摘要:
A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.
摘要:
An electronic device may be provided that includes a base portion having an input device, a tablet having a display and a docking connector with a plurality of second electrical connectors, and a docking connector to move relative to the base portion. The docking connector may include a first docking pole to extend from the docking connector and to engage with the docking receptacle, and a plurality of first electrical connectors.
摘要:
An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
摘要:
According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.
摘要:
According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.
摘要:
A fan impeller is part of a fan assembly designed to maximize both intake and expelled air during use. The fan impeller employs a distinct airfoil shape for the fan blades to substantially move the ambient air. A low constant blade angle and overlapping blades are employed to improve the blade lift and consequent mass flow and exit pressure. The blade stall is eliminated, as evidenced by a smoothened fan curve, for more efficient operation. The blade sweep angle is optimally arranged to control radial flow characteristics of the ambient air. Housing sidewalls are removed from the fan assembly to remove parasitic drag and improve the motion of air passing through the fan.
摘要:
According to some embodiments, a method and system are provided to receive an airflow at a blower fan via an axial fan, and expel the airflow via a blower fan. The blower fan comprises a hub associated with an axis of rotation, and the axial fan comprises the hub.
摘要:
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein tile base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.
摘要:
According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.
摘要:
According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.