公开(公告)号：US20240274462A1

公开(公告)日：2024-08-15

申请号：US18441518

申请日：2024-02-14

Applicant: Tokyo Electron Limited

Inventor： Makoto Fujiwara ,  Kenji Sugakawa ,  Hideyuki Fukushima ,  Norifumi Kohama ,  Daisuke Ikemoto

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/02035 ,  H01L21/67092 ,  H01L21/67288 ,  H01L21/68714

Abstract: A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The substrate processing apparatus includes an attracting pressure generator configured to generate an attracting pressure in the central region and each of multiple zones separated along a circumferential direction of the outer region individually; a transforming device configured to transform the central region relative to an outer edge of the holder. A controller controls: attracting the substrate to the attraction surface, based on a bending state of the substrate, by generating the attracting pressure in at least some of the multiple zones of the outer region; and transforming, after the attracting of the substrate, the attraction surface while carrying on the attracting of the substrate.

公开(公告)号：US09401291B2

公开(公告)日：2016-07-26

申请号：US14525502

申请日：2014-10-28

Applicant: Tokyo Electron Limited

Inventor： Yuji Mimura ,  Tetsuya Maki ,  Shigeto Tsuruta ,  Tatsumi Oonishi ,  Daisuke Ikemoto ,  Takahiro Masunaga

IPC: B05B12/02 ,  B05B1/04 ,  B05C5/02 ,  B05C11/10 ,  H01L21/67

CPC classification number: H01L21/6715 ,  B05C5/0254 ,  B05C11/1013 ,  B05C11/1047 ,  H01L21/67253

Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.

Abstract translation: 涂布装置包括：狭缝喷嘴，其包括保持涂料的保留室; 使狭缝喷嘴移动的移动机构; 压力调节单元，其调节保持室内的压力; 以及控制单元，其控制所述移动机构和所述压力调节单元，以使所述狭缝喷嘴相对于所述基板相对移动，同时将所述保持室内的压力从负压变为大气压，其中，所述控制单元被配置为控制 压力调节单元，使得在包括涂层开始位置和包括涂层终止位置的端部区域的起始区域内的保持室内的压力变化比在中间区域中的保持室内部的压力变化慢，除了 起始区和结束区。