公开(公告)号：US10274843B2

公开(公告)日：2019-04-30

申请号：US15815925

申请日：2017-11-17

Applicant: Tokyo Electron Limited

Inventor： Seiji Nagahara ,  Masaru Tomono ,  Nobutaka Fukunaga ,  Gousuke Shiraishi ,  Yukie Minekawa

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/677

Abstract: An exposure apparatus includes: a stage on which a substrate is placed; a plurality of light irradiation units configured to emit light independently of each other, so as to form a strip-like irradiation area; a rotation mechanism configured to rotate the substrate relative to the irradiation area; a stage moving mechanism configured to move the stage relative to the irradiation area in a back and forth direction; and a control unit configured to make the exposure apparatus perform a first step that rotates the substrate relative to the irradiation area having a first illuminance distribution such that the whole surface of the substrate is exposed, and a second step that moves the substrate in the back and forth direction relative to the irradiation area having a second illuminance distribution while rotation of the substrate is being stopped, such that the whole surface of the substrate is exposed.

公开(公告)号：US12290898B2

公开(公告)日：2025-05-06

申请号：US17776639

申请日：2020-11-02

Applicant: Tokyo Electron Limited

Inventor： Nobutaka Fukunaga ,  Tomohiro Kaneko ,  Takeshi Matsumoto

IPC: B24B7/04 ,  B24B49/05 ,  H01L21/304

Abstract: A substrate processing method of grinding a first substrate in a combined substrate in which the first substrate and a second substrate are bonded to each other includes measuring a total thickness distribution of the combined substrate; measuring a thickness distribution of the first substrate; calculating a thickness distribution of the second substrate by subtracting the thickness distribution of the first substrate from the total thickness distribution of the combined substrate; deciding a relative inclination between a substrate holder configured to hold the combined substrate and a grinder configured to grind the combined substrate, based on the thickness distribution of the second substrate; and grinding the first substrate while holding the combined substrate at the inclination which is decided.

公开(公告)号：US10527948B2

公开(公告)日：2020-01-07

申请号：US15828870

申请日：2017-12-01

Applicant: Tokyo Electron Limited

Inventor： Seiji Nagahara ,  Masaru Tomono ,  Nobutaka Fukunaga ,  Gousuke Shiraishi

IPC: G03F7/20 ,  H01L21/027

Abstract: An illuminance distribution response amount as the change amount of the illuminance distribution pattern, associating the position in the irradiation region in the lengthwise direction with the change amount of the illuminance with respect to the change in the drive current, has previously been acquired and stored in a storage unit for each light-emitting block. There is provided an arithmetic processing unit that determines (estimates) a current command value of each of the light-emitting blocks based on a present current command value of each of the light-emitting blocks and the change amount of the illuminance distribution pattern of each light-emitting block in order to bring a present illuminance distribution pattern in the irradiation region in a lengthwise direction close to a target illuminance distribution pattern.

公开(公告)号：US12194594B2

公开(公告)日：2025-01-14

申请号：US17776642

申请日：2020-11-02

Applicant: Tokyo Electron Limited

Inventor： Nobutaka Fukunaga ,  Takeshi Matsumoto ,  Tomohiro Kaneko

IPC: B24B49/05 ,  H01L21/304 ,  H01L21/66

Abstract: A substrate processing method includes measuring a first thickness distribution of a first substrate in a first one of multiple combined substrates before being subjected to a finishing grinding; measuring a second thickness distribution of the first substrate in a second one of the multiple combined substrates before being subjected to the finishing grinding; deciding a relative inclination between a substrate holder configured to hold the second one of the multiple combined substrates and a grinder configured to perform the finishing grinding on the corresponding combined substrate, based on first difference data between the first thickness distribution and the second thickness distribution; and performing finishing grinding on the first substrate in the second one of the multiple combined substrates while holding the second one of the multiple combined substrates at the inclination which is decided.

公开(公告)号：US20180173103A1

公开(公告)日：2018-06-21

申请号：US15828870

申请日：2017-12-01

Applicant: Tokyo Electron Limited

Inventor： Seiji NAGAHARA ,  Masaru Tomono ,  Nobutaka Fukunaga ,  Gousuke Shiraishi

IPC: G03F7/20 ,  H01L21/027

CPC classification number: G03F7/7055 ,  G03F7/16 ,  G03F7/201 ,  G03F7/2022 ,  G03F7/30 ,  G03F7/7005 ,  G03F7/70133 ,  G03F7/70558 ,  H01L21/027 ,  H01L21/67115 ,  H01L21/6715

Abstract: An illuminance distribution response amount as the change amount of the illuminance distribution pattern, associating the position in the irradiation region in the lengthwise direction with the change amount of the illuminance with respect to the change in the drive current, has previously been acquired and stored in a storage unit for each light-emitting block. There is provided an arithmetic processing unit that determines (estimates) a current command value of each of the light-emitting blocks based on a present current command value of each of the light-emitting blocks and the change amount of the illuminance distribution pattern of each light-emitting block in order to bring a present illuminance distribution pattern in the irradiation region in a lengthwise direction close to a target illuminance distribution pattern.