公开(公告)号：US20230056038A1

公开(公告)日：2023-02-23

申请号：US17889520

申请日：2022-08-17

Applicant: Tokyo Electron Limited

Inventor： Kousei IDE ,  Naruaki IIDA ,  Kazuya MATSUSHITA

IPC: H01L21/677 ,  H01L21/67

Abstract: A substrate processing apparatus includes: a loading/unloading block; a processing station provided on one of left and right sides of the loading/unloading block; a relay block provided on one of left and right sides of the processing station; processing blocks provided side by side in a left-right direction to form the processing station, each of the processing blocks including a processing module configured to perform a process on the substrate and a main transfer mechanism configured to deliver the substrate to the processing module; and bypass transfer mechanisms provided separately from the main transfer mechanism and provided respectively for the processing blocks arranged side by side in the left-right direction to transfer the substrate between left and right blocks, wherein bypass transfer paths for the substrate transferred by the plurality of bypass transfer mechanisms have heights different from each other, and partially overlap each other in a plan view.

公开(公告)号：US20230347369A1

公开(公告)日：2023-11-02

申请号：US18218457

申请日：2023-07-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hideki KAJIWARA ,  Yuya YONEMITSU ,  Shinichiro YAMANAKA ,  Shinichi MIZUSHINO ,  Naruaki IIDA ,  Kohei KAWAKAMI ,  Tohru AZUMA

IPC: B05B12/04 ,  B05B7/00

CPC classification number: B05B12/04 ,  B05B7/00

Abstract: An apparatus includes substrate holders each configured to hold a substrate, a first nozzle provided for each substrate holder and for discharging a first processing liquid to the substrate at a first position, a second nozzle provided to be shared by the substrate holders and for discharging a second processing liquid to the substrate at a second position, a third nozzle provided for each substrate holder and for discharging a third processing liquid to the substrate at a third position while the first and second processing liquids are not supplied to the substrate, first to third standby parts for respectively allowing the first to third nozzles to wait outside a substrate holding region, a turning mechanism for turning the first nozzle between the first standby part and the first position, and a linear motion mechanism for linearly moving the third nozzle between the third standby part and the third position.

公开(公告)号：US20160358829A1

公开(公告)日：2016-12-08

申请号：US15171240

申请日：2016-06-02

Applicant: Tokyo Electron Limited

Inventor： Masato HAYASHI ,  Kohei NOGUCHI ,  Kenji IIZUKA ,  Naruaki IIDA

IPC: H01L21/66 ,  G03F7/16 ,  B08B3/08 ,  B08B9/032 ,  H01L21/67 ,  G01N21/85

CPC classification number: H01L22/10 ,  G01N21/85 ,  G01N2021/8578 ,  G03F7/16 ,  G03F7/162 ,  H01L21/0273 ,  H01L21/67253

Abstract: An apparatus includes: measurement flow passage portions as part of a respective plurality of supply paths of fluids to be supplied to a substrate, the measurement flow passage portions constituting measurement regions for measurement of foreign matter in the fluids, and being disposed so as to form a row with each other; a light irradiating unit configured to form an optical path in one of the flow passage portions, the light irradiating unit being shared by the plurality of flow passage portions; a moving mechanism configured to move the light irradiating unit relatively along a direction of arrangement of the flow passage portions to form the optical path within the flow passage portion selected among the plurality of flow passage portions; a light receiving unit including a light receiving element, the light receiving element receiving light transmitted by the flow passage portion; and a detecting unit configured to detect foreign matter in the fluid on a basis of a signal output from the light receiving element. Consequently, the number of necessary light irradiating units can be reduced, and the apparatus can be miniaturized.

Abstract translation: 一种装置，包括：作为供给到基板的流体的多个供给路径的一部分的测定流路部，构成测定流体中异物的测定区域的测量流路部， 相互排列; 光照射单元，被配置为在所述流路部分之一中形成光路，所述光照射单元由所述多个流路部分共享; 移动机构，其构造成沿着所述流路部的配置方向相对移动所述光照射单元，以在所述多个流路部中选择的流路部内形成光路; 光接收单元，其包括受光元件，所述光接收元件接收由所述流路部分透射的光; 以及检测单元，被配置为基于从所述光接收元件输出的信号来检测所述流体中的异物。 因此，可以减少必要的光照射单元的数量，并且可以使该装置小型化。

公开(公告)号：US20240249968A1

公开(公告)日：2024-07-25

申请号：US18626565

申请日：2024-04-04

Applicant: Tokyo Electron Limited

Inventor： Kousei IDE ,  Naruaki IIDA

IPC: H01L21/687 ,  B65G47/90 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/68707 ,  B65G47/90 ,  H01L21/67178 ,  H01L21/67712

Abstract: A substrate transfer device includes: a substrate holder configured to transfer a substrate to one of a plurality of processing modules that process the substrate; a base provided to be connected to the substrate holder; and a lift configured to move up and down the base. The lift includes: a plurality of rails and a plurality of seal belts arranged side by side in a left-right direction and extending in a longitudinal direction, a driver shared by the rails and configured to move up and down the base along an extending direction of each of the rails, a slider configured to move up and down while being supported by the lift and physically connected to the plurality of rails, and a connecting member. A portion of each seal belts is opened, and the slider and the base are connected to each other via the connecting member provided in the opening.

公开(公告)号：US20150235888A1

公开(公告)日：2015-08-20

申请号：US14625201

申请日：2015-02-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naruaki IIDA ,  Katsuhiro MORIKAWA

IPC: H01L21/68 ,  H01L21/687 ,  G05B19/418 ,  H01L21/677

CPC classification number: G05B19/4189 ,  G05B2219/45031 ,  H01L21/67766 ,  H01L21/681 ,  H01L21/68707 ,  Y02P90/28

Abstract: A substrate processing apparatus includes: first and second places in which a substrate can be placed; a substrate transfer device having a substrate holder that holds the substrate to transfer the substrate between the first and second places; and a substrate position measuring unit that detects a position of the substrate held by the substrate holder. The substrate position measuring unit, disposed independently of the substrate transfer device, is arranged at a position where the substrate held by the substrate holder of the substrate transfer device can be placed.

Abstract translation: 基板处理装置包括：可以放置基板的第一和第二位置; 衬底传送装置，具有保持所述衬底以在所述第一和第二位置之间传送所述衬底的衬底保持器; 以及基板位置测量单元，其检测由所述基板保持器保持的所述基板的位置。 基板位置测量单元独立于基板传送装置设置在可以放置基板传送装置的基板保持器的基板的位置。

公开(公告)号：US20140234991A1

公开(公告)日：2014-08-21

申请号：US14248765

申请日：2014-04-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichi DOUKI ,  Tokutarou HAYASHI ,  Naruaki IIDA ,  Suguru ENOKIDA

IPC: H01L21/68 ,  H01L21/66

CPC classification number: H01L21/68 ,  H01L21/6715 ,  H01L21/67748 ,  H01L21/681 ,  H01L21/68707 ,  H01L22/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.

Abstract translation: 一种能够在不使用任何定位夹具的情况下定位基板支架的基板支架定位方法，包括：测量保持在基板承载机构中的基板保持器上的基板的第一位置; 将保持在所述基板保持器上的所述基板承载到用于保持和旋转所述基板的基板旋转单元; 通过基板旋转单元将由基板旋转单元保持的基板转动预定角度; 将由基板旋转单元转动的基板从基板旋转单元传送到基板保持器; 测量从所述基板旋转单元转移到所述基板保持器的所述基板的第二位置; 基于第一位置和第二位置确定基板旋转单元的旋转中心的位置; 并且基于旋转中心的位置来定位衬底保持器。

公开(公告)号：US20130078061A1

公开(公告)日：2013-03-28

申请号：US13623189

申请日：2012-09-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru ENOKIDA ,  Masahiro NAKAHARADA ,  Hidekazu KIYAMA ,  Naruaki IIDA ,  Akira MIYATA

IPC: H01L21/677

CPC classification number: H01L21/67766 ,  H01L21/67155 ,  H01L21/67178 ,  H01L21/67769 ,  H01L21/68707

Abstract: A substrate treatment system comprise a treatment station having a plurality of treatment units provided at multiple tiers in an up-down direction, a cassette mounting table on which a cassette housing a plurality of wafers W is mounted, and a wafer transfer mechanism arranged between the treatment station and the cassette mounting table, wherein a delivery block in which a plurality of delivery units are provided at multiple tiers is provided between the treatment station and the wafer transfer mechanism, the delivery units temporarily housing a wafer to be transferred between the cassette mounting table and the treatment station and a wafer to be transferred between the tiers of the treatment units. The wafer transfer mechanism includes a first transfer arm that transfers a wafer between the cassette mounting table and the delivery block, and a second transfer arm that transfers a wafer between the tiers of the delivery units.

Abstract translation: 基板处理系统包括处理台，该处理台具有设置在上下方向的多层的多个处理单元，安装有多个晶片W的盒子的盒安装台，以及布置在 处理台和盒安装台，其中在处理站和晶片传送机构之间设置有多个传送单元设置在多层的传送块，传送单元暂时容纳要在盒安装件 桌子和治疗台以及待处理单元层之间转移的晶片。 晶片传送机构包括在盒安装台和传送块之间传送晶片的第一传送臂和在传送单元的各层之间传送晶片的第二传送臂。

公开(公告)号：US20230298927A1

公开(公告)日：2023-09-21

申请号：US18201270

申请日：2023-05-24

Applicant: Tokyo Electron Limited

Inventor： Kousei IDE ,  Naruaki IIDA

IPC: H01L21/687 ,  B65G47/90 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01L21/68707 ,  B65G47/90 ,  H01L21/67712 ,  H01L21/67178

Abstract: A substrate transfer mechanism includes: an arm base main body provided with a first driver; a lift configured to move up and down the arm base main body; a first arm extending transversely from a lower side of the arm base main body, and having a tip end that pivots around a vertical axis with respect to the arm base main body by the first driver; a second arm extending transversely from an upper side of the tip end of the first arm, and having a tip end that pivots around a vertical axis with respect to the first arm along with the pivoting of the first arm; and a substrate holder provided on an upper side of the tip end of the second arm, and configured to rotate around a vertical axis with respect to the second arm.

公开(公告)号：US20220270912A1

公开(公告)日：2022-08-25

申请号：US17679352

申请日：2022-02-24

Applicant: Tokyo Electron Limited

Inventor： Kousei IDE ,  Naruaki IIDA

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  B65G47/90

Abstract: A substrate transfer mechanism for transferring a substrate to each of a plurality of stacked processing modules that process the substrate includes: an arm base provided with a first driver; a lift configured to move up and down the arm base; a first arm extending transversely from a lower side of the arm base, and having a tip end that pivots around a vertical axis with respect to the arm base by the first driver; a second arm extending transversely from an upper side of the tip end of the first arm, and having a tip end that pivots around a vertical axis with respect to the first arm along with the pivoting of the first arm; and a substrate holder provided on an upper side of the tip end of the second arm, and configured to rotate around a vertical axis with respect to the second arm.

公开(公告)号：US20200041913A1

公开(公告)日：2020-02-06

申请号：US16521052

申请日：2019-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihisa KOGA ,  Yoshitaka KONISHI ,  Naruaki IIDA ,  Yuzo OHISHI ,  Kazuhiro TAKESHITA

IPC: G03F7/20 ,  H01L21/027

Abstract: There is provided a substrate processing apparatus including: a light radiator configured to radiate a light for processing into an irradiation area which is smaller than a processing target area of a surface of a substrate; a driver configured to move the irradiation area in two directions that cross each other in a plane along the surface of the substrate; and a controller configured to control the driver to move an irradiation position in two directions according to a movement pattern which has been set to radiate the light to an entire area of the processing target area.