公开(公告)号：US11380527B2

公开(公告)日：2022-07-05

申请号：US17036558

申请日：2020-09-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryo Sasaki

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

Abstract: A plasma processing apparatus includes a substrate support having a substrate supporting portion on which a substrate is placed and a peripheral portion surrounding the substrate supporting portion, a conductive focus ring placed on the peripheral portion of the substrate support, a cover ring surrounding an outer periphery of the substrate support and formed of a dielectric material, a conductive ring placed on the cover ring, and a radio frequency power supply electrically coupled to the substrate support. A first surface on an outer peripheral portion of the focus ring and a second surface on an inner peripheral portion of the conductive ring are spaced apart from each other while facing each other. Further, the cover ring has a spacing portion that separates the focus ring from the conductive ring.

公开(公告)号：US10304666B2

公开(公告)日：2019-05-28

申请号：US15212400

申请日：2016-07-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryo Sasaki ,  Yusei Kuwabara

IPC: H01J37/32 ,  C23C16/50 ,  C23C16/455

Abstract: A plasma processing apparatus includes: a chamber; a placing table; an exhaust path provided around the placing table to surround the placing table, and configured to exhaust a gas within a processing space above the semiconductor wafer placed on the placing table; an exhaust device configured to exhaust the gas within the processing space through the exhaust path; a baffle plate having a plurality of through holes and provided between the processing space and the exhaust path to surround the placing table; and a rectifying plate provided around the placing table to surround the placing table within the exhaust path at a position farther from the processing space than the baffle plate, and forming an opening within the exhaust path to make a sectional area of a flow path within the exhaust path larger at a position farther from a position within the exhaust path connected to the exhaust device.

公开(公告)号：US12062527B2

公开(公告)日：2024-08-13

申请号：US17114722

申请日：2020-12-08

Applicant: Tokyo Electron Limited

Inventor： Jun Young Chung ,  Ryo Sasaki

IPC: H01L21/00 ,  H01J37/32

CPC classification number: H01J37/32834 ,  H01J37/32633 ,  H01J37/32082 ,  H01J2237/334

Abstract: A baffle unit includes an inner ring, an outer ring disposed outside the inner ring, and a connecting portion connecting the inner ring with the outer ring. The connecting portion includes multiple openings arranged in a radial direction of the baffle unit and in a circumferential direction of the baffle unit, each of the multiple openings being arcuate and extending in the circumferential direction; multiple rigid portions each being disposed between the adjacent openings of the multiple openings that are adjacent to each other on a same concentric circle of the baffle unit; and multiple walls each being formed between the adjacent openings of the multiple openings that are adjacent to each other in the radial direction. Each of the multiple walls connects a rigid portion of the multiple rigid portions with another rigid portion of the multiple rigid portions.

公开(公告)号：US11721531B2

公开(公告)日：2023-08-08

申请号：US17826483

申请日：2022-05-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryo Sasaki

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32642 ,  H01J37/32183 ,  H01L21/6833

Abstract: A plasma processing apparatus includes a substrate support having a substrate supporting portion on which a substrate is placed and a peripheral portion surrounding the substrate supporting portion, a conductive focus ring placed on the peripheral portion of the substrate support, a cover ring surrounding an outer periphery of the substrate support and formed of a dielectric material, a conductive ring placed on the cover ring, and a radio frequency power supply electrically coupled to the substrate support. A first surface on an outer peripheral portion of the focus ring and a second surface on an inner peripheral portion of the conductive ring are spaced apart from each other while facing each other. Further, the cover ring has a spacing portion that separates the focus ring from the conductive ring.