公开(公告)号：US20230062662A1

公开(公告)日：2023-03-02

申请号：US17760182

申请日：2021-01-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ayuta SUZUKI ,  Hidefumi MATSUI ,  Atsushi KUBO

IPC: H01J37/32 ,  G01J5/00

Abstract: A measurement system including an imaging device and a plasma processing device having a plasma generator configured to generate plasma from a gas supplied into a processing chamber and a controller. The imaging device is configured to generate optical information of the plasma from image data of imaged plasma in the processing chamber, and the controller is configured to convert the generated optical information of the plasma into a plasma parameter that determines physical characteristics of the plasma with reference to a storage that stores correlation information between the optical information of the plasma and measurement results of the plasma parameter.

公开(公告)号：US20250118542A1

公开(公告)日：2025-04-10

申请号：US18986429

申请日：2024-12-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ayuta SUZUKI ,  Hidefumi MATSUI ,  Atsushi KUBO

IPC: H01J37/32

Abstract: A measurement system including an imaging device and a plasma processing device having a plasma generator configured to generate plasma from a gas supplied into a processing chamber and a controller. The imaging device is configured to generate optical information of the plasma from image data of imaged plasma in the processing chamber, and the controller is configured to convert the generated optical information of the plasma into a plasma parameter that determines physical characteristics of the plasma with reference to a storage that stores correlation information between the optical information of the plasma and measurement results of the plasma parameter.

公开(公告)号：US20230085325A1

公开(公告)日：2023-03-16

申请号：US17903444

申请日：2022-09-06

Applicant: Tokyo Electron Limited

Inventor： Hirokazu KYOKANE ,  Hidefumi MATSUI ,  Toshiyuki FUKUMOTO ,  Satoshi ITOH ,  Masashi IMANAKA ,  Toyohisa TSURUDA ,  Masashi ENOMOTO ,  Masahiro YANAGISAWA

IPC: G01B11/06 ,  G06T7/60

Abstract: A substrate processing apparatus includes: an imaging portion configured to acquire a surface image of a film formed on a surface of a substrate; an optical property estimation portion configured to estimate an optical property of the film based on process information acquired during formation of the film; and a film thickness estimation portion configured to estimate a film thickness of the film based on the surface image and an estimation result of the optical property.

公开(公告)号：US20230357931A1

公开(公告)日：2023-11-09

申请号：US18042644

申请日：2021-08-23

Applicant: Tokyo Electron Limited

Inventor： Hidefumi MATSUI

IPC: C23C16/52 ,  C23C16/455 ,  H01L21/02

CPC classification number: C23C16/52 ,  C23C16/45527 ,  H01L21/0228

Abstract: A parameter selection method for causing a computer to execute processing steps including: (a) acquiring a plurality of parameters in measurement data of a plurality of sensors regarding a process in a substrate processing apparatus and result data of the process corresponding to the measurement data; (b) classifying the acquired parameters into a plurality of groups by a specific clustering method; (c) selecting parameters having a large effect on the result data based on a threshold value for each of the plurality of groups; (d) repeating the step of (c) in a tournament format between the groups for the parameters selected for each of the groups; and (e) selecting parameters highly correlated with the result data by correlation analysis between the parameters selected in the step of (d).

公开(公告)号：US20230115637A1

公开(公告)日：2023-04-13

申请号：US17759638

申请日：2021-01-27

Applicant: Tokyo Electron Limited

Inventor： Naoshige FUSHIMI ,  Hidefumi MATSUI

IPC: G01K13/02 ,  G06F30/10

Abstract: Provided are a process estimation system and a process data estimation method for appropriately estimating process data, and a program. The process estimation system includes: an input part configured to input actual sensor data detected by a sensor of a substrate processing apparatus; a virtual sensor data generation part configured to generate virtual sensor data for a virtual sensor based on the actual sensor data and a physical model; and a process data estimation part configured to estimate process data based on the virtual sensor data.