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公开(公告)号：US06935023B2
公开(公告)日：2005-08-30
申请号：US10318430
申请日：2002-12-12
CPC分类号： B41J2/1643 , B41J2/155 , B41J2/1601 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2202/18 , B41J2202/19 , B41J2202/20 , Y10T29/49083 , Y10T29/49155 , Y10T29/49165 , Y10T29/49401
摘要： A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection device includes forming a trench in the second side of the fluid ejection device, depositing a conductive material in the trench, forming a first opening in the fluid ejection device between the first side of the fluid ejection device and the conductive material in the trench, depositing a conductive material in the first opening, and forming a conductive path between the conductive material in the first opening and a wiring line of one of the drop ejecting elements.
摘要翻译： 形成用于流体喷射装置的电连接的方法包括与流体喷射装置的第一侧和第二侧连通的流体通道和形成在流体喷射装置的第一侧上的液滴喷射元件阵列包括形成 在流体喷射装置的第二侧中的沟槽，在沟槽中沉积导电材料，在流体喷射装置的第一侧和沟槽中的导电材料之间的流体喷射装置中形成第一开口，将导电材料沉积在 第一开口，并且在第一开口中的导电材料和一个液滴喷射元件的布线之间形成导电路径。
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公开(公告)号：US06508536B1
公开(公告)日：2003-01-21
申请号：US09521872
申请日：2000-03-08
IPC分类号： B41J2155
CPC分类号： B41J2/14129 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1637 , B41J2/1643 , B41J2002/14387 , B41J2202/18 , B41J2202/19 , B41J2202/20 , B41J2202/21 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , Y10T29/49401 , H01L2924/00014 , H01L2924/00
摘要： A method of mounting a fluid ejection device having a first plurality of pads on a carrier substrate having a corresponding second plurality of pads includes positioning the first plurality of pads with respect to the second plurality of pads, and melting solder between the first plurality of pads and the second plurality of pads. Melting the solder includes aligning the first plurality of pads with respect to the second plurality of pads with a solder reflow force and forming a fluidic boundary between the fluid ejection device and the carrier substrate with the solder.
摘要翻译： 将具有第一多个焊盘的流体喷射装置安装在具有对应的第二多个焊盘的载体基板上的方法包括相对于第二多个焊盘定位第一多个焊盘，并且在第一多个焊盘之间熔化焊料 和第二多个垫。 熔化焊料包括用焊料回流力使第一多个焊盘相对于第二多个焊盘对准，并在焊料之间在流体喷射装置和载体衬底之间形成流体边界。
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公开(公告)号：US6123410A
公开(公告)日：2000-09-26
申请号：US959376
申请日：1997-10-28
CPC分类号： B41J2/14129 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1637 , B41J2/1643 , B41J2002/14387 , B41J2202/18 , B41J2202/19 , B41J2202/20 , B41J2202/21 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , Y10T29/49401
摘要： A scalable wide-array printhead is formed by mounting multiple thermal inkjet printheads to a carrier substrate. The printheads are mounted to one face and logic ICs and drive ICs are mounted to an opposite face. Interconnects are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots. A solder bump mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot.
摘要翻译： 通过将多个热喷墨打印头安装到载体基底上形成可扩展的宽阵列打印头。 打印头安装在一个面上，逻辑IC和驱动IC安装在相对的面上。 通过载体衬底形成互连件，以将打印头电耦合到逻辑IC和驱动IC。 载体衬底由硅形成并被蚀刻以限定油墨补充槽。 使用焊料凸块安装工艺将打印头安装到载体基板上。 这种过程用于对准每个打印头。 焊料在打印头墨槽周围形成流体边界。
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公开(公告)号：US06188414B1
公开(公告)日：2001-02-13
申请号：US09430534
申请日：1999-10-29
IPC分类号： B41J2155
CPC分类号： B41J2/14072 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2202/20 , B41J2202/21
摘要： A robust printhead is disclosed comprising a substrate, an ink flow channel formed in the substrate, a beveled die having disposed heater resistors and which is inserted into the substrate, a TAB circuit used to electrically couple the beveled die to the substrate, and an encapsulated upper surface. The encapsulant is disposed at least over the electrical coupling between the beveled die and the interconnect.
摘要翻译： 公开了一种坚固的打印头，其包括基板，形成在基板中的油墨流动通道，具有设置的加热电阻器并且插入到基板中的倾斜模具，用于将斜切模具电耦合到基板的TAB电路，以及封装 上表面。 密封剂至少设置在斜切模和互连之间的电耦合之上。
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公开(公告)号：US06325488B1
公开(公告)日：2001-12-04
申请号：US09070864
申请日：1998-04-30
IPC分类号： B41J2155
CPC分类号： B41J2/14129 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1637 , B41J2/1643 , B41J2002/14387 , B41J2202/18 , B41J2202/19 , B41J2202/20 , B41J2202/21 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , Y10T29/49401 , H01L2924/00014 , H01L2924/00
摘要： A printhead is formed from a plurality of ink ejectors mounted on an inner surface of a rigid substrate while protruding through holes provided in the substrate. Electrical contact is provided on a surface of the ink ejectors common with the ink ejecting nozzles thereby avoiding vias to another surface. The rigid substrate provides a conducting layer on its inner surface such that the ink ejectors may be connected thereto with solder reflow techniques.
摘要翻译： 打印头由安装在刚性基板的内表面上的多个喷墨头形成，同时突出设置在基板中的孔。 在与喷墨嘴共同的喷墨头的表面上提供电接触，从而避免通向另一表面。 刚性衬底在其内表面上提供导电层，使得喷墨器可以通过焊料回流技术连接到其上。
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公开(公告)号：US06394579B1
公开(公告)日：2002-05-28
申请号：US09379946
申请日：1999-08-24
申请人： Melissa D. Boyd , Mark E. Gorzynski , Timothy E. Beerling , Evan P. Smouse , Kenneth R Williams
发明人： Melissa D. Boyd , Mark E. Gorzynski , Timothy E. Beerling , Evan P. Smouse , Kenneth R Williams
IPC分类号： B41J214
CPC分类号： B41J2/2103 , B41J2/15
摘要： A fluid ejecting device with a body defining an array of nozzles. The nozzles are arranged in an array along an array axis. The array has a first portion in which the nozzles are spaced apart along the array axis by a first pitch, and a second portion in which the nozzles are spaced apart by a different second pitch. The array may have a third portion between the first and second portions with a third pitch different from the first and second pitch. An assembly may include two or more of such fluid ejection devices, and the second portion of one print head may be aligned with the first portion of the other print head. Printers incorporating the fluid ejection devices and printing methods are also disclosed.
摘要翻译： 具有限定喷嘴阵列的主体的流体喷射装置。 喷嘴沿着阵列轴排列成阵列。 阵列具有第一部分，其中喷嘴沿着阵列轴线间隔开第一节距，以及第二部分，其中喷嘴以不同的第二节距隔开。 阵列可以具有在第一和第二部分之间的第三部分，具有不同于第一和第二间距的第三间距。 组件可以包括这种流体喷射装置中的两个或更多个，并且一个打印头的第二部分可以与另一打印头的第一部分对准。 还公开了结合流体喷射装置和打印方法的打印机。
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公开(公告)号：US06460992B1
公开(公告)日：2002-10-08
申请号：US08637569
申请日：1996-04-25
IPC分类号： B41J201
CPC分类号： D06P5/003 , B32B27/10 , B41J2/01 , B41J3/4078 , B41M5/0256 , D06P5/30
摘要： A method of printing includes coating a transfer sheet with a first ink component that has an ink thickener; and operating an ink jet printing apparatus to emit a second ink component onto the transfer sheet to form a thickened resulting ink in a selected pattern. The second ink component has a selected dye and a selected solvent in which the thickener is soluble.
摘要翻译： 印刷方法包括用具有油墨增稠剂的第一油墨组分涂覆转印纸; 以及操作喷墨打印设备以将第二墨水组分发射到转印纸上以形成选定图案中的增稠的所得墨。 第二油墨组分具有选择的染料和选择的溶剂，其中增稠剂是可溶的。
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公开(公告)号：US5508724A
公开(公告)日：1996-04-16
申请号：US118371
申请日：1993-09-07
申请人： Melissa D. Boyd , Daniel A. Kearl
发明人： Melissa D. Boyd , Daniel A. Kearl
CPC分类号： B41J2/355
摘要： A multiplexed array of resistors including a plurality of address leads and a plurality of ground leads which cooperatively define a matrix of nodes, each node defining a possible location in the matrix for a resistor heater interconnecting one address lead and one ground lead. Resistor heaters are located in the array at only a portion of the nodes. The locations of the resistor heaters are selected to limit the conductance of alternate current paths around the resistor heater when addressed. The resistor heaters are preferably formed at nodes selected so that no two address leads are interconnected through resistor heaters to more than one common ground lead. Preferably, each alternate current path includes at least four non-addressed resistors in series.
摘要翻译： 多个电阻器阵列包括多个地址引线和多个接地引线，其协作地限定了一个节点矩阵，每个节点在矩阵中定义了一个连接一个地址引线和一个地线的电阻加热器的可能位置。 电阻加热器仅在节点的一部分位于阵列中。 选择电阻加热器的位置以限制在寻址时电阻加热器周围的交流电路的电导。 电阻加热器优选地形成在所选择的节点处，使得没有两个地址引线通过电阻加热器互连到多于一个公共接地引线。 优选地，每个交流电流路径包括串联的至少四个非寻址电阻器。
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公开(公告)号：US4471697A
公开(公告)日：1984-09-18
申请号：US343613
申请日：1982-01-28
CPC分类号： F42B3/124
摘要： The disclosure is directed to a bidirectional slapper detonator. One embodiment utilizes a single bridge circuit to detonate a pair of opposing initiating pellets. A line generator embodiment uses a plurality of bridges in electrical series to generate opposing cylindrical wavefronts.
摘要翻译： 本公开涉及一种双向打击式雷管。 一个实施例使用单桥电路来引爆一对相对的起始粒子。 线发生器实施例使用电串联的多个桥来产生相对的圆柱形波前。
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10.发明授权Polymer systems with reactive and fusible properties for solid freeform fabrication 有权具有反应性和易熔性的聚合体系，用于固体自由形成公开(公告)号：US07365129B2
公开(公告)日：2008-04-29
申请号：US10686137
申请日：2003-10-14
申请人： Laura Kramer , Vladek Kasperchik , Melissa D. Boyd
发明人： Laura Kramer , Vladek Kasperchik , Melissa D. Boyd
CPC分类号： C08F8/00 , B29C64/165 , B33Y70/00 , C08F210/02
摘要： A powder system for use in solid freeform fabrication. The powder system includes at least one polymer having reactive properties and fusible properties. The at least one polymer is reactive with a liquid binder and is fusible at a temperature above the melting point or glass transition temperature of the at least one polymer. The at least one polymer may be a single co-polymer having at least one reactive portion and at least one fusible portion or may be a mixture of polymers including at least one reactive polymer and at least one fusible polymer. A method of forming an object by solid freeform fabrication is also disclosed.
摘要翻译： 用于固体自由形成制造的粉末系统。 粉末体系包括至少一种具有反应性和易熔性的聚合物。 至少一种聚合物与液体粘合剂反应，并且在高于至少一种聚合物的熔点或玻璃化转变温度的温度下是可熔的。 至少一种聚合物可以是具有至少一个反应性部分和至少一个可熔部分的单一共聚物，或者可以是包含至少一种反应性聚合物和至少一种可熔聚合物的聚合物的混合物。 还公开了通过固体自由形成制造形成物体的方法。
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