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公开(公告)号：US20080271384A1
公开(公告)日：2008-11-06
申请号：US11857499
申请日：2007-09-19
申请人： Thomas Puthanangady , Taewook Hwang , Srinivasan Ramanath , Eric M. Schultz , J. Gary Baldoni , Sergej-Tomislav Buljan , Charles Dinh-Ngoc
发明人： Thomas Puthanangady , Taewook Hwang , Srinivasan Ramanath , Eric M. Schultz , J. Gary Baldoni , Sergej-Tomislav Buljan , Charles Dinh-Ngoc
CPC分类号： B24B53/017 , B24B53/12 , B24D3/06 , B24D18/00
摘要： Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.
摘要翻译： 用于调理化学机械平面化（CMP）衬垫的工具包括具有与至少一个表面耦合的磨料颗粒的衬底。 这些工具可以具有各种粒子和键结构。 例如，磨料颗粒可以结合（例如钎焊或其他金属粘合技术）到一侧或前后两侧。 或者，磨料颗粒结合到前侧，并且填料颗粒连接到背面。 研磨颗粒可以形成图案（例如六边形），并且具有足够小的粒度以在调理期间穿透CMP垫的孔，导致用经调节的CMP垫抛光的晶片上的缺陷较少。 可以使用钎焊膜来实现晶粒结合，尽管也可以使用其它金属键。 此外，平衡粘合材料（例如，两侧上钎焊）允许低的平坦度值。
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2.发明申请公开(公告)号：US20120060426A1
公开(公告)日：2012-03-15
申请号：US13301276
申请日：2011-11-21
申请人： Thomas PUTHANANGADY , Taewook Hwang , Srinivasan Ramanath , Eric M. Schultz , J. Gary Baldoni , Biljana Buljan , Charles Dinh-Ngoc
发明人： Thomas PUTHANANGADY , Taewook Hwang , Srinivasan Ramanath , Eric M. Schultz , J. Gary Baldoni , Biljana Buljan , Charles Dinh-Ngoc
IPC分类号： B24D3/06
CPC分类号： B24B53/017 , B24B53/12 , B24D3/06 , B24D18/00
摘要： Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.
摘要翻译： 用于调理化学机械平面化（CMP）衬垫的工具包括具有与至少一个表面耦合的磨料颗粒的衬底。 这些工具可以具有各种粒子和键结构。 例如，磨料颗粒可以结合（例如钎焊或其他金属粘合技术）到一侧或前后两侧。 或者，磨料颗粒结合到前侧，并且填料颗粒连接到背面。 研磨颗粒可以形成图案（例如六边形），并且具有足够小的粒度以在调理期间穿透CMP垫的孔，导致用经调节的CMP垫抛光的晶片上的缺陷较少。 可以使用钎焊膜来实现晶粒结合，尽管也可以使用其它金属键。 此外，平衡粘合材料（例如，两侧上钎焊）允许低的平坦度值。
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3.发明申请公开(公告)号：US20090053980A1
公开(公告)日：2009-02-26
申请号：US12195600
申请日：2008-08-21
IPC分类号： B24B33/00
CPC分类号： B24B53/017 , B24B53/12 , B24D3/06
摘要： A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.
摘要翻译： 已经对几个关键的调节器设计参数进行了研究。 其目的是通过考虑诸如晶片缺陷，垫寿命和调理剂寿命等因素来改善调节剂性能。 对于这项研究，选择了几种关键的调节器设计参数，如钻石类型，金刚石尺寸，菱形，金刚石浓度和分布，以确定其对CMP性能和工艺稳定性的影响。 进行实验验证。 调节器规格与每个特定CMP环境（预期应用）匹配，以提高工艺稳定性和CMP性能，特别是对于新兴技术节点。 在现场开发并运行了几种护发素设计。 根据一个实施例，实现300mm CMP工艺的显着的平面度改进，并且另一实施例同时实现焊盘寿命和晶片抛光速率的增加。
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4.发明授权公开(公告)号：US08657652B2
公开(公告)日：2014-02-25
申请号：US12195600
申请日：2008-08-21
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B53/12 , B24D3/06
摘要： A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.
摘要翻译： 已经对几个关键的调节器设计参数进行了研究。 其目的是通过考虑诸如晶片缺陷，垫寿命和调理剂寿命等因素来改善调节剂性能。 对于这项研究，选择了几种关键的调节器设计参数，如钻石类型，金刚石尺寸，菱形，金刚石浓度和分布，以确定其对CMP性能和工艺稳定性的影响。 进行实验验证。 调节器规格与每个特定CMP环境（预期应用）匹配，以提高工艺稳定性和CMP性能，特别是对于新兴技术节点。 在现场开发并运行了几种护发素设计。 根据一个实施例，实现300mm CMP工艺的显着的平面度改进，并且另一实施例同时实现焊盘寿命和晶片抛光速率的增加。
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公开(公告)号：US4696352A
公开(公告)日：1987-09-29
申请号：US840309
申请日：1986-03-17
CPC分类号： E21B44/00 , C23C30/005 , E21B10/58 , E21B3/00 , Y10T428/12056
摘要： A coated insert for such drilling tool bits as mine tool roof bits or masonry drill bits. A hard, fracture resistant substrate is coated with one or more thin adherent layers of refractory coating material. The material of each layer is a carbide, nitride, or carbonitride of titanium, hafnium, vanadium, tantalum, or niobium, or an oxide of aluminum or zirconium or a mixture or solid solution of these compounds. Methods for drilling holes in a mine roof or other hard materials are also disclosed.
摘要翻译： 用于钻井工具钻头的涂层刀片，如矿山工具屋顶钻头或砖石钻头。 硬的，耐断裂的基底涂覆有一层或多层耐火涂层材料的粘附层。 每层的材料是钛，铪，钒，钽或铌，或铝或锆的氧化物或这些化合物的混合物或固溶体的碳化物，氮化物或碳氮化物。 还公开了在矿山屋顶或其他硬质材料中钻孔的方法。
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公开(公告)号：US07195549B2
公开(公告)日：2007-03-27
申请号：US10924027
申请日：2004-08-23
IPC分类号： B34D5/06
CPC分类号： B24D5/06
摘要： A drum grinding wheel includes an elongated drum configured for coaxial engagement with a spindle of a grinding machine. An exterior surface of the drum extends parallel to a central axis, and a plurality of removable cutters are removably fastened to the exterior surface. Each of the cutters has a plurality of ribs disposed in spaced relation thereon, and abrasive grain is disposed on a grinding face of each of the ribs, such as by use of a metallic braze.
摘要翻译： 滚筒砂轮包括配置成与研磨机的主轴同轴接合的细长滚筒。 鼓的外表面平行于中心轴线延伸，并且多个可移除的切割器可拆卸地紧固到外表面。 每个切割器具有以间隔关系设置的多个肋，并且磨料颗粒例如通过使用金属钎焊设置在每个肋的研磨面上。
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公开(公告)号：US4698266A
公开(公告)日：1987-10-06
申请号：US799088
申请日：1985-11-18
CPC分类号： C22C29/08 , B23B27/148 , C23C28/04 , C23C30/005 , B22F2998/00 , Y10T428/31678
摘要： A steel roughing grade coated cemented carbide cutting tool comprises WC grains equal to or less than 70 w/o of the tool substrate, from about 5 to about 10 w/o of a cobalt bonding phase and the remainder being metal carbide grains selected from the group TiC, TaC, NbC, HfC and combinations thereof. The average WC grain size is from about 0.9 to about 1.3 microns and less than 10% of the WC grains have a size less than 0.5 microns. The coated cemented carbide tool is coated with an adherent refractory coating layer. The coated cemented carbide cutting tool can be used to machine steel at rough and heavy rough cutting conditions.
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公开(公告)号：US06663682B2
公开(公告)日：2003-12-16
申请号：US10328253
申请日：2002-12-23
IPC分类号： C09K314
CPC分类号： C23C10/34 , C09K3/1445 , C23C18/08 , C23C30/005 , Y10T428/24355 , Y10T428/2438 , Y10T428/24413 , Y10T428/2991 , Y10T428/2993
摘要： A process for metal coating diamond superabrasive particles involves heating the superabrasive particles in the presence of coat-forming powder of a metal compound under a common inert atmosphere. The metal compound contains a metal which can be thermochemically reduced by the superabrasive substance serving as the reducing agent. The process forms a chemical bond at the interface between the outer metal layer and the superabrasive particle substrate. The metal coated superabrasive particles can be hydrogen treated in situ and separated from excess coat-forming powder easily by filtration. The product particles are ideal for use in a wide variety of metal bonded cutting, machining, dressing and other abrasive tools, especially diamond film insert and single layer diamond tools.
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公开(公告)号：US06524357B2
公开(公告)日：2003-02-25
申请号：US09873172
申请日：2001-06-01
IPC分类号： B24D304
CPC分类号： C09K3/1445 , C23C10/34 , C23C18/08 , C23C30/005
摘要： A process for metal coating diamond superabrasive particles involves heating the superabrasive particles in the presence of coat-forming powder of a metal compound under a common inert atmosphere. The metal compound contains a metal which can be thermochemically reduced by the superabrasive substance serving as the reducing agent. The process forms a chemical bond at the interface between the outer metal layer and the superabrasive particle substrate. The metal coated superabrasive particles can be hydrogen treated in situ and separated from excess coat-forming powder easily by filtration. The product particles are ideal for use in a wide variety of metal bonded cutting, machining, dressing and other abrasive tools, especially diamond film insert and single layer diamond tools.
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