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    CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION
    1.
    发明申请
    CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION 审中-公开
    化学机械平面化的工具和技术

    公开(公告)号：US20080271384A1

    公开(公告)日：2008-11-06

    申请号：US11857499

    申请日：2007-09-19

    申请人： Thomas Puthanangady ,  Taewook Hwang ,  Srinivasan Ramanath ,  Eric M. Schultz ,  J. Gary Baldoni ,  Sergej-Tomislav Buljan ,  Charles Dinh-Ngoc

    发明人： Thomas Puthanangady ,  Taewook Hwang ,  Srinivasan Ramanath ,  Eric M. Schultz ,  J. Gary Baldoni ,  Sergej-Tomislav Buljan ,  Charles Dinh-Ngoc

    IPC分类号： C09K3/14 ,  B24D3/06

    CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/06 ,  B24D18/00

    摘要： Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.

    摘要翻译： 用于调理化学机械平面化（CMP）衬垫的工具包括具有与至少一个表面耦合的磨料颗粒的衬底。 这些工具可以具有各种粒子和键结构。 例如，磨料颗粒可以结合（例如钎焊或其他金属粘合技术）到一侧或前后两侧。 或者，磨料颗粒结合到前侧，并且填料颗粒连接到背面。 研磨颗粒可以形成图案（例如六边形），并且具有足够小的粒度以在调理期间穿透CMP垫的孔，导致用经调节的CMP垫抛光的晶片上的缺陷较少。 可以使用钎焊膜来实现晶粒结合，尽管也可以使用其它金属键。 此外，平衡粘合材料（例如，两侧上钎焊）允许低的平坦度值。

    Conditioning Tools and Techniques for Chemical Mechanical Planarization
    2.
    发明申请
    Conditioning Tools and Techniques for Chemical Mechanical Planarization 审中-公开
    化学机械平面化的调节工具和技术

    公开(公告)号：US20120060426A1

    公开(公告)日：2012-03-15

    申请号：US13301276

    申请日：2011-11-21

    申请人： Thomas PUTHANANGADY ,  Taewook Hwang ,  Srinivasan Ramanath ,  Eric M. Schultz ,  J. Gary Baldoni ,  Biljana Buljan ,  Charles Dinh-Ngoc

    发明人： Thomas PUTHANANGADY ,  Taewook Hwang ,  Srinivasan Ramanath ,  Eric M. Schultz ,  J. Gary Baldoni ,  Biljana Buljan ,  Charles Dinh-Ngoc

    IPC分类号： B24D3/06

    CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/06 ,  B24D18/00

    摘要： Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.

    摘要翻译： 用于调理化学机械平面化（CMP）衬垫的工具包括具有与至少一个表面耦合的磨料颗粒的衬底。 这些工具可以具有各种粒子和键结构。 例如，磨料颗粒可以结合（例如钎焊或其他金属粘合技术）到一侧或前后两侧。 或者，磨料颗粒结合到前侧，并且填料颗粒连接到背面。 研磨颗粒可以形成图案（例如六边形），并且具有足够小的粒度以在调理期间穿透CMP垫的孔，导致用经调节的CMP垫抛光的晶片上的缺陷较少。 可以使用钎焊膜来实现晶粒结合，尽管也可以使用其它金属键。 此外，平衡粘合材料（例如，两侧上钎焊）允许低的平坦度值。

    Abrasive tool
    9.
    发明申请
    Abrasive tool 有权
    研磨工具

    公开(公告)号：US20070037501A1

    公开(公告)日：2007-02-15

    申请号：US11203456

    申请日：2005-08-11

    申请人： Sergej-Tomislav Buljan ,  Srinivasan Ramanath ,  Donald Brodeur ,  Robert Corcoran

    发明人： Sergej-Tomislav Buljan ,  Srinivasan Ramanath ,  Donald Brodeur ,  Robert Corcoran

    IPC分类号： B23F21/03

    CPC分类号： B24D3/06 ,  B24D3/32 ,  B24D5/10

    摘要： An abrasive tool, suitable for cutting, slotting, grinding and polishing hard materials, such as ceramics, metals, and composites thereof, and methods for making same. The tool includes a plurality of pores positioned in an abrasive region adjacent an outer circumference of the disk. The pores have any predetermined shape, size and position relative to one another.

    摘要翻译： 一种适用于切割，开槽，研磨和抛光硬质材料如陶瓷，金属及其复合材料的研磨工具及其制造方法。 该工具包括位于与盘的外圆周相邻的研磨区域中的多个孔。 孔隙相对于彼此具有任何预定的形状，尺寸和位置。

    Porous abrasive tool and method for making the same
    10.
    发明授权
    Porous abrasive tool and method for making the same 有权
    多孔研磨工具及其制造方法

    公开(公告)号：US06685755B2

    公开(公告)日：2004-02-03

    申请号：US09990647

    申请日：2001-11-21

    申请人： Srinivasan Ramanath ,  Sergej-Tomislav Buljan ,  Jason R. Wilson ,  Jeri Ann S. Ikeda

    发明人： Srinivasan Ramanath ,  Sergej-Tomislav Buljan ,  Jason R. Wilson ,  Jeri Ann S. Ikeda

    IPC分类号： B24D1800

    CPC分类号： B24D99/005 ,  B24D3/10 ,  C09K3/1409

    摘要： An abrasive article including from about 40 to about 80 volume percent interconnected porosity, the article being useful as a segment for a segmented grinding wheel, and a method for fabricating the same. The method includes blending a mixture of abrasive grain, bond material and dispersoid particles, the mixture including from about 40 to about 80 volume percent dispersoid particles. In one embodiment the mixture includes from about 50 to about 80 volume percent dispersoid particles. In another embodiment the mixture includes an organic bond material and from about 40 to about 80 volume percent dispersoid particles. The powder mixture is then pressed into an abrasive laden composite and thermally processed. After cooling the composite is immersed into a solvent, which dissolves substantially all of the dispersoid particles, leaving a highly porous, bonded abrasive article.

    摘要翻译： 一种磨料制品，包括约40至约80体积％的相互连接的孔隙率，该制品可用作分段磨轮的段，及其制造方法。 该方法包括混合研磨颗粒，粘合材料和分散质颗粒的混合物，该混合物包括约40至约80体积％的分散质颗粒。 在一个实施方案中，该混合物包括约50至约80体积％的分散质颗粒。 在另一个实施方案中，混合物包括有机粘合材料和约40至约80体积％的分散质颗粒。 然后将粉末混合物压制成含磨料的复合材料并进行热处理。 冷却后，将复合材料浸入溶剂中，其溶解基本上所有的分散质颗粒，留下高度多孔的粘结的磨料制品。