公开(公告)号：US12157293B2

公开(公告)日：2024-12-03

申请号：US17820299

申请日：2022-08-17

Applicant: Tokyo Electron Limited

Inventor： Takashi Terada ,  Yuji Mimura ,  Hiroshi Maeda ,  Kazutaka Noda ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki ,  Tatsuya Kitayama ,  Akira Fukutomi

IPC: B32B43/00

Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

公开(公告)号：US20240339431A1

公开(公告)日：2024-10-10

申请号：US18625419

申请日：2024-04-03

Applicant: Tokyo Electron Limited

Inventor： Kazutaka Noda ,  Atsushi Nagata ,  Takashi Terada

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/05 ,  H01L24/74 ,  H01L2224/05647 ,  H01L2224/74 ,  H01L2224/80009 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: A bonding method of bonding substrates, a metal material being exposed on each of the substrates, is provided. The bonding method includes modifying a surface of each of the substrates to be bonded with a plasma of a processing gas; hydrophilizing the modified surface of each of the substrates; and bonding the hydrophilized surfaces of the substrates. In the hydrophilizing of the modified surface, a processing liquid is supplied to the surface of each of the substrates, and a recess amount of the metal material is controlled with the processing liquid.

公开(公告)号：US10071544B2

公开(公告)日：2018-09-11

申请号：US13693151

申请日：2012-12-04

Applicant: Tokyo Electron Limited ,  INTEL CORPORATION

Inventor： Osamu Hirakawa ,  Masaru Honda ,  Akira Fukutomi ,  Takeshi Tamura ,  Jiro Harada ,  Kazutaka Noda ,  Xavier Francois Brun

IPC: B32B38/10 ,  H01L21/67 ,  B32B43/00

CPC classification number: B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67288 ,  Y10T156/11 ,  Y10T156/1189 ,  Y10T156/19 ,  Y10T156/1972

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.

公开(公告)号：US20230055853A1

公开(公告)日：2023-02-23

申请号：US17820299

申请日：2022-08-17

Applicant: Tokyo Electron Limited

Inventor： Takashi Terada ,  Yuji Mimura ,  Hiroshi Maeda ,  Kazutaka Noda ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki ,  Tatsuya Kitayama ,  Akira Fukutomi

IPC: B32B43/00

Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

公开(公告)号：US09679798B2

公开(公告)日：2017-06-13

申请号：US14182969

申请日：2014-02-18

Applicant: Tokyo Electron Limited ,  Intel Corporation

Inventor： Yasuharu Iwashita ,  Osamu Hirakawa ,  Yasutaka Soma ,  Takeshi Tamura ,  Kazutaka Noda ,  Xavier Francois Brun ,  Charles Wayne Singleton, Jr.

IPC: B32B38/10 ,  H01L21/683 ,  B32B43/00

CPC classification number: H01L21/6838 ,  B32B43/006 ,  Y10S156/93 ,  Y10S156/941

Abstract: Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.