Method for fabricating a shallow ion implanted microelectronic structure
    1.
    发明授权
    Method for fabricating a shallow ion implanted microelectronic structure 有权
    制造浅离子注入微电子结构的方法

    公开(公告)号:US06582995B2

    公开(公告)日:2003-06-24

    申请号:US09903125

    申请日:2001-07-11

    IPC分类号: H01L21335

    摘要: Within a method for fabricating a microelectronic fabrication comprising a topographic microelectronic structure formed over a substrate, there is implanted, while employing a first ion implant method and while masking a portion of the substrate adjacent the topographic microelectronic structure but not masking the topographic microelectronic structure, the topographic microelectronic structure to form an ion implanted topographic microelectronic structure without implanting the substrate. There is also implanted, while employing a second ion implant method, the portion of the substrate adjacent the topographic microelectronic substrate to form therein an ion implant structure. The method is particularly useful for fabricating source/drain regions with shallow junctions within field effect transistor (FET) devices.

    摘要翻译: 在制造包括形成在衬底上的形貌微电子结构的微电子制造的方法中,注入植入,同时采用第一离子注入方法,同时掩盖与形貌微电子结构相邻但不掩盖地形微电子结构的衬底的一部分, 地形微电子结构,以形成离子注入的地形微电子结构,而不会植入衬底。 在采用第二离子注入方法的同时,植入衬底的部分与形貌微电子衬底相邻以在其中形成离子注入结构。 该方法对于在场效应晶体管(FET)器件中制造具有浅结的源极/漏极区域特别有用。

    Bipolar junction transistor with surface protection and manufacturing method thereof
    3.
    发明申请
    Bipolar junction transistor with surface protection and manufacturing method thereof 审中-公开
    具有表面保护的双极结晶体管及其制造方法

    公开(公告)号:US20120241870A1

    公开(公告)日:2012-09-27

    申请号:US13373225

    申请日:2011-11-08

    IPC分类号: H01L27/06 H01L21/8249

    摘要: The present invention discloses a bipolar junction transistor (BJT) with surface protection and a manufacturing method thereof. The BJT includes: a first conductive type base, a second conductive type emitter, and a second conductive type collector, which are formed in a substrate, wherein the base is formed between and separates the emitter and the collector, and the base includes a base contact region functioning as an electrical contact node of the base; and a gate structure which is formed on the substrate between the base contact region and the second conductive type emitter.

    摘要翻译: 本发明公开了一种具有表面保护的双极结型晶体管(BJT)及其制造方法。 BJT包括:形成在基板中的第一导电型基极,第二导电型发射极和第二导电型集电极,其中基极形成在发射极和集电极之间并分离,并且基极包括基极 接触区域用作基座的电接触节点; 以及栅极结构,其形成在所述基极接触区域和所述第二导电型发射极之间。

    LDMOS Device Having Increased Punch-Through Voltage and Method For Making Same
    4.
    发明申请
    LDMOS Device Having Increased Punch-Through Voltage and Method For Making Same 有权
    具有增加穿通电压的LDMOS器件和制造相同的方法

    公开(公告)号:US20110220997A1

    公开(公告)日:2011-09-15

    申请号:US12720834

    申请日:2010-03-10

    IPC分类号: H01L29/78 H01L21/8249

    摘要: The present invention discloses an LDMOS device having an increased punch-through voltage and a method for making same. The LDMOS device includes: a substrate; a well of a first conductive type formed in the substrate; an isolation region formed in the substrate; a body region of a second conductive type in the well; a source in the body region; a drain in the well; a gate structure on the substrate; and a first conductive type dopant region beneath the body region, for increasing a punch-through voltage.

    摘要翻译: 本发明公开了一种具有增加的穿通电压的LDMOS器件及其制造方法。 LDMOS器件包括:衬底; 在基板中形成的第一导电类型的阱; 形成在衬底中的隔离区; 井中的第二导电类型的体区; 身体的一个来源; 井中排水 基板上的栅极结构; 以及在身体区域下面的第一导电型掺杂区域,用于增加穿通电压。

    Single-chip common-drain JFET device and its applications

    公开(公告)号:US07768033B2

    公开(公告)日:2010-08-03

    申请号:US12385720

    申请日:2009-04-17

    IPC分类号: H01L29/74 H01L31/111

    摘要: A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.

    Single-chip common-drain JFET device and its applications
    6.
    发明授权
    Single-chip common-drain JFET device and its applications 失效
    单片共漏极JFET器件及其应用

    公开(公告)号:US07759695B2

    公开(公告)日:2010-07-20

    申请号:US12385717

    申请日:2009-04-17

    IPC分类号: H01L29/74 H01L31/111

    摘要: A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.

    摘要翻译: 单芯片公共漏极JFET器件包括漏极,两个栅极和两个源极,使得与其形成两个公共漏极JFET。 由于在单个芯片内合并的两个JFET,其间不需要引线接合连接,因此没有由接合线引起的寄生电感和电阻,因此提高性能并降低封装成本。 单片式公共漏极JFET器件可以应用于降压转换器,升压转换器,反相转换器,开关和两级DC-DC转换器,以提高其性能和效率。 还提供了用于电流感测或比例电流产生的替代单芯片公共漏极JFET器件。

    Single-chip common-drain JFET device and its applications
    7.
    发明授权
    Single-chip common-drain JFET device and its applications 失效
    单片共漏极JFET器件及其应用

    公开(公告)号:US07535032B2

    公开(公告)日:2009-05-19

    申请号:US11165028

    申请日:2005-06-24

    IPC分类号: H01L29/74 H01L31/111

    摘要: A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.

    摘要翻译: 单芯片公共漏极JFET器件包括漏极,两个栅极和两个源极,使得与其形成两个公共漏极JFET。 由于在单个芯片内合并的两个JFET,其间不需要引线接合连接,因此没有由接合线引起的寄生电感和电阻,因此提高性能并降低封装成本。 单片式公共漏极JFET器件可以应用于降压转换器,升压转换器,反相转换器,开关和两级DC-DC转换器,以提高其性能和效率。 还提供了用于电流感测或比例电流产生的替代单芯片公共漏极JFET器件。

    Semiconductor process for butting contact and semiconductor circuit device having a butting contact
    8.
    发明申请
    Semiconductor process for butting contact and semiconductor circuit device having a butting contact 审中-公开
    用于对接接触的半导体工艺和具有对接接触的半导体电路器件

    公开(公告)号:US20080153239A1

    公开(公告)日:2008-06-26

    申请号:US11805979

    申请日:2007-05-25

    IPC分类号: H01L21/336 G03F1/00

    摘要: According to the present invention, a semiconductor process for butting contact comprises: providing a substrate on which are formed two adjacent transistor gates; implanting a full area between the two adjacent transistor gates by a tilt angle, to form a lightly doped region of a first conductivity type; forming a heavily doped region of the first conductivity type and a heavily doped region of a second conductivity type in the area between the two adjacent transistor gates, in which the heavily doped region of the second conductivity type overrides the lightly doped region of the first conductivity type, and divides the heavily doped region of the first conductivity type into two areas; depositing a dielectric layer; and forming a butting contact in the dielectric layer which concurrently contacts the two divided heavily doped regions of the first conductivity type.

    摘要翻译: 根据本发明,用于对接接触的半导体工艺包括:提供在其上形成两个相邻晶体管栅极的衬底; 在两个相邻的晶体管栅极之间以倾斜角注入全部区域,以形成第一导电类型的轻掺杂区域; 在所述两个相邻晶体管栅极之间的区域中形成第一导电类型的重掺杂区域和第二导电类型的重掺杂区域,其中所述第二导电类型的重掺杂区域覆盖所述第一导电类型的轻掺杂区域 并且将第一导电类型的重掺杂区域划分为两个区域; 沉积介电层; 以及在同时接触第一导电类型的两个分开的重掺杂区域的电介质层中形成对接触点。

    Power supply circuit and control method thereof
    9.
    发明申请
    Power supply circuit and control method thereof 有权
    电源电路及其控制方法

    公开(公告)号:US20070176636A1

    公开(公告)日:2007-08-02

    申请号:US11650525

    申请日:2007-01-08

    IPC分类号: H03K19/0175

    CPC分类号: H02M3/156

    摘要: A power supply circuit and a control method are provided, in which the original enable pad and output pad, or the enable pad and feedback pad are used to trim the output voltage of the power supply circuit without extra trim pads.

    摘要翻译: 提供了电源电路和控制方法,其中原始使能焊盘和输出焊盘或使能焊盘和反馈焊盘用于修剪电源电路的输出电压而无需额外的修整焊盘。

    Control apparatus and method for a boost-inverting converter
    10.
    发明申请
    Control apparatus and method for a boost-inverting converter 有权
    升压反相转换器的控制装置和方法

    公开(公告)号:US20060214648A1

    公开(公告)日:2006-09-28

    申请号:US11388158

    申请日:2006-03-24

    IPC分类号: G05F1/00

    摘要: A plurality of switches, an inductor and two capacitors are configured to be a boost-inverting converter. To operate the converter in a boost-inverting mode, a control apparatus and method switch the switches such that the inductor is energized in a first phase, the first capacitor is discharged to produce an inverting voltage in a second phase, and the second capacitor is charged to produce a boost voltage in a third phase. Therefore, the boost-inverting converter has lower peak inductor current and less power loss, and the limitation to the switch design for the boost-inverting converter is relaxed.

    摘要翻译: 多个开关,电感器和两个电容器被配置为升压反相转换器。 为了在升压反转模式下操作转换器,控制装置和方法切换开关使得电感器在第一相中通电,第一电容器被放电以在第二相中产生反相电压,并且第二电容器 充电以在第三相中产生升压电压。 因此,升压反相转换器具有较低的峰值电感电流和较小的功率损耗,并且对升压反相转换器的开关设计的限制放宽。