公开(公告)号：US20150357222A1

公开(公告)日：2015-12-10

申请号：US14721452

申请日：2015-05-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tetsuya MIYASHITA ,  Masamichi HARA ,  Naoyuki SUZUKI ,  Kaoru YAMAMOTO ,  Kouji MAEDA

IPC: H01L21/683 ,  H05K7/20

CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6875

Abstract: A cooling processing apparatus includes: a processing vessel; an electrostatic chuck installed in the processing vessel, the electrostatic chuck having a mounting surface on which an object to be processed is mounted; a cooling mechanism configured to cool the electrostatic chuck; and a lamp heating device configured to remove moisture attached to the mounting surface. Further, a method for operating the cooling processing apparatus includes: decompressing the space in the processing vessel by using the exhaust device; removing the moisture attached to the mounting surface of the electrostatic chuck by using the lamp heating device; and cooling the electrostatic chuck by using the cooling mechanism after the removal of the moisture performed by the lamp heating device is terminated.

Abstract translation: 冷却处理装置包括：处理容器; 安装在所述处理容器中的静电卡盘，所述静电卡盘具有安装在其上的待加工物体的安装面; 冷却机构，其构造成冷却所述静电卡盘; 以及灯加热装置，其构造成去除附着到所述安装表面的水分。 此外，用于操作冷却处理装置的方法包括：通过使用排气装置对处理容器中的空间进行减压; 通过使用灯加热装置去除附着在静电卡盘的安装表面上的湿气; 并且在终止了由灯加热装置执行的除去湿气之后通过使用冷却机构来冷却静电卡盘。

公开(公告)号：US20140076494A1

公开(公告)日：2014-03-20

申请号：US14027367

申请日：2013-09-16

Applicant: Tokyo Electron Limited

Inventor： Tetsuya MIYASHITA ,  Kaoru YAMAMOTO

IPC: H01L21/677

CPC classification number: H01L21/67703 ,  H01L21/6719 ,  H01L21/67196

Abstract: A processing system includes a transfer chamber having therein a transfer unit for transferring a substrate and at least one processing unit connected to the transfer chamber. The transfer chamber is maintained in a vacuum state. The processing unit is configured to perform a processing on a substrate. The processing unit includes a first chamber in which a first processing is performed on a substrate, and a second chamber detachably installed in the first chambers. A second processing is performed on a substrate in the second chamber installed in the first chamber. Wall portions of the first chamber and the second chamber are maintained at different temperatures.

Abstract translation: 处理系统包括传送室，其中具有用于传送基板的传送单元和连接到传送室的至少一个处理单元。 传送室保持在真空状态。 处理单元被配置为对基板执行处理。 处理单元包括在基板上执行第一处理的第一室和可拆卸地安装在第一室中的第二室。 在安装在第一室中的第二室中的基板上进行第二处理。 第一室和第二室的壁部保持在不同的温度。

公开(公告)号：US20150136027A1

公开(公告)日：2015-05-21

申请号：US14491940

申请日：2014-09-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masamichi HARA ,  Kaoru YAMAMOTO ,  Yasushi MIZUSAWA

IPC: C23C16/44 ,  C23C16/458 ,  C23C16/46 ,  C23C16/455

CPC classification number: C23C16/4412 ,  B01D8/00 ,  B01D2258/0216 ,  C23C16/16 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/463 ,  F15D1/0005 ,  H01J37/32834 ,  H01J37/32844 ,  Y02C20/30 ,  Y02P70/605

Abstract: A trap mechanism for trapping exhaust gas from a process chamber. The trap assembly includes a housing containing a plurality of trap units. The plurality of trap units are arranged successively along a flow direction of said exhaust gas. Each trap unit includes a set of trap panels parallel to each other and spaced apart from each other. The two opposite surfaces with a larger area of each trap panel are oriented substantially parallel to a flow direction of the exhaust gas flow. The two opposite surfaces with a smaller area of each trap panels are oriented orthogonal to the exhaust gas flow.

Abstract translation: 用于捕获来自处理室的废气的捕集机构。 捕集器组件包括容纳多个捕集器单元的壳体。 多个捕集单元沿着排气的流动方向依次配置。 每个陷阱单元包括彼此平行并彼此间隔开的一组陷阱板。 具有每个陷阱板的较大面积的两个相对表面基本上平行于废气流的流动方向定向。 每个陷阱板的面积较小的两个相对表面定向成垂直于废气流。