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公开(公告)号：US10818521B2
公开(公告)日：2020-10-27
申请号：US16045941
申请日：2018-07-26
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
Abstract: Disclosed is a substrate processing apparatus including: a substrate holding member that holds a peripheral portion of a substrate; a rotating member that includes a plate provided with the substrate holding member and rotates the substrate by rotating the plate; a fluid supply unit that is disposed at a center of the rotating member and supplies a processing liquid and an inert gas to a lower surface of the substrate held by the substrate holding member; and a controller that controls to perform a liquid processing by supplying the processing liquid to the lower surface of the substrate while rotating the substrate, and, after the liquid processing, to perform a drying processing of the substrate while supplying the inert gas to the lower surface of the substrate.
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公开(公告)号：US11850697B2
公开(公告)日：2023-12-26
申请号：US17120857
申请日：2020-12-14
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
IPC: B24B29/00 , B24B37/005 , H01L21/02 , B24B57/02 , B24B37/07
CPC classification number: B24B29/005 , B24B37/005 , B24B37/07 , B24B57/02 , H01L21/02013 , H01L21/02052
Abstract: A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid for each area and controls the moving part to scan the polishing head for each area while a subsequent supply of the cleaning liquid is stopped.
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公开(公告)号：US20190084117A1
公开(公告)日：2019-03-21
申请号：US16136476
申请日：2018-09-20
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
IPC: B24B29/00 , H01L21/687 , H01L21/67 , H01L21/306
Abstract: A substrate processing method includes polishing a target surface of a substrate to be polished by moving a polishing brush in a horizontal direction while pressing the polishing brush against the polishing target surface of the substrate which rotates in a horizontal posture around a vertical axis. The polishing is performed while varying a rotation speed of the substrate and a moving speed of the polishing brush such that the rotation speed of the substrate decreases stepwise or continuously and the moving speed of the polishing brush in a radial direction of the substrate decreases stepwise or continuously as a distance from a center of rotation of the substrate measured in the radial direction of the substrate to a center of the polishing brush increases.
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公开(公告)号：US20240307925A1
公开(公告)日：2024-09-19
申请号：US18459913
申请日：2022-02-17
Applicant: Tokyo Electron Limited
Inventor： Yoshitomo Sato , Osamu Miyahara
Abstract: A substrate processing method includes etching a film formed on a rear surface of a substrate opposite to a main surface of the substrate and polishing the rear surface of the substrate after the etching of the film. In the etching of the film, a film formed on a rear surface of a substrate opposite to a main surface of the substrate is etched. In the polishing of the rear surface, the rear surface of the substrate is polished after the etching.
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Patent Agency Ranking
公开(公告)号：US20210005471A1
公开(公告)日：2021-01-07
申请号：US17029296
申请日：2020-09-23
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
Abstract: Disclosed is a substrate processing apparatus including: a substrate holding member that holds a peripheral portion of a substrate; a rotating member that includes a plate provided with the substrate holding member and rotates the substrate by rotating the plate; a fluid supply unit that is disposed at a center of the rotating member and supplies a processing liquid and an inert gas to a lower surface of the substrate held by the substrate holding member; and a controller that controls to perform a liquid processing by supplying the processing liquid to the lower surface of the substrate while rotating the substrate, and, after the liquid processing, to perform a drying processing of the substrate while supplying the inert gas to the lower surface of the substrate.
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公开(公告)号：US11731229B2
公开(公告)日：2023-08-22
申请号：US16136476
申请日：2018-09-20
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
IPC: B24B29/00 , H01L21/67 , B24B37/005 , B24B49/00 , H01L21/687 , H01L21/306
CPC classification number: B24B29/005 , B24B37/005 , B24B49/006 , H01L21/30625 , H01L21/67017 , H01L21/67046 , H01L21/67051 , H01L21/67219 , H01L21/67253 , H01L21/68785
Abstract: A substrate processing method includes polishing a target surface of a substrate to be polished by moving a polishing brush in a horizontal direction while pressing the polishing brush against the polishing target surface of the substrate which rotates in a horizontal posture around a vertical axis. The polishing is performed while varying a rotation speed of the substrate and a moving speed of the polishing brush such that the rotation speed of the substrate decreases stepwise or continuously and the moving speed of the polishing brush in a radial direction of the substrate decreases stepwise or continuously as a distance from a center of rotation of the substrate measured in the radial direction of the substrate to a center of the polishing brush increases.
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公开(公告)号：USD843118S1
公开(公告)日：2019-03-19
申请号：US29607555
申请日：2017-06-14
Applicant: Tokyo Electron Limited
Designer： Hidetaka Shinohara , Osamu Miyahara , Kento Kurusu
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公开(公告)号：US20190043740A1
公开(公告)日：2019-02-07
申请号：US16045941
申请日：2018-07-26
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
Abstract: Disclosed is a substrate processing apparatus including: a substrate holding member that holds a peripheral portion of a substrate; a rotating member that includes a plate provided with the substrate holding member and rotates the substrate by rotating the plate; a fluid supply unit that is disposed at a center of the rotating member and supplies a processing liquid and an inert gas to a lower surface of the substrate held by the substrate holding member; and a controller that controls to perform a liquid processing by supplying the processing liquid to the lower surface of the substrate while rotating the substrate, and, after the liquid processing, to perform a drying processing of the substrate while supplying the inert gas to the lower surface of the substrate.
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公开(公告)号：US11967509B2
公开(公告)日：2024-04-23
申请号：US17029296
申请日：2020-09-23
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
CPC classification number: H01L21/67051 , B08B1/002 , B08B1/02 , B08B3/041 , H01L21/02057 , H01L21/67017 , H01L21/67028 , H01L21/67034 , H01L21/67046 , H01L21/68728 , H01L21/02052 , H01L21/0209
Abstract: Disclosed is a substrate processing apparatus including: a substrate holding member that holds a peripheral portion of a substrate; a rotating member that includes a plate provided with the substrate holding member and rotates the substrate by rotating the plate; a fluid supply unit that is disposed at a center of the rotating member and supplies a processing liquid and an inert gas to a lower surface of the substrate held by the substrate holding member; and a controller that controls to perform a liquid processing by supplying the processing liquid to the lower surface of the substrate while rotating the substrate, and, after the liquid processing, to perform a drying processing of the substrate while supplying the inert gas to the lower surface of the substrate.
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