公开(公告)号：US20170025268A1

公开(公告)日：2017-01-26

申请号：US15209136

申请日：2016-07-13

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: H01L21/02

CPC classification number: G03F7/423 ,  H01L21/67028 ,  H01L21/67086 ,  H01L21/67253

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a processing liquid is stored; a chemical liquid component supply unit that supplies chemical liquid components; a concentration detecting unit that detects a concentration of the chemical liquid components; and a controller configured to perform a first control as a feedback control that replenishes the processing liquid with the chemical liquid components such that the concentration of the chemical liquid components contained in the processing liquid within the processing bath does not become less than a predetermined allowable lower limit, based on the concentration of the chemical liquid components detected by the concentration detecting unit. In addition, the controller performs a second control that replenishes the processing liquid with the chemical liquid components in a predetermined amount required to offset a reduction in concentration of the chemical liquid components caused by the introduction of the substrate.

Abstract translation: 公开了一种基板液体处理设备，包括：处理液，其中存储有处理液体; 提供化学液体组分的化学液体组分供应单元; 浓度检测单元，其检测所述药液成分的浓度; 以及控制器，被配置为执行作为反馈控制的第一控制，所述反馈控制用所述化学液体成分补充所述处理液体，使得包含在所述处理液中的所述处理液体中的所述化学液体成分的浓度不会变得小于预定的允许下限 基于由浓度检测单元检测到的化学液体成分的浓度。 此外，控制器进行第二控制，其中补充处理液的化学液体成分以预定量来补偿由引入基材引起的化学液体成分的浓度的降低。

公开(公告)号：US10458010B2

公开(公告)日：2019-10-29

申请号：US15216868

申请日：2016-07-22

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: C23C2/04 ,  H01L21/67 ,  G03F7/42

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a mixture of sulfuric acid and hydrogen peroxide is stored, and a substrate is immersed in the stored mixture such that a processing is performed on the substrate; an outer bath configured to receive the mixture flowing out from the processing bath; a circulation line configured to return the mixture in the outer bath to the processing bath; a sulfuric acid supply unit configured to supply sulfuric acid to the mixture; a first hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture in the outer bath; and a second hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture flowing through a downstream portion of the circulation line.

公开(公告)号：US10928732B2

公开(公告)日：2021-02-23

申请号：US15209136

申请日：2016-07-13

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: G03F7/42 ,  H01L21/67

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a processing liquid is stored; a chemical liquid component supply unit that supplies chemical liquid components; a concentration detecting unit that detects a concentration of the chemical liquid components; and a controller configured to perform a first control as a feedback control that replenishes the processing liquid with the chemical liquid components such that the concentration of the chemical liquid components contained in the processing liquid within the processing bath does not become less than a predetermined allowable lower limit, based on the concentration of the chemical liquid components detected by the concentration detecting unit. In addition, the controller performs a second control that replenishes the processing liquid with the chemical liquid components in a predetermined amount required to offset a reduction in concentration of the chemical liquid components caused by the introduction of the substrate.

公开(公告)号：US20170037499A1

公开(公告)日：2017-02-09

申请号：US15216868

申请日：2016-07-22

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: C23C2/04

CPC classification number: C23C2/04 ,  G03F7/423 ,  H01L21/67086

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a mixture of sulfuric acid and hydrogen peroxide is stored, and a substrate is immersed in the stored mixture such that a processing is performed on the substrate; an outer bath configured to receive the mixture flowing out from the processing bath; a circulation line configured to return the mixture in the outer bath to the processing bath; a sulfuric acid supply unit configured to supply sulfuric acid to the mixture; a first hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture in the outer bath; and a second hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture flowing through a downstream portion of the circulation line.

Abstract translation: 公开了一种基板液体处理装置，包括：储存硫酸和过氧化氢的混合物的处理槽，将基板浸渍在所存储的混合物中，使得对基板进行加工; 外浴，其构造成接收从处理槽流出的混合物; 循环管线，其构造成将外浴中的混合物返回到处理槽; 构造成向混合物供给硫酸的硫酸供给单元; 第一过氧化氢供给单元，其构造成向所述外浴中的混合物供给过氧化氢; 以及第二过氧化氢供给单元，其构造成向流经所述循环管路的下游部分的混合物供给过氧化氢。