公开(公告)号：US20210398827A1

公开(公告)日：2021-12-23

申请号：US17467346

申请日：2021-09-06

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/687 ,  B24B37/30 ,  B08B1/04 ,  B08B1/00 ,  B24B37/10 ,  H01L21/304 ,  H01L21/677

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US20240213046A1

公开(公告)日：2024-06-27

申请号：US18419867

申请日：2024-01-23

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  B08B1/10 ,  B08B1/32 ,  B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67046 ,  B08B1/10 ,  B08B1/32 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67748 ,  H01L21/68728 ,  H01L21/68742

Abstract: A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.

公开(公告)号：US20200083064A1

公开(公告)日：2020-03-12

申请号：US16560166

申请日：2019-09-04

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Kento Kurusu

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/02 ,  B08B3/08 ,  B08B1/00

Abstract: A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.

公开(公告)号：US11887869B2

公开(公告)日：2024-01-30

申请号：US17467346

申请日：2021-09-06

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/06 ,  H01L21/687 ,  B24B37/30 ,  B08B1/04 ,  B08B1/00 ,  B24B37/10 ,  H01L21/304 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67046 ,  B08B1/001 ,  B08B1/04 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67748 ,  H01L21/68728 ,  H01L21/68742

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US11482428B2

公开(公告)日：2022-10-25

申请号：US16560166

申请日：2019-09-04

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Kento Kurusu

IPC: H01L21/67 ,  H01L21/683 ,  B08B1/00 ,  H01L21/02 ,  B08B3/08

Abstract: A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.

公开(公告)号：US10665478B2

公开(公告)日：2020-05-26

申请号：US15454108

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Shingo Kamitomo ,  Masakazu Yarimitsu ,  Takeru Hirose ,  Tomohito Ura

IPC: H01L21/304 ,  H01L21/67 ,  B08B1/00 ,  B08B17/00 ,  H01L21/687

Abstract: A liquid residue on a bottom surface of a substrate can be reduced while placing the substrate accurately. A liquid processing apparatus includes an inclined portion, a plurality of supporting members, a processing liquid supply unit and a rotation unit. The inclined portion is provided under the substrate, and has an inclined surface which is inclined downwards from an outer side of the substrate toward an inner side thereof and is extended along a circumferential direction of the substrate. The supporting members are protruded from the inclined surface and configured to support the substrate from below. The processing liquid supply unit is configured to supply a processing liquid onto a top surface of the substrate. The rotation unit is configured to rotate the inclined portion. Further, each of the supporting members has a long narrow shape extended from the outer side of the substrate toward the inner side thereof.

公开(公告)号：US11139182B2

公开(公告)日：2021-10-05

申请号：US16214501

申请日：2018-12-10

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/687 ,  B08B1/04 ,  B08B1/00 ,  H01L21/304 ,  H01L21/677 ,  B24B37/30 ,  B24B37/10

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

公开(公告)号：US20170278727A1

公开(公告)日：2017-09-28

申请号：US15454108

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Shingo Kamitomo ,  Masakazu Yarimitsu ,  Takeru Hirose ,  Tomohito Ura

IPC: H01L21/67 ,  B08B3/04 ,  B08B1/00 ,  H01L21/687

CPC classification number: H01L21/67046 ,  B08B1/002 ,  B08B17/00 ,  H01L21/67051 ,  H01L21/68735

Abstract: A liquid residue on a bottom surface of a substrate can be reduced while placing the substrate accurately. A liquid processing apparatus includes an inclined portion, a plurality of supporting members, a processing liquid supply unit and a rotation unit. The inclined portion is provided under the substrate, and has an inclined surface which is inclined downwards from an outer side of the substrate toward an inner side thereof and is extended along a circumferential direction of the substrate. The supporting members are protruded from the inclined surface and configured to support the substrate from below. The processing liquid supply unit is configured to supply a processing liquid onto a top surface of the substrate. The rotation unit is configured to rotate the inclined portion. Further, each of the supporting members has a long narrow shape extended from the outer side of the substrate toward the inner side thereof.

公开(公告)号：US12230515B2

公开(公告)日：2025-02-18

申请号：US18419867

申请日：2024-01-23

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  B08B1/10 ,  B08B1/32 ,  B24B37/10 ,  B24B37/30 ,  H01L21/02 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

Abstract: A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.

公开(公告)号：US20190181022A1

公开(公告)日：2019-06-13

申请号：US16214501

申请日：2018-12-10

Applicant: Tokyo Electron Limited

Inventor： Nobuhiko Mouri ,  Takanori Obaru ,  Yasushi Takiguchi ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/304 ,  B08B1/04 ,  B08B1/00 ,  B24B37/10 ,  B24B37/30

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.