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公开(公告)号：US09523711B2
公开(公告)日：2016-12-20
申请号：US14402940
申请日：2013-04-25
发明人： Kazuya Yano , Eiji Hayashi , Munetoshi Nagasaka
IPC分类号： G01R31/00 , G01R1/04 , H01L21/683 , G01R31/28
CPC分类号： G01R1/0425 , G01R1/0491 , G01R31/2886 , H01L21/6838
摘要： A probe apparatus includes a card clamp unit detachably supporting a probe card; and a wafer mounting table adsorbing the semiconductor wafer and bringing electrodes on the semiconductor wafer into contact with the probes. In order to mount the semiconductor wafer including an annular portion protruding from a rear surface of an outer peripheral portion and a thin portion having a thickness smaller than the annular portion, the wafer mounting table includes a planar portion on which the thin portion is mounted; and a step-shaped portion which is formed at an edge of the planar portion and mounts the annular portion thereon. Multiple circular vacuum chuck grooves are concentrically formed in the planar portion, and at least some of the vacuum chuck grooves are connected to multiple vacuum paths through which vacuum evacuation is performed at multiple positions separated from each other by 90° or more along a circumferential direction.
摘要翻译： 探针装置包括可拆卸地支撑探针卡的卡夹单元; 以及将所述半导体晶片吸附并使所述半导体晶片上的电极与所述探针接触的晶片安装台。 为了安装包括从外周部分的后表面突出的环形部分和具有小于环形部分的厚度的薄部分的半导体晶片，晶片安装台包括其上安装薄部分的平面部分; 以及形成在平面部分的边缘处并且将环形部分安装在其上的台阶部分。 多个圆形的真空吸盘凹槽同心地形成在平面部分中，并且至少一些真空吸盘凹槽连接到多个真空通道，通过该多个真空通道在沿着圆周方向彼此分开90°或更多个的多个位置处进行真空排气 。
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公开(公告)号：US09261553B2
公开(公告)日：2016-02-16
申请号：US14444180
申请日：2014-07-28
CPC分类号： G01R31/2601 , G01R1/07342 , G01R31/2886
摘要： A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter φ and pitch p) that satisfies the condition of φ
摘要翻译： 在晶片级检查基板的两侧具有电极的功率器件的电特性的探针装置可以减小基板背面的电极与卡盘顶部的安装面导体之间的接触电阻。 在探针装置中，吸引装置在卡盘顶部12上支撑半导体晶片W，并且具有满足条件＆lt; p＆nlE; 2＆phgr的图案（直径＆php和节距p）的许多垂直细孔。 例如，直径＆phgr 约0.25mm，间距p约为0.5mm。
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公开(公告)号：US20150145547A1
公开(公告)日：2015-05-28
申请号：US14402940
申请日：2013-04-25
发明人： Kazuya Yano , Eiji Hayashi , Munetoshi Nagasaka
IPC分类号： G01R1/04 , H01L21/683
CPC分类号： G01R1/0425 , G01R1/0491 , G01R31/2886 , H01L21/6838
摘要： A probe apparatus includes a card clamp unit detachably supporting a probe card; and a wafer mounting table adsorbing the semiconductor wafer and bringing electrodes on the semiconductor wafer into contact with the probes. In order to mount the semiconductor wafer including an annular portion protruding from a rear surface of an outer peripheral portion and a thin portion having a thickness smaller than the annular portion, the wafer mounting table includes a planar portion on which the thin portion is mounted; and a step-shaped portion which is formed at an edge of the planar portion and mounts the annular portion thereon. Multiple circular vacuum chuck grooves are concentrically formed in the planar portion, and at least some of the vacuum chuck grooves are connected to multiple vacuum paths through which vacuum evacuation is performed at multiple positions separated from each other by 90° or more along a circumferential direction.
摘要翻译： 探针装置包括可拆卸地支撑探针卡的卡夹单元; 以及将所述半导体晶片吸附并使所述半导体晶片上的电极与所述探针接触的晶片安装台。 为了安装包括从外周部分的后表面突出的环形部分和具有小于环形部分的厚度的薄部分的半导体晶片，晶片安装台包括其上安装薄部分的平面部分; 以及形成在平面部分的边缘处并且将环形部分安装在其上的台阶部分。 多个圆形的真空吸盘凹槽同心地形成在平面部分中，并且至少一些真空吸盘凹槽连接到多个真空通道，通过该多个真空通道在沿着圆周方向彼此分开90°或更多个的多个位置处进行真空排气 。
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公开(公告)号：US20150226767A1
公开(公告)日：2015-08-13
申请号：US14619279
申请日：2015-02-11
发明人： Shuji Akiyama , Kazuya Yano , Isamu Inomata
IPC分类号： G01R1/073
CPC分类号： G01R1/07314 , G01R1/07364
摘要： A prober can suppress a decrease of a throughput in inspection of semiconductor devices on a substrate. The prober 10 includes a stage 11 having a horizontal mounting surface 11a that mounts thereon a wafer W on which semiconductor devices are formed; a probe card 16 provided to face the stage 11; three roller devices 26, each having a vertical rotational shaft, equally-spaced along a circumference of the mounted wafer W. Each roller device 26 is configured to rotate the wafer W on a horizontal plane while being in contact with a peripheral edge of the wafer W.
摘要翻译： 探测器可以抑制在衬底上检查半导体器件的吞吐量的降低。 探测器10包括具有安装在其上形成有半导体器件的晶片W的水平安装表面11a的平台11; 设置成面向台架11的探针卡16; 三个辊装置26，每个具有垂直旋转轴，沿着安装的晶片W的圆周等间隔。每个辊装置26构造成在晶片W与晶片的周边边缘接触的同时在水平面上旋转晶片W W.
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公开(公告)号：US20150204909A1
公开(公告)日：2015-07-23
申请号：US14601573
申请日：2015-01-21
发明人： Kazuya Yano , Shuji Akiyama
CPC分类号： G01R1/07342 , B24B19/16 , G01R1/073 , G01R1/07371 , G01R3/00 , G01R31/2889
摘要： A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.
摘要翻译： 包括具有多个探针17的探针卡16的探测器10包括针尖抛光单元24，并且针尖抛光单元24包括与针尖接触的WAPP 28和被配置为支撑WAPP的支撑构件27 在WAPP28的上表面上，设置有包装片29，WAPP 28包括形成在其底面30上的多个凹部31，支撑部件27具有形成在其顶面32上的多个突出部33。 当WAPP 28移动到退避位置时，突起33分别插入并嵌合到凹部31中，并且当WAPP 28移动到接触位置时，突起33的顶部分别与部分接触 未形成凹部31的底面30。
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公开(公告)号：US09684014B2
公开(公告)日：2017-06-20
申请号：US14619279
申请日：2015-02-11
发明人： Shuji Akiyama , Kazuya Yano , Isamu Inomata
IPC分类号： G01R1/073
CPC分类号： G01R1/07314 , G01R1/07364
摘要： A prober can suppress a decrease of a throughput in inspection of semiconductor devices on a substrate. The prober 10 includes a stage 11 having a horizontal mounting surface 11a that mounts thereon a wafer W on which semiconductor devices are formed; a probe card 16 provided to face the stage 11; three roller devices 26, each having a vertical rotational shaft, equally-spaced along a circumference of the mounted wafer W. Each roller device 26 is configured to rotate the wafer W on a horizontal plane while being in contact with a peripheral edge of the wafer W.
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公开(公告)号：US09383389B2
公开(公告)日：2016-07-05
申请号：US14601573
申请日：2015-01-21
发明人： Kazuya Yano , Shuji Akiyama
CPC分类号： G01R1/07342 , B24B19/16 , G01R1/073 , G01R1/07371 , G01R3/00 , G01R31/2889
摘要： A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.
摘要翻译： 包括具有多个探针17的探针卡16的探测器10包括针尖抛光单元24，并且针尖抛光单元24包括与针尖接触的WAPP 28和被配置为支撑WAPP的支撑构件27 在WAPP28的上表面上，设置有包装片29，WAPP 28包括形成在其底面30上的多个凹部31，支撑部件27具有形成在其顶面32上的多个突出部33。 当WAPP 28移动到退避位置时，突起33分别插入并嵌合到凹部31中，并且当WAPP 28移动到接触位置时，突起33的顶部分别与部分接触 未形成凹部31的底面30。
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公开(公告)号：US20150028907A1
公开(公告)日：2015-01-29
申请号：US14444180
申请日：2014-07-28
CPC分类号： G01R31/2601 , G01R1/07342 , G01R31/2886
摘要： A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter φ and pitch p) that satisfies the condition of φ
摘要翻译： 在晶片级检查基板的两侧具有电极的功率器件的电特性的探针装置可以减小基板背面的电极与卡盘顶部的安装面导体之间的接触电阻。 在探针装置中，吸引装置在卡盘顶部12上支撑半导体晶片W，并且具有满足条件＆lt; p＆nlE; 2＆phgr的图案（直径＆php和节距p）的许多垂直细孔。 例如，直径＆phgr 约0.25mm，间距p约为0.5mm。
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