公开(公告)号：US20250022724A1

公开(公告)日：2025-01-16

申请号：US18897344

申请日：2024-09-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masanori TAKAHASHI ,  Shota EZAKI

IPC: H01L21/67 ,  F25B21/04 ,  H01J37/32 ,  H01L21/683

Abstract: A substrate support for use in a substrate processing apparatus includes: a base having an internal space; an electronic circuit board disposed in the internal space; a substrate supporting plate disposed on the base; and at least one temperature adjusting element disposed in the internal space, the at least one temperature adjusting element being configured to adjust a temperature of the electronic circuit board.

公开(公告)号：US20210265143A1

公开(公告)日：2021-08-26

申请号：US17178458

申请日：2021-02-18

Applicant: Tokyo Electron Limited

Inventor： Hiroki ENDO ,  Kazuhito YAMADA ,  Masanori TAKAHASHI

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: A substrate processing apparatus for processing a substrate using plasma includes a chamber in which the substrate is accommodated, and a stage arranged inside the chamber and configured to mount the substrate thereon. The stage includes: a base formed by a conductor and configured to allow RF (Radio Frequency) power to flow through the conductor; a substrate holding part provided on the base and configured to hold the substrate; a plurality of heaters provided in the substrate holding part; a heater control part provided inside the base and configured to control electric power to be supplied to each of the plurality of heaters; and an RF filter provided outside the base and connected to a wiring for supplying the electric power to each of the plurality of heaters. The RF filter is provided in common for the plurality of heaters.

公开(公告)号：US20250157797A1

公开(公告)日：2025-05-15

申请号：US19023579

申请日：2025-01-16

Applicant: Tokyo Electron Limited

Inventor： Katsuyuki KOIZUMI ,  Masanori TAKAHASHI ,  Shota EZAKI

IPC: H01J37/32 ,  F28D7/00

Abstract: A placing table includes a first surface located at an outer side than a substrate; and a second surface on which the substrate is placed. A first path is formed to correspond to the first surface.

公开(公告)号：US20220415628A1

公开(公告)日：2022-12-29

申请号：US17848760

申请日：2022-06-24

Applicant: Tokyo Electron Limited

Inventor： Shota EZAKI ,  Masanori TAKAHASHI ,  Kazuhito YAMADA

IPC: H01J37/32

Abstract: A plasma processing method includes: setting a temperature of a substrate support surface to a first temperature; supplying electric power from an electric power adjuster to a heater; before plasma is generated, when the temperature of the substrate support surface measured by a temperature sensor stabilizes at the first temperature, measuring first electric power supplied to the heater; after the plasma is generated, when the temperature of the substrate support surface measured by the temperature sensor stabilizes at the first temperature, measuring second electric power supplied to the heater; calculating an input heat quantity input from the plasma based on the first electric power and the second electric power; and correcting the first temperature to a second temperature based on the input heat quantity and a thermal resistance between the substrate support and the temperature sensor or between a substrate and the temperature sensor.

公开(公告)号：US20210313202A1

公开(公告)日：2021-10-07

申请号：US17204666

申请日：2021-03-17

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masanori TAKAHASHI ,  Shota EZAKI

IPC: H01L21/67 ,  H01J37/32 ,  F25B21/04

Abstract: A substrate support for use in a substrate processing apparatus includes: a base having an internal space; an electronic circuit board disposed in the internal space; a substrate supporting plate disposed on the base; and at least one temperature adjusting element disposed in the internal space, the at least one temperature adjusting element being configured to adjust a temperature of the electronic circuit board.

公开(公告)号：US20230317474A1

公开(公告)日：2023-10-05

申请号：US18205168

申请日：2023-06-02

Applicant: Tokyo Electron Limited

Inventor： Shota EZAKI ,  Katsuyuki KOIZUMI ,  Masanori TAKAHASHI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01L21/67103 ,  H01L21/68785 ,  H01L21/6833 ,  H01L21/67109

Abstract: A stage includes a base having an accommodation space therein, a dielectric layer provided on a first surface of the base and having a placement surface on which a substrate is placed, the dielectric layer including therein a plurality of heaters, and a heater control board disposed in the accommodation space and configured to drive the plurality of heaters. The base has an inlet in a second surface thereof that is opposite the first surface, the inlet being configured to introduce a coolant into the accommodation space.

公开(公告)号：US20190051501A1

公开(公告)日：2019-02-14

申请号：US16057548

申请日：2018-08-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Katsuyuki KOIZUMI ,  Masanori TAKAHASHI

IPC: H01J37/32 ,  H01L21/67

Abstract: Disclosed is a plasma processing apparatus including: a first member including a recessed portion in a range corresponding to a placing surface on a back surface side with respect to the placing surface on which a plasma processing target workpiece is placed; a sheet member formed in a sheet shape, including a heater and a lead wiring that supplies power to the heater, and disposed in the recessed portion such that the heater is positioned in a region corresponding to a placing surface inside the recessed portion and the lead wiring is positioned on a side surface of the recessed portion, and a second member fitted into the recessed portion in which the sheet member is disposed.

公开(公告)号：US20150170891A1

公开(公告)日：2015-06-18

申请号：US14567133

申请日：2014-12-11

Applicant: Tokyo Electron Limited

Inventor： Masanori TAKAHASHI ,  Tsuyoshi HIDA ,  Noboru TAKEMOTO ,  Hideaki YAKUSHIJI ,  Lin ChiaHung ,  Akitoshi HARADA

IPC: H01J37/34

CPC classification number: H01J37/32834 ,  H01J37/32844 ,  H01J37/32871 ,  Y02C20/30 ,  Y02P70/605

Abstract: A particle backflow preventing part, which is disposed inside of an evacuation pipe connecting a process chamber and an evacuation device, includes a first plate part, and a second plate part that has an opening and is spaced from the first plate part by a first gap and positioned closer to the evacuation device than the first plate part. The opening is covered by the first plate part in plan view.

Abstract translation: 设置在连接处理室和排气装置的抽气管内部的颗粒回流防止部分包括第一板部分和第二板部分，该第一板部分和第二板部分具有开口并且与第一板部分间隔开第一间隙 并且比第一板部更靠近排气装置。 开口在平面图中被第一板部分覆盖。

公开(公告)号：US20250087470A1

公开(公告)日：2025-03-13

申请号：US18957942

申请日：2024-11-25

Applicant: Tokyo Electron Limited

Inventor： Takari YAMAMOTO ,  Kazuhito YAMADA ,  Masanori TAKAHASHI ,  Shinya ISHIKAWA ,  Shota EZAKI

IPC: H01J37/32

Abstract: A substrate processing apparatus includes: a chamber having a processing space; a base arranged inside the processing space and having an internal space; an electrostatic chuck arranged on the base and including a dielectric member having a support surface, at least one heater electrode layer arranged inside the dielectric member and formed of a first material, and at least one resistive layer arranged inside the dielectric member and formed of a second material, wherein a resistance temperature coefficient of the second material is equal to or greater than that of the first material; a control circuit arranged inside the internal space and configured to control power to be applied to the at least one heater electrode layer; and a detection circuit arranged inside the internal space and configured to detect a voltage applied to the at least one resistive layer.

公开(公告)号：US20210057237A1

公开(公告)日：2021-02-25

申请号：US16998264

申请日：2020-08-20

Applicant: Tokyo Electron Limited

Inventor： Shota EZAKI ,  Katsuyuki KOIZUMI ,  Masanori TAKAHASHI

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A stage includes a base having an accommodation space therein, a dielectric layer provided on a first surface of the base and having a placement surface on which a substrate is placed, the dielectric layer including therein a plurality of heaters, and a heater control board disposed in the accommodation space and configured to drive the plurality of heaters. The base has an inlet in a second surface thereof that is opposite the first surface, the inlet being configured to introduce a coolant into the accommodation space.