公开(公告)号：US20160228832A1

公开(公告)日：2016-08-11

申请号：US15130282

申请日：2016-04-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi TANAKA ,  Koukichi HIROSHIRO ,  Fumihiro KAMIMURA

IPC: B01F3/08 ,  C01B15/08 ,  B01F15/06 ,  B01J19/24 ,  B01F5/10 ,  B01F15/00

CPC classification number: B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied Into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

Abstract translation: 本发明提供了当硫酸和过氧化氢溶液彼此混合时，能够充分产生有效地从基材中除去抗蚀剂的化学 - 液体混合方法和药液混合装置。 首先，内部容器10填充有硫酸，使从内部容器10溢出的硫酸流入外部容器12.然后，将过氧化氢溶液供给至内部容器10，将氢气 使过氧化物溶液流入外槽12，由此将过氧化氢溶液和硫酸的两种液体储存在外罐12中。同时当过氧化氢溶液流入外罐12时，返回泵 16被激活。

公开(公告)号：US20220316059A1

公开(公告)日：2022-10-06

申请号：US17628682

申请日：2020-07-13

Applicant: Tokyo Electron Limited

Inventor： Koukichi HIROSHIRO ,  Makoto MURAMATSU ,  Koji KAGAWA ,  Kenji SEKIGUCHI

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/46

Abstract: A substrate processing method includes a protective film forming step, an insulating material depositing step, a protective film removing step, and a metal material depositing step. In the protective film forming step, a protective film is formed on a metal film among the metal film and an insulating film exposed on the surface of a substrate, using a film-forming material that is selectively adsorbed onto the metal film. In the insulating material depositing step, after the protective film forming step, an insulating material is deposited on the surface of the insulating film using an atomic layer deposition method. In the protective film removing step, the protective film is removed from the surface of the metal film after the insulating material depositing step. In the metal material depositing step, a metal material is deposited on the metal film after the protective film removing step.

公开(公告)号：US20210391539A1

公开(公告)日：2021-12-16

申请号：US17336657

申请日：2021-06-02

Applicant: Tokyo Electron Limited

Inventor： Koukichi HIROSHIRO ,  Jun NONAKA ,  Kazuya KOYAMA ,  Mitsunori NAKAMORI

IPC: H01L51/00

Abstract: A method of processing a substrate includes loading the substrate to which a processing liquid is adhered, inside a processing container, removing the processing liquid adhering to the substrate by supplying a first organic solvent to the loaded substrate, causing the substrate to be water-repellent by supplying a water repellent to the substrate from which the processing liquid has been removed, supplying a second organic solvent to the water-repellent substrate, and drying the substrate by volatilizing the second organic solvent adhering to the substrate.

公开(公告)号：US20150290599A1

公开(公告)日：2015-10-15

申请号：US14750319

申请日：2015-06-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi TANAKA ,  Koukichi HIROSHIRO ,  Fumihiro KAMIMURA

IPC: B01F5/10 ,  B01F15/02 ,  B01F15/00 ,  B01F3/08 ,  B01F15/06

CPC classification number: B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxornonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

Abstract translation: 本发明提供了当硫酸和过氧化氢溶液彼此混合时，能够充分产生有效地从基材中除去抗蚀剂的化学 - 液体混合方法和药物 - 液体混合装置。 首先，用硫酸填充内箱10，使从内箱10溢出的硫酸流入外箱12.然后，将过氧化氢溶液供给至内箱10，将氢 使过氧化物溶液流入外槽12，由此将过氧化氢溶液和硫酸的两种液体储存在外罐12中。同时当过氧化氢溶液流入外罐12时，返回泵 16被激活。

公开(公告)号：US20240332040A1

公开(公告)日：2024-10-03

申请号：US18612873

申请日：2024-03-21

Applicant: Tokyo Electron Limited

Inventor： Koukichi HIROSHIRO

IPC: H01L21/67

CPC classification number: H01L21/67069

Abstract: A substrate liquid-processing apparatus includes: an irradiation unit that radiates an etching energy beam having a wavelength of 185 nm or less toward the peripheral edge of a substrate; a gas supply unit that supplies an oxygen-containing gas or ozone gas to the peripheral edge of the substrate; a peripheral edge heating unit that is arranged to be located above the substrate, extends in a circular arc or annular shape along the peripheral edge of the substrate, and heats the peripheral edge of the substrate by radiating light to the peripheral edge of the substrate; a light shielding member that is disposed between the substrate and the peripheral edge heating unit, and blocks at least a portion of the light from the peripheral edge heater toward the peripheral edge of the substrate; and a driving unit that changes the separation distance between the substrate and the light shielding member.