公开(公告)号：US20150017782A1

公开(公告)日：2015-01-15

申请号：US14325685

申请日：2014-07-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naoki AKIYAMA ,  Masahiko SUGIYAMA ,  Yosuke OMORI ,  Shinji AKAIKE ,  Hideaki TANAKA ,  Masahiro YAMAMOTO

IPC: H01L23/00

CPC classification number: H01L24/741 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/6838 ,  Y10T156/1744

Abstract: A bonding device for bonding substrates together, includes: a first holding unit configured to hold a first substrate on a lower surface thereof; a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface thereof; a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction; a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit; and a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit, at least one of the first image pickup unit and the second image pickup unit including an infrared camera.

Abstract translation: 一种用于将基板接合在一起的接合装置，包括：第一保持单元，其构造成在其下表面上保持第一基板; 第二保持单元，位于第一保持单元的下方，并被配置为在其上表面上保持第二基板; 移动机构，其构造成在第一保持单元或第二保持单元的水平方向和垂直方向上移动; 第一图像拾取单元，位于所述第一保持单元中，并被配置为拾取保持在所述第二保持单元中的所述第二基板的图像; 以及第二图像拾取单元，位于所述第二保持单元中，并且被配置为拾取保持在所述第一保持单元中的所述第一基板的图像，所述第一图像拾取单元和所述第二图像拾取单元中的至少一个包括红外相机。

公开(公告)号：US20140349465A1

公开(公告)日：2014-11-27

申请号：US14281152

申请日：2014-05-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahiro YAMAMOTO ,  Shintaro SUGIHARA ,  Hajime FURUYA

IPC: H01L21/18 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/187 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/68

Abstract: A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.

Abstract translation: 用于使基板与分子间力接合的接合装置包括：第一保持单元，其构造成在其下表面上保持第一基板;第二保持单元，安装在第一保持单元下方，并且构造成在其上表面上保持第二基板; 以及温度调节机构，其被配置为在所述第一基板被保持在所述第一保持单元之前调节所述第一基板的温度，并且将所述第二基板的温度保持在所述第二保持单元中之前的温度达到预定温度。

公开(公告)号：US20240203694A1

公开(公告)日：2024-06-20

申请号：US18067917

申请日：2022-12-19

Applicant: Tokyo Electron Limited

Inventor： Takuji SAKO ,  Kyohei NOGUCHI ,  Masaki HOSONO ,  Masahiro YAMAMOTO ,  Julen AROZAMENA

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  H01J37/32724 ,  H01J37/32357 ,  H01J37/32816 ,  H01J2237/1825 ,  H01J2237/334

Abstract: An etching method of etching silicon formed on a side surface of a recess that exists in a substrate includes: forming an oxide film on a surface of the silicon by performing a radical oxidation processing on the substrate; performing a chemical processing with a gas on the oxide film; and removing a reaction product produced by the chemical processing, wherein the forming the oxide film includes: a first phase of performing a radical processing with a plasma of an oxygen-containing gas; and a second phase of performing a radical processing with a plasma of the oxygen-containing gas and an etching gas, and wherein the forming the oxide film, the performing the chemical processing, and the removing the reaction product are repeated multiple times.