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公开(公告)号:US20250045635A1
公开(公告)日:2025-02-06
申请号:US18783106
申请日:2024-07-24
Applicant: Tokyo Electron Limited
Inventor: Masahiro YANAGISAWA
IPC: G06N20/00
Abstract: An information processing apparatus includes a model acquisition unit that acquires a learned model that has learned a relationship between first log information measured during a processing in a first substrate processing apparatus and a first process result indicating a state of a processing target after the processing; a data acquisition unit that acquires second log information measured during a processing in a second substrate processing apparatus and a second process result indicating a state of a processing target after the processing; and a model correction unit that corrects the learned model based on the second log information and the second process result.
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公开(公告)号:US20250014925A1
公开(公告)日:2025-01-09
申请号:US18759466
申请日:2024-06-28
Applicant: Tokyo Electron Limited
Inventor: Yuka NAKASATO , Masahiro YANAGISAWA , Huizhen BU
Abstract: An information processing apparatus includes an acquisition unit that acquires a plurality of sensor values output from a plurality of sensors installed in a semiconductor manufacturing apparatus while a process is running; an inference unit that infers an abnormality degree of the process from the acquired sensor values, using an abnormality detection model that has learned a correspondence relationship between the sensor values and the abnormality degree of the process using learning data; an abnormality detection unit that detects an abnormality occurring in the process based on the inferred abnormality degree of the process; and an abnormality factor search unit that searches for a univariate abnormality and a correlation abnormality that are candidates of abnormality factors occurring in the process, using abnormality factor search methods; and an abnormality determination result output unit that outputs the detected abnormality and the searched univariate abnormality and correlation abnormality, as an abnormality determination result.
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公开(公告)号:US20230085325A1
公开(公告)日:2023-03-16
申请号:US17903444
申请日:2022-09-06
Applicant: Tokyo Electron Limited
Inventor: Hirokazu KYOKANE , Hidefumi MATSUI , Toshiyuki FUKUMOTO , Satoshi ITOH , Masashi IMANAKA , Toyohisa TSURUDA , Masashi ENOMOTO , Masahiro YANAGISAWA
Abstract: A substrate processing apparatus includes: an imaging portion configured to acquire a surface image of a film formed on a surface of a substrate; an optical property estimation portion configured to estimate an optical property of the film based on process information acquired during formation of the film; and a film thickness estimation portion configured to estimate a film thickness of the film based on the surface image and an estimation result of the optical property.
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