公开(公告)号：US20190206695A1

公开(公告)日：2019-07-04

申请号：US16232645

申请日：2018-12-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuya KOYAMA

IPC: H01L21/311 ,  H01L21/67

CPC classification number: H01L21/31111 ,  H01L21/67086

Abstract: There is provided a substrate processing method for performing an etching processing by immersing a substrate in a processing liquid containing a chemical liquid and silicon, the substrate processing method including: a preparation step of setting a supply flow rate of the chemical liquid based on a replenishment amount of the chemical liquid and a replenishment amount of the silicon; and a replenishment step of supplying the chemical liquid at the set supply flow rate of the chemical liquid and dissolving a set replenishment amount of the silicon in the processing liquid.

公开(公告)号：US20150328668A1

公开(公告)日：2015-11-19

申请号：US14713275

申请日：2015-05-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuya KOYAMA ,  Hiromi KIYOSE ,  Katsufumi MATSUKI ,  Shuhei TAKAHASHI ,  Hideki NISHIMURA ,  Takashi UNO ,  Hirotaka MARUYAMA

IPC: B08B9/032 ,  H01L21/67

CPC classification number: H01L21/67017 ,  B08B9/032 ,  H01L21/67023

Abstract: A substrate liquid treatment apparatus includes: at least one processing unit that processes a substrate with a treatment liquid; a storage tank that stores the treatment liquid; a circulation line through which the treatment liquid discharged from the storage tank into the circulation line is returned to the storage tank; a branch supply line that is branched from the circulation line to supply the treatment liquid to the processing unit; a recovery line that returns to the storage tank the treatment liquid having been supplied to the substrate in the processing unit; a distribution line connecting the circulation line and the recovery line; and a shutoff valve, provided on the distribution line, that is opened when cleaning of the recovery line is performed.

Abstract translation: 基板液体处理装置包括：至少一个处理单元，其用处理液处理基板; 存储处理液的储罐; 从储罐排入循环管线的处理液通过该循环管线返回到储罐; 分支供应管线，其从所述循环管线分支以将处理液体供应到所述处理单元; 回收管线，其将处理单元中已经供给到所述基板的处理液体返回到所述储存罐; 连接循环管线和回收管线的分配管线; 以及设置在分配线上的截止阀，其在清洁回收管线时被打开。

公开(公告)号：US20210391539A1

公开(公告)日：2021-12-16

申请号：US17336657

申请日：2021-06-02

Applicant: Tokyo Electron Limited

Inventor： Koukichi HIROSHIRO ,  Jun NONAKA ,  Kazuya KOYAMA ,  Mitsunori NAKAMORI

IPC: H01L51/00

Abstract: A method of processing a substrate includes loading the substrate to which a processing liquid is adhered, inside a processing container, removing the processing liquid adhering to the substrate by supplying a first organic solvent to the loaded substrate, causing the substrate to be water-repellent by supplying a water repellent to the substrate from which the processing liquid has been removed, supplying a second organic solvent to the water-repellent substrate, and drying the substrate by volatilizing the second organic solvent adhering to the substrate.