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25 条记录 (耗时 0.024 秒)

    Cover for an electronic cartridge
    1.
    发明授权
    Cover for an electronic cartridge 有权
    电子墨盒盖

    公开(公告)号：US6028771A

    公开(公告)日：2000-02-22

    申请号：US189905

    申请日：1998-11-11

    申请人： Thomas Wong ,  Michael Crocker ,  Peter Davison ,  Mike MacGregor ,  Joe Benefield

    发明人： Thomas Wong ,  Michael Crocker ,  Peter Davison ,  Mike MacGregor ,  Joe Benefield

    IPC分类号： H05K7/20 ,  H05K5/00 ,  H05K7/14

    CPC分类号： H05K5/0013 ,  H05K7/142 ,  H05K7/1431

    摘要： A cover for a substrate of an electronic assembly. The cover may include a snap-in pin that can be inserted through an opening of the substrate. The cover may also have a barbed pin that exerts a force onto the substrate. The force secures the pin to the substrate. The snap-in pin and barbed pin may extend from a panel portion of the cover which covers one side of the substrate. The entire cover may be constructed as a relatively inexpensive plastic injection molded part.

    摘要翻译： 一种用于电子组件的基板的盖。 盖可以包括可插入通过基板的开口的卡扣销。 盖子还可以具有向基板施加力的倒钩销。 力将销固定到基板上。 卡扣销和倒钩销可以从覆盖基板的一侧的盖的面板部分延伸。 整个盖可以被构造为相对便宜的塑料注塑部件。

    Retention mechanism for an electrical assembly
    3.
    发明授权
    Retention mechanism for an electrical assembly 失效
    电气组件的保持机构

    公开(公告)号：US06585534B2

    公开(公告)日：2003-07-01

    申请号：US09137520

    申请日：1998-08-20

    申请人： David J. Llapitan ,  Michael Crocker ,  Peter Davison

    发明人： David J. Llapitan ,  Michael Crocker ,  Peter Davison

    IPC分类号： H01R1362

    CPC分类号： H05K7/1405 ,  H01L23/4093 ,  H01L2924/0002 ,  H01R12/7047 ,  H01L2924/00

    摘要： A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.

    摘要翻译： 一种用于具有基板和散热器的电子组件的保持机构。 保持机构包括接收基板的基板槽和接收散热器的散热槽。 可能有两个固定机构连接到与电连接器相邻的印刷电路板。 可能有两个对准地位于基板槽周围的散热槽，使得该机构可以安装在连接器的左侧或右侧。 对称槽消除了对左侧机构和右侧机构的需要。 保持器机构还可以具有螺母保持器，其捕获用于将机构附接到印刷电路板的螺母。 螺母固定器允许螺母在组装过程中与保持器机构一起运输。

    Retention mechanism for an electrical assembly
    4.
    发明授权
    Retention mechanism for an electrical assembly 有权
    电气组件的保持机构

    公开(公告)号：US06722908B2

    公开(公告)日：2004-04-20

    申请号：US10335679

    申请日：2003-01-02

    申请人： David J. Llapitan ,  Michael Crocker ,  Peter Davison

    发明人： David J. Llapitan ,  Michael Crocker ,  Peter Davison

    IPC分类号： H01R1362

    CPC分类号： H05K7/1405 ,  H01L23/4093 ,  H01L2924/0002 ,  H01R12/7047 ,  H01L2924/00

    摘要： A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.

    摘要翻译： 一种用于具有基板和散热器的电子组件的保持机构。 保持机构包括接收基板的基板槽和接收散热器的散热槽。 可能有两个固定机构连接到与电连接器相邻的印刷电路板。 可能有两个对准地位于基板槽周围的散热槽，使得该机构可以安装在连接器的左侧或右侧。 对称槽消除了对左侧机构和右侧机构的需要。 保持器机构还可以具有螺母保持器，其捕获用于将机构附接到印刷电路板的螺母。 螺母固定器允许螺母在组装过程中与保持器机构一起运输。

    Integrated circuit heat sink support and retention mechanism
    6.
    发明授权
    Integrated circuit heat sink support and retention mechanism 有权
    集成电路散热器支撑和保持机构

    公开(公告)号：US06563213B1

    公开(公告)日：2003-05-13

    申请号：US09419964

    申请日：1999-10-18

    申请人： Thomas Wong ,  Neal Ulen ,  Peter Davison ,  Ketan Shah

    发明人： Thomas Wong ,  Neal Ulen ,  Peter Davison ,  Ketan Shah

    IPC分类号： H05K720

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

    摘要： The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

    摘要翻译： 本发明提供一种改进的散热器保持组件，使得散热器由基座而不是由集成电路物理支撑。 传统的散热器具有对准特征，其通过特征与集成电路的接触来物理对准和支撑散热器，并且将施加到散热器的力传递到集成电路。 这种转移的力可以被看作是诸如针阵列的集成电路的引脚处的剪切应力，并且可能损坏集成电路的完整性或其与外部电路的连接。 本发明提供了远离与集成电路接触的对准和支撑特征，并因此以不会对集成电路施加相当大的应力的方式为散热器提供支撑。

    Integrated circuit heat sink support and retention mechanism
    7.
    发明授权
    Integrated circuit heat sink support and retention mechanism 有权

    公开(公告)号：US06529378B2

    公开(公告)日：2003-03-04

    申请号：US09754973

    申请日：2001-01-05

    申请人： Thomas Wong ,  Neal Ulen ,  Peter Davison ,  Ketan Shah

    发明人： Thomas Wong ,  Neal Ulen ,  Peter Davison ,  Ketan Shah

    IPC分类号： H05K720

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

    摘要： The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

    Locking device for turbine blades
    8.
    发明申请
    Locking device for turbine blades 有权
    涡轮叶片锁紧装置

    公开(公告)号：US20050226729A1

    公开(公告)日：2005-10-13

    申请号：US11100404

    申请日：2005-04-07

    申请人： Joana Negulescu ,  Peter Davison

    发明人： Joana Negulescu ,  Peter Davison

    IPC分类号： B64C27/48 ,  F01D5/30 ,  F01D5/32

    CPC分类号： F01D5/326 ,  Y10T29/49321

    摘要： A turbine blade locking device axially retains a turbine blade (1) inserted in an axial, profiled slot (10) of a turbine disk (6). The turbine disk (6) is provided with a locking groove (8) passing through the slot (10) and extending radially in the plane of the turbine disk (6). A locking pin (4) is inserted in the locking groove (8) and the blade root (3) is provided at its bottom side with a notch (9) aligning with the locking groove (8). A portion of an elastic element (5) is arranged radially below the locking pin (4) to pre-load the locking pin (4) in a radially outward direction and into the notch (9).

    摘要翻译： 涡轮机叶片锁定装置轴向地保持插入在涡轮盘（6）的轴向型轮廓槽（10）中的涡轮叶片（1）。 涡轮盘（6）设置有穿过狭槽（10）并在涡轮盘（6）的平面内径向延伸的锁定槽（8）。 锁定销（4）插入到锁定槽（8）中，并且叶片根部（3）在其底侧设置有与锁定槽（8）对准的凹口（9）。 弹性元件（5）的一部分径向地设置在锁定销（4）的下方，以将锁定销（4）沿径向向外的方向预加载到凹口（9）中。

    FILM INSERT MOLDING FOR DEVICE MANUFACTURE
    10.
    发明申请
    FILM INSERT MOLDING FOR DEVICE MANUFACTURE 有权
    用于器件制造的电影插件模制

    公开(公告)号：US20140022720A1

    公开(公告)日：2014-01-23

    申请号：US13997871

    申请日：2012-05-17

    申请人： Peter Davison ,  David Pidwerbecki

    发明人： Peter Davison ,  David Pidwerbecki

    IPC分类号： H05K7/02 ,  B29C39/10

    CPC分类号： H05K7/02 ,  B29C39/10 ,  G06F1/1626 ,  G06F1/203 ,  G06F1/32

    摘要： Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

    摘要翻译： 系统和方法提供了包括具有限定内部区域的形状的膜的装置。 该装置还可以包括设置在膜的内部区域内的一个或多个电子部件和内部区域内的硬化的热固树脂，其中热固性树脂包围电子部件并基本上填充膜的内部区域 。 在一个示例中，印刷内容耦合到胶片的表面。 此外，热固树脂可以包括被配置为吸收和分配由电子部件产生的热量的添加剂。