公开(公告)号：US20240282617A1

公开(公告)日：2024-08-22

申请号：US18442522

申请日：2024-02-15

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Kenji Sugakawa ,  Norifumi Kohama ,  Hideyuki Fukushima ,  Shintaro Sugihara ,  Norio Wada

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68785

Abstract: A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder; and an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder.

公开(公告)号：US20240096846A1

公开(公告)日：2024-03-21

申请号：US18467071

申请日：2023-09-14

Applicant: Tokyo Electron Limited

Inventor： Hideyuki Fukushima ,  Manju Choi

IPC: H01L23/00 ,  B32B37/00 ,  B32B37/10 ,  B32B41/00

CPC classification number: H01L24/75 ,  B32B37/0046 ,  B32B37/10 ,  B32B41/00 ,  H01L24/83 ,  B32B2457/14 ,  H01L2224/7555 ,  H01L2224/83896

Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator, a pushing member and a controller. The controller attracts a second substrate with a beginning attracting pressure distribution set on multiple regions, when a pressurization of a first substrate by the pushing member is begun. The controller performs a control of performing a switchover from the beginning attracting pressure distribution to a progress attracting pressure distribution between a time point when the pressurization by the pushing member is begun and a contact end point at which an entire bonding surface of the first substrate and an entire bonding surface of the second substrate come into contact with each other. The progress attracting pressure distribution is created by changing at least one attracting pressure of attracting pressures on the multiple regions in the beginning attracting pressure distribution.

公开(公告)号：US20240274462A1

公开(公告)日：2024-08-15

申请号：US18441518

申请日：2024-02-14

Applicant: Tokyo Electron Limited

Inventor： Makoto Fujiwara ,  Kenji Sugakawa ,  Hideyuki Fukushima ,  Norifumi Kohama ,  Daisuke Ikemoto

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/02035 ,  H01L21/67092 ,  H01L21/67288 ,  H01L21/68714

Abstract: A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The substrate processing apparatus includes an attracting pressure generator configured to generate an attracting pressure in the central region and each of multiple zones separated along a circumferential direction of the outer region individually; a transforming device configured to transform the central region relative to an outer edge of the holder. A controller controls: attracting the substrate to the attraction surface, based on a bending state of the substrate, by generating the attracting pressure in at least some of the multiple zones of the outer region; and transforming, after the attracting of the substrate, the attraction surface while carrying on the attracting of the substrate.

公开(公告)号：US20230162982A1

公开(公告)日：2023-05-25

申请号：US18057935

申请日：2022-11-22

Applicant: Tokyo Electron Limited

Inventor： Hideyuki Fukushima

IPC: H01L21/18

CPC classification number: H01L21/187 ,  H01L21/68714

Abstract: A bonding apparatus includes a first holder, a second holder, a moving unit, a first transforming unit, a second transforming unit and a controller. The first holder holds a first substrate from above. The second holder is provided below the first holder, and holds a second substrate from below. The moving unit moves the first holder and the second holder relative to each other. The first transforming unit makes a central portion of the first substrate held by the first holder protruded downwards. The second transforming unit makes a central portion of the second substrate held by the second holder protruded upwards. The controller performs a control of bringing the central portions into contact with each other. The controller performs a control of changing a protruding amount of the central portion of the first substrate according to a protruding amount of the central portion of the second substrate.