US11394007
申请日：2006-03-30
CPC分类号： H01L23/3733 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
摘要翻译： 提供了一种应力释放热界面，用于在保持可靠的热和机械接触的同时，防止多芯片模块（MCM）中芯片和散热片表面之间的应力增大。 该接口通过使用附接到芯片和散热器表面的柔性互锁柱来实现增强的热传导。
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公开(公告)号：US20060286712A1
公开(公告)日：2006-12-21
申请号：US11437084
申请日：2006-05-19
CPC分类号： H01L23/3733 , H01L23/3737 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73253 , H01L2224/83365 , H01L2224/83385 , H01L2224/8385 , H01L2924/01057
摘要： An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
摘要翻译： 通过将图案化的第一表面和第二表面压在一起形成界面，其中颗粒加载的界面材料在其间。 第一表面被制造成具有通道图案，其设计用于在界面形成期间重新分布出现在界面材料中的速度梯度，以便控制在界面形成结束时颗粒的排列，取向和浓度。 该概念适用于热界面和受控放置的纳米微粒和生物分子。
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