公开(公告)号：US20140121814A1

公开(公告)日：2014-05-01

申请号：US14063341

申请日：2013-10-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Junichi OGAWA ,  Youichi NAKAYAMA ,  Keiji OSADA ,  Hiroaki DEWA

IPC: H01L21/67

CPC classification number: G05B19/41865 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/20 ,  Y02P90/86

Abstract: The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.

Abstract translation: 基板处理装置包括：多个处理模块; 转移机制; 控制器 和设置单元。 处理模块相对于衬底进行处理。 转印机构传送从转印容器排出的基板。 控制器输出控制信号，用于沿预先设定的传送路径顺序地将基板传送到多个处理模块，并且基于处理配方处理转印目的地的处理模块中的基板， 设置处理顺序和处理条件。 设置单元设置除了处理配方中设定的操作以外的非配方操作的内容以及通过控制器每个处理模块的控制操作执行非配方操作的执行定时。 相对于处理模块执行非配方操作。

公开(公告)号：US20210287920A1

公开(公告)日：2021-09-16

申请号：US17177382

申请日：2021-02-17

Applicant: Tokyo Electron Limited

Inventor： Rintaro TAKAO ,  Naohide ITO ,  Hiroaki DEWA ,  Masayuki KOZAWA

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/68

Abstract: A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.

公开(公告)号：US20240093371A1

公开(公告)日：2024-03-21

申请号：US18244532

申请日：2023-09-11

Applicant: Tokyo Electron Limited

Inventor： Hiroaki DEWA ,  Satoshi MIZUNAGA ,  Naohide ITO

IPC: C23C16/52 ,  C23C16/448 ,  C23C16/455

CPC classification number: C23C16/52 ,  C23C16/448 ,  C23C16/45561

Abstract: Provided is a method of supplying a liquid raw material to a gas supply device. The gas supply device includes: a storage tank that stores the liquid raw material; a heating unit that heats the liquid raw material to generate a raw material gas; a level detecting unit that detects a liquid surface level of the liquid raw material stored in the storage tank; a gas inlet and a gas outlet provided in the storage tank; and a raw material inlet provided in the storage tank. The method includes: determining whether the liquid surface level of the liquid raw material is equal to or lower than a supply target level; and repeating supply of a specified amount of liquid raw material to the storage tank a specified number of times when the liquid surface level of the liquid raw material is equal to or lower than the supply target level.