公开(公告)号：US20160307784A1

公开(公告)日：2016-10-20

申请号：US15133110

申请日：2016-04-19

Applicant: Tokyo Electron Limited

Inventor： Satoshi GOMI ,  Daisuke MORISAWA ,  Keiji OSADA

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

CPC classification number: H01L21/67276 ,  G05B2219/45031 ,  H01L21/67745

Abstract: A substrate processing system includes a processing unit having one or more processing chambers each of which includes a mounting table configured to mount thereon a substrate and is configured to perform predetermined processing on the substrate, a loading/unloading unit configured to load/unload a substrate container accommodating a plurality of substrates, one or more transfer units configured to transfer a substrate between the loading/unloading unit and the processing chambers, and a control unit configured to control the processing unit, the loading/unloading unit and the transfer units. The control unit controls a simulated operation, which does not include the predetermined processing in the processing chamber, to be performed on a plurality of dummy substrates in parallel. The simulated operation is a simulated transfer operation of the dummy substrates and includes a operation without transferring the dummy substrates from the loading/unloading unit into the processing chamber.

Abstract translation: 一种基板处理系统，包括具有一个或多个处理室的处理单元，每个处理室包括：安装台，其被配置为在其上安装基板，并且被配置为在所述基板上执行预定处理;装载/卸载单元，被配置为加载/卸载基板 容纳多个基板的容器，配置成在装载/卸载单元和处理室之间传送基板的一个或多个传送单元，以及被配置为控制处理单元，装载/卸载单元和传送单元的控制单元。 控制单元控制在并行地对多个虚拟基板执行的不包括处理室中的预定处理的模拟操作。 模拟操作是虚拟基板的模拟传送操作，并且包括不将虚设基板从装载/卸载单元传送到处理室中的操作。

公开(公告)号：US20160093520A1

公开(公告)日：2016-03-31

申请号：US14860251

申请日：2015-09-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naohide ITO ,  Daisuke MORISAWA ,  Keiji OSADA

IPC: H01L21/677 ,  C23C16/458 ,  H01L21/67 ,  C23C16/52 ,  H01L21/02 ,  H01L21/687

CPC classification number: C23C16/4584 ,  C23C16/52 ,  H01L21/02263 ,  H01L21/67201 ,  H01L21/67745

Abstract: Disclosed is a processing apparatus. The processing apparatus includes: a load port in which a conveyance container accommodating a plurality of semiconductor wafers is placed; a dummy wafer storage area in which a conveyance container accommodating a plurality of dummy wafers is placed; a normal-pressure conveyance room in which a first conveyance arm is installed; an equipment that processes the plurality of semiconductor wafers in a state where the semiconductor wafers and the dummy wafers which are conveyed are placed in slots, respectively; and a controller that controls each component of the processing apparatus. The controller classifies the dummy wafers accommodated in the conveyance container into a plurality of groups, and controls the first conveyance arm to preferentially convey the dummy wafers within one of the classified groups to the equipment and, in replacing the dummy wafers, to perform replacement of the dummy wafers group to group as classified.

Abstract translation: 公开了一种处理装置。 处理装置包括：装载有容纳多个半导体晶片的输送容器的装载口; 虚设晶片存储区域，其中放置容纳多个虚拟晶片的输送容器; 其中安装有第一输送臂的常压输送室; 在被输送的半导体晶片和虚拟晶片分别放置在槽中的状态下处理多个半导体晶片的设备; 以及控制器，其控制处理装置的每个部件。 控制器将容纳在输送容器中的虚拟晶片分成多个组，并且控制第一输送臂以优先地将分类组中的一个中的虚拟晶片传送到设备，并且在更换虚拟晶片时，执行更换 虚晶片组分组。

公开(公告)号：US20140121814A1

公开(公告)日：2014-05-01

申请号：US14063341

申请日：2013-10-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Junichi OGAWA ,  Youichi NAKAYAMA ,  Keiji OSADA ,  Hiroaki DEWA

IPC: H01L21/67

CPC classification number: G05B19/41865 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/20 ,  Y02P90/86

Abstract: The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.

Abstract translation: 基板处理装置包括：多个处理模块; 转移机制; 控制器 和设置单元。 处理模块相对于衬底进行处理。 转印机构传送从转印容器排出的基板。 控制器输出控制信号，用于沿预先设定的传送路径顺序地将基板传送到多个处理模块，并且基于处理配方处理转印目的地的处理模块中的基板， 设置处理顺序和处理条件。 设置单元设置除了处理配方中设定的操作以外的非配方操作的内容以及通过控制器每个处理模块的控制操作执行非配方操作的执行定时。 相对于处理模块执行非配方操作。

公开(公告)号：US20140109833A1

公开(公告)日：2014-04-24

申请号：US14060182

申请日：2013-10-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naohide ITO ,  Keiji OSADA ,  Daisuke MORISAWA

IPC: H01L21/02

CPC classification number: H01L21/02617 ,  H01J37/32743 ,  H01J37/32899 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67276

Abstract: A substrate processing apparatus is provided with a process module including a processing container, a rotary table installed within the processing container, the rotary table having a plurality of placing regions to receive substrates, and a process gas supply unit supplying a process gas to the placing regions, a load port in which a transfer container is placed, a dummy substrate receiving unit, a transfer chamber including a transfer mechanism delivering the product substrates or the dummy substrates between the transfer container or the dummy substrate receiving unit and the rotary table, a setting unit setting a placing region to which one of the product substrates is to be transferred, and a control unit outputting a control signal such that the dummy substrates are carried into the remaining placing regions.

Abstract translation: 基板处理装置设置有处理模块，该处理模块包括处理容器，安装在处理容器内的旋转台，具有多个用于接收基板的放置区域的旋转台，以及向处理气体供给处理气体 区域，其中放置转移容器的负载端口，虚设基板接收单元，包括在转印容器或虚设基板接收单元和旋转台之间输送产品基板或虚设基板的转印机构的转印室， 设置单元设置要传送一个产品基板的放置区域，以及输出控制信号的控制单元，使得虚设基板被携带到剩余的放置区域中。