公开(公告)号：US20210057243A1

公开(公告)日：2021-02-25

申请号：US16999024

申请日：2020-08-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru MOTEGI ,  Takashi KUMAGAI ,  Akira KODASHIMA ,  Keisuke YOSHIMURA

IPC: H01L21/67 ,  H01J37/32

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

公开(公告)号：US20230326724A1

公开(公告)日：2023-10-12

申请号：US18209030

申请日：2023-06-13

Applicant: Tokyo Electron Limited

Inventor： Yusuke HAYASAKA ,  Shuhei YAMABE ,  Naoki TAMARU ,  Keisuke YOSHIMURA ,  Kyo TSUBOI

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/32522 ,  H01J37/32715 ,  H01J37/32743 ,  H01L21/67069 ,  H01J37/32834 ,  H01J37/32495 ,  H01J2237/334 ,  H01J2237/002

Abstract: A plasma processing apparatus is for performing plasma processing in a depressurizable inner space. The apparatus includes a chamber having therein an inner space, a supporting table provided in the inner space and configured to support a substrate to be mounted thereon, one or more first members included in the chamber or separate from the chamber and partially exposed to a depressurized environment including the inner space, and one or more second members included in the chamber or separate from the chamber, each being in contact with a corresponding one of said one or more first members, and partially disposed in an atmospheric pressure environment. The apparatus further includes one or more feeders each of which is configured to supply a coolant to a cavity formed in a corresponding one of said one or more second members.

公开(公告)号：US20230015560A1

公开(公告)日：2023-01-19

申请号：US17956214

申请日：2022-09-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru MOTEGI ,  Takashi KUMAGAI ,  Akira KODASHIMA ,  Keisuke YOSHIMURA

IPC: H01L21/67 ,  H01J37/32

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.