公开(公告)号：US20150318194A1

公开(公告)日：2015-11-05

申请号：US14689223

申请日：2015-04-17

Applicant: Tokyo Electron Limited

Inventor： Kento Kurusu ,  Kohei Mori

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67259 ,  H01L21/02041 ,  H01L21/67023

Abstract: A liquid processing apparatus includes a substrate holding and rotating unit provided with a rotating plate and a substrate support unit, and a liquid supply unit. The rotating plate is connected to a rotating shaft and a central portion of the rotating shaft is exposed to outside through an opening of the rotating plate. A ring-shaped retro-reflective sheet is attached to the central portion of the rotating shaft. The central opened part of the ring-shaped retro-reflective sheet is positioned on the extended line of the central axis of the wafer holding and rotating unit. Further, a supply pipe penetrates through the central opened part of the retro-reflective sheet. Laser light is irradiated to the retro-reflective sheet from the slanted upper side, the reflected light is received by the laser light projecting/receiving part, and presence or absence of the wafer is detected by a substrate detection unit.

Abstract translation: 液体处理装置包括设置有旋转板和基板支撑单元的基板保持旋转单元和液体供应单元。 旋转板连接到旋转轴，旋转轴的中心部分通过旋转板的开口暴露于外部。 环状的逆反射片安装在旋转轴的中心部分。 环形反光片的中央开口部位于晶片保持旋转部的中心轴的延长线上。 此外，供给管穿过逆反射片的中央开口部。 激光从倾斜的上侧照射到逆反射片，反射光被激光投射/接收部接收，并且由衬底检测单元检测是否存在晶片。

公开(公告)号：USD719591S1

公开(公告)日：2014-12-16

申请号：US29466456

申请日：2013-09-09

Applicant: Tokyo Electron Limited

Designer： Kento Kurusu

公开(公告)号：USD719199S1

公开(公告)日：2014-12-09

申请号：US29466453

申请日：2013-09-09

Applicant: Tokyo Electron Limited

Designer： Kento Kurusu

公开(公告)号：US20200083064A1

公开(公告)日：2020-03-12

申请号：US16560166

申请日：2019-09-04

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Kento Kurusu

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/02 ,  B08B3/08 ,  B08B1/00

Abstract: A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.

公开(公告)号：US10290518B2

公开(公告)日：2019-05-14

申请号：US14834482

申请日：2015-08-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kento Kurusu ,  Yukiyoshi Saito ,  Seiki Ishida

IPC: H01L21/67

Abstract: A substrate liquid processing apparatus includes a substrate holding device which holds a substrate in horizontal position and rotate the substrate around vertical axis of the substrate, a liquid discharge device which is positioned underneath central portion of lower surface of the substrate in the horizontal position and discharges processing liquid toward the lower surface of the substrate, and a gas discharge passage structure which has a gas discharge passage formed around the discharge device such that drying gas passes through. The discharge device has a head including a cover which is extending beyond upper end of the passage such that the cover is covering the upper end of the passage, a liquid discharge port which is protruding from the cover toward the substrate in the horizontal position, and a curved portion which is formed between the port and cover such that the curved portion has a surface bending downward.

公开(公告)号：USD843118S1

公开(公告)日：2019-03-19

申请号：US29607555

申请日：2017-06-14

Applicant: Tokyo Electron Limited

Designer： Hidetaka Shinohara ,  Osamu Miyahara ,  Kento Kurusu

公开(公告)号：US09691646B2

公开(公告)日：2017-06-27

申请号：US14689223

申请日：2015-04-17

Applicant: Tokyo Electron Limited

Inventor： Kento Kurusu ,  Kohei Mori

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67259 ,  H01L21/02041 ,  H01L21/67023

Abstract: A liquid processing apparatus includes a substrate holding and rotating unit provided with a rotating plate and a substrate support unit, and a liquid supply unit. The rotating plate is connected to a rotating shaft and a central portion of the rotating shaft is exposed to outside through an opening of the rotating plate. A ring-shaped retro-reflective sheet is attached to the central portion of the rotating shaft. The central opened part of the ring-shaped retro-reflective sheet is positioned on the extended line of the central axis of the wafer holding and rotating unit. Further, a supply pipe penetrates through the central opened part of the retro-reflective sheet. Laser light is irradiated to the retro-reflective sheet from the slanted upper side, the reflected light is received by the laser light projecting/receiving part, and presence or absence of the wafer is detected by a substrate detection unit.

公开(公告)号：US20130206171A1

公开(公告)日：2013-08-15

申请号：US13760249

申请日：2013-02-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kento Kurusu

IPC: B08B1/00

CPC classification number: B08B1/002 ,  B08B1/04 ,  H01L21/02074 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051

Abstract: A removal target can be effectively removed from a substrate. In a substrate processing apparatus 1 and a substrate processing method by using a substrate processing scrubber 29 of removing the removal target from the substrate 5, the substrate processing scrubber 29 includes a base 31 connected to a rotation shaft 28; scrubber main bodies 32 provided at the base 31 and arranged at a regular distance in a rotational direction of the base 31; and a processing liquid supply opening 36 formed at the base 31 and configured to supply a processing liquid to the scrubber main bodies 32. Further, an area of an attachment surface of each of the scrubber main bodies 32 to be attached to the base 31 is larger than an area of a contact surface of each of the scrubber main bodies 32 to be brought into contact with the substrate 5.

Abstract translation: 可以有效地从基板去除去除靶。 在基板处理装置1和基板处理方法中，通过使用从基板5除去去除靶的基板处理洗涤器29，基板处理洗涤器29包括连接到旋转轴28的基部31; 洗涤器主体32，其设置在基部31处并且沿着基部31的旋转方向以规则的距离布置; 以及处理液供给口36，其形成在基部31并且被配置为向洗涤器主体32供给处理液。此外，每个洗涤器主体32的附接到基座31的安装面的面积为 大于每个洗涤器主体32的与基板5接触的接触表面的面积。

公开(公告)号：US20250010341A1

公开(公告)日：2025-01-09

申请号：US18761581

申请日：2024-07-02

Applicant: Tokyo Electron Limited

Inventor： Takanori Obaru ,  Kento Kurusu

IPC: B08B1/40 ,  B08B1/36 ,  B08B3/10 ,  B08B11/02 ,  B08B13/00

Abstract: A substrate processing apparatus includes a processor configured to process a substrate with a processing liquid. The processor has a holder configured to hold the substrate horizontally. The holder includes a first holder configured to come into contact with a center of a bottom surface of the substrate. The processor has a rotation driver configured to rotate the first holder around a vertical rotation axis. The substrate processing apparatus includes a charging member configured to charge a second substrate prepared separately from the substrate; and a controller configured to perform bringing the second substrate charged by the charging member into contact with the first holder.

公开(公告)号：US11482428B2

公开(公告)日：2022-10-25

申请号：US16560166

申请日：2019-09-04

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Kento Kurusu

IPC: H01L21/67 ,  H01L21/683 ,  B08B1/00 ,  H01L21/02 ,  B08B3/08

Abstract: A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.