公开(公告)号：US20140109833A1

公开(公告)日：2014-04-24

申请号：US14060182

申请日：2013-10-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naohide ITO ,  Keiji OSADA ,  Daisuke MORISAWA

IPC: H01L21/02

CPC classification number: H01L21/02617 ,  H01J37/32743 ,  H01J37/32899 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67276

Abstract: A substrate processing apparatus is provided with a process module including a processing container, a rotary table installed within the processing container, the rotary table having a plurality of placing regions to receive substrates, and a process gas supply unit supplying a process gas to the placing regions, a load port in which a transfer container is placed, a dummy substrate receiving unit, a transfer chamber including a transfer mechanism delivering the product substrates or the dummy substrates between the transfer container or the dummy substrate receiving unit and the rotary table, a setting unit setting a placing region to which one of the product substrates is to be transferred, and a control unit outputting a control signal such that the dummy substrates are carried into the remaining placing regions.

Abstract translation: 基板处理装置设置有处理模块，该处理模块包括处理容器，安装在处理容器内的旋转台，具有多个用于接收基板的放置区域的旋转台，以及向处理气体供给处理气体 区域，其中放置转移容器的负载端口，虚设基板接收单元，包括在转印容器或虚设基板接收单元和旋转台之间输送产品基板或虚设基板的转印机构的转印室， 设置单元设置要传送一个产品基板的放置区域，以及输出控制信号的控制单元，使得虚设基板被携带到剩余的放置区域中。

公开(公告)号：US20150040828A1

公开(公告)日：2015-02-12

申请号：US14455795

申请日：2014-08-08

Applicant: Tokyo Electron Limited

Inventor： Daisuke MORISAWA ,  Junichi OGAWA

IPC: C23C16/52 ,  C23C16/44

CPC classification number: C23C16/4401 ,  H01L21/67276

Abstract: A substrate processing system for sequentially processing substrates includes processing chambers, a transfer unit, and a control unit controlling the processing chambers and the transfer unit. The control unit includes a transfer control unit controlling an operation of the transfer unit, a transfer order setting unit setting a transfer order of substrates to the processing chambers, an accumulation unit for accumulating a film thickness of a formed thin film or the number of processed substrates after completion of previous cleaning or previous pre-coating in the processing chambers, a processing chamber priority determination unit for determining priority of processing the substrates in the processing chambers based on predetermined rules, and an execution instruction unit for executing conditioning in the processing chambers. The control unit prevents the substrates from being simultaneously processed in all processing chambers during one cycle of executing conditioning once in each of the processing chambers.

Abstract translation: 用于顺序处理基板的基板处理系统包括处理室，转印单元和控制处理室和转印单元的控制单元。 控制单元包括控制传送单元的操作的传送控制单元，设置到处理室的基板的传送顺序的传送顺序设置单元，用于累积形成的薄膜的膜厚度的累积单元或被处理的 处理室优先确定单元，用于基于预定规则确定处理室中的基板的处理优先权;以及执行指令单元，用于在处理室中执行调节 。 控制单元防止在每个处理室中执行一次循环的一个循环期间在所有处理室中同时处理基板。

公开(公告)号：US20140112743A1

公开(公告)日：2014-04-24

申请号：US14055490

申请日：2013-10-16

Applicant: Tokyo Electron Limited

Inventor： Daisuke MORISAWA

IPC: H01L21/677

CPC classification number: H01L21/67703 ,  H01L21/67276

Abstract: A substrate processing system includes a plurality of processing chambers configured to perform a predetermined processing with respect to substrates, a transfer device configured to transfer the substrates to the processing chambers in a predetermined order, and a delivery unit configured to deliver the substrates between the delivery unit and the transfer device. The substrate processing system configured to sequentially process the substrates by repeating an operation in a predetermined transfer order. The substrate processing system includes a transfer order setting unit and a transfer control unit configured to switch the first transfer order to the second transfer order.

Abstract translation: 衬底处理系统包括被配置为对衬底执行预定处理的多个处理室，被配置为以预定顺序将衬底传送到处理室的传送装置以及配置成在传送之间传送衬底的传送单元 单元和传送设备。 衬底处理系统被配置为通过以预定的传送顺序重复操作来顺序处理衬底。 基板处理系统包括传送顺序设置单元和传送控制单元，其被配置为将第一传送顺序切换到第二传送顺序。

公开(公告)号：US20160093520A1

公开(公告)日：2016-03-31

申请号：US14860251

申请日：2015-09-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naohide ITO ,  Daisuke MORISAWA ,  Keiji OSADA

IPC: H01L21/677 ,  C23C16/458 ,  H01L21/67 ,  C23C16/52 ,  H01L21/02 ,  H01L21/687

CPC classification number: C23C16/4584 ,  C23C16/52 ,  H01L21/02263 ,  H01L21/67201 ,  H01L21/67745

Abstract: Disclosed is a processing apparatus. The processing apparatus includes: a load port in which a conveyance container accommodating a plurality of semiconductor wafers is placed; a dummy wafer storage area in which a conveyance container accommodating a plurality of dummy wafers is placed; a normal-pressure conveyance room in which a first conveyance arm is installed; an equipment that processes the plurality of semiconductor wafers in a state where the semiconductor wafers and the dummy wafers which are conveyed are placed in slots, respectively; and a controller that controls each component of the processing apparatus. The controller classifies the dummy wafers accommodated in the conveyance container into a plurality of groups, and controls the first conveyance arm to preferentially convey the dummy wafers within one of the classified groups to the equipment and, in replacing the dummy wafers, to perform replacement of the dummy wafers group to group as classified.

Abstract translation: 公开了一种处理装置。 处理装置包括：装载有容纳多个半导体晶片的输送容器的装载口; 虚设晶片存储区域，其中放置容纳多个虚拟晶片的输送容器; 其中安装有第一输送臂的常压输送室; 在被输送的半导体晶片和虚拟晶片分别放置在槽中的状态下处理多个半导体晶片的设备; 以及控制器，其控制处理装置的每个部件。 控制器将容纳在输送容器中的虚拟晶片分成多个组，并且控制第一输送臂以优先地将分类组中的一个中的虚拟晶片传送到设备，并且在更换虚拟晶片时，执行更换 虚晶片组分组。

公开(公告)号：US20190109030A1

公开(公告)日：2019-04-11

申请号：US16152812

申请日：2018-10-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Daisuke MORISAWA

IPC: H01L21/67 ,  G05B19/418

Abstract: A method of processing a target substrate includes a process of serially executing multiple processes including a main process and first to M-th subprocesses (where M is a positive integer). An index value indicating one execution of the main process is accumulated for each execution of the main process. The main process is executed multiple times in the process of serially executing multiple processes. An i-th subprocess (where i is a positive integer that satisfies 1≤i≤M) is executed once or multiple times in the process of serially executing multiple processes, and is executed subsequent to one or multiple consecutive executions of the main process. The i-th application and execution conditions are changeable.

公开(公告)号：US20160307784A1

公开(公告)日：2016-10-20

申请号：US15133110

申请日：2016-04-19

Applicant: Tokyo Electron Limited

Inventor： Satoshi GOMI ,  Daisuke MORISAWA ,  Keiji OSADA

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

CPC classification number: H01L21/67276 ,  G05B2219/45031 ,  H01L21/67745

Abstract: A substrate processing system includes a processing unit having one or more processing chambers each of which includes a mounting table configured to mount thereon a substrate and is configured to perform predetermined processing on the substrate, a loading/unloading unit configured to load/unload a substrate container accommodating a plurality of substrates, one or more transfer units configured to transfer a substrate between the loading/unloading unit and the processing chambers, and a control unit configured to control the processing unit, the loading/unloading unit and the transfer units. The control unit controls a simulated operation, which does not include the predetermined processing in the processing chamber, to be performed on a plurality of dummy substrates in parallel. The simulated operation is a simulated transfer operation of the dummy substrates and includes a operation without transferring the dummy substrates from the loading/unloading unit into the processing chamber.

Abstract translation: 一种基板处理系统，包括具有一个或多个处理室的处理单元，每个处理室包括：安装台，其被配置为在其上安装基板，并且被配置为在所述基板上执行预定处理;装载/卸载单元，被配置为加载/卸载基板 容纳多个基板的容器，配置成在装载/卸载单元和处理室之间传送基板的一个或多个传送单元，以及被配置为控制处理单元，装载/卸载单元和传送单元的控制单元。 控制单元控制在并行地对多个虚拟基板执行的不包括处理室中的预定处理的模拟操作。 模拟操作是虚拟基板的模拟传送操作，并且包括不将虚设基板从装载/卸载单元传送到处理室中的操作。