公开(公告)号：US20170154799A1

公开(公告)日：2017-06-01

申请号：US15428896

申请日：2017-02-09

Applicant: Tokyo Electron Limited

Inventor： Shinji WAKABAYASHI ,  Keisuke KONDOH ,  Sensho KOBAYASHI

IPC: H01L21/677

CPC classification number: H01L21/67772 ,  B65G2201/0297 ,  H01L21/67769

Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

公开(公告)号：US20150340259A1

公开(公告)日：2015-11-26

申请号：US14646706

申请日：2013-11-12

Applicant: Tokyo Electron Limited

Inventor： Shinji WAKABAYASHI

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67376 ,  H01L21/67373 ,  H01L21/67393 ,  H01L21/6773 ,  H01L21/67772

Abstract: Provided is a substrate processing apparatus that can suppress the amount of inert gas and dry gas used and also can prevent reductions in throughput. A substrate processing apparatus is provided with: a loader module; an opener that removes a cover from a FOUP having a main body, an opening and the cover, to communicate the inside of the FOUP with the inside of the loader module through the opening; an N2 gas supply unit that is attached to the loader module and supplies N2 gas to the inside of the FOUP; and two slide cover plates movable respectively along an opening surface of the opening. The slide cover plates move toward each other until the gap therebetween is 1 mm to 3 mm to shield the opening of the FOUP that is attached to the loader module from the inside of the loader module.

Abstract translation: 提供一种能够抑制惰性气体和干燥气体的使用量的基板处理装置，能够防止生产量的降低。 基板处理装置具有：加载模块; 从具有主体，开口和盖子的FOUP移除盖的开启器，通过开口将FOUP的内部与装载机模块的内部连通; N 2气体供给单元，其附接到所述装载机模块并将N 2气体供给到所述FOUP的内部; 以及分别沿着开口的开口表面移动的两个滑动盖板。 滑动盖板朝向彼此移动，直到它们之间的间隙为1mm至3mm，以从装载机模块的内部屏蔽附接到装载机模块的FOUP的开口。

公开(公告)号：US20210305081A1

公开(公告)日：2021-09-30

申请号：US17211347

申请日：2021-03-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Shinji WAKABAYASHI

IPC: H01L21/683 ,  H01L21/67

Abstract: A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.

公开(公告)号：US20190152722A1

公开(公告)日：2019-05-23

申请号：US16252978

申请日：2019-01-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shinji WAKABAYASHI ,  Keisuke KONDOH

IPC: B65G49/07 ,  H01L21/677 ,  H01L21/67

Abstract: Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.

公开(公告)号：US20150221537A1

公开(公告)日：2015-08-06

申请号：US14608843

申请日：2015-01-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shinji WAKABAYASHI

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67769

Abstract: A container interchanging method is provided. The container interchanging method provides that a first container accommodating a processed substrate therein and a second container accommodating an unprocessed substrate therein are interchanged in a container connection mechanism of a substrate transfer chamber. The substrate transfer chamber includes the container connection mechanism to which the container accommodating the substrate is connected. The substrate transfer chamber is configured to unload the substrate from the container connected to the container connection mechanism. The substrate transfer chamber further includes a buffer configured to mount the container. When the first container and the second container are interchanged in the container connection mechanism, any one of the first container and the second container is temporarily stored in the buffer.

Abstract translation: 提供了一种容器互换方法。 容器互换方法将容纳处理过的基板的第一容器和容纳未处理基板的第二容器互换在基板传送室的容器连接机构中。 基板传送室包括容纳基板的容器连接到的容器连接机构。 衬底传送室被配置为从连接到容器连接机构的容器卸载衬底。 衬底传送室还包括构造成安装容器的缓冲器。 当第一容器和第二容器在容器连接机构中互换时，第一容器和第二容器中的任何一个暂时存储在缓冲器中。

公开(公告)号：US20170025290A1

公开(公告)日：2017-01-26

申请号：US15216161

申请日：2016-07-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shinji WAKABAYASHI

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67373 ,  H01L21/67772

Abstract: A load lock apparatus having a load lock chamber, which is connected to a vacuum transfer chamber configured to transfer a substrate under a vacuum pressure state via a communication hole which is opened and closed by a gate valve, and configured to be capable of switching an inner pressure into an atmospheric pressure state and the vacuum pressure state, is provided. The load lock apparatus includes a load lock chamber main body in which a substrate container having an attachable/detachable cover is carried, wherein the communication hole is formed in a side surface of the load lock chamber; and a cover attaching/detaching mechanism installed at a height position vertically arranged with the communication hole in the load lock chamber; and an elevating mechanism including a mounting table on which the substrate container is loaded and configured to lift and lower the mounting table.

Abstract translation: 一种具有负载锁定室的装载锁定装置，其连接到真空传送室，所述真空传送室被构造成通过由闸阀打开和关闭的连通孔在真空压力状态下传送基板，并且被配置为能够切换 提供内压到大气压状态和真空压力状态。 装载锁定装置包括装载锁定室主体，其中承载有具有可拆卸盖的基板容器，其中连通孔形成在装载锁定室的侧表面中; 以及安装在与所述连接孔垂直设置在所述加载锁定室中的高度位置处的盖安装/拆卸机构; 以及升降机构，其包括安装台，载置基板容器并构造为升降所述安装台。

公开(公告)号：US20160240412A1

公开(公告)日：2016-08-18

申请号：US15018277

申请日：2016-02-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshiaki KODAMA ,  Shinji WAKABAYASHI

IPC: H01L21/67 ,  H01L21/68 ,  G01V8/20 ,  H01L21/677

Abstract: There is provided a substrate detection apparatus of detecting whether or not a substrate is normally supported by a support part at a predetermined position, in a transfer device including the support part configured to support a plurality of disc-like substrates in multi-stage processing at vertical intervals. The substrate detection apparatus includes: a plurality of optical sensors, each of the plurality of optical sensors including a light transmitting part configured to irradiate a light and a light receiving part configured to receive the light from the light transmitting part, wherein at least one pair of the plurality of optical sensors are disposed such that the light from the light transmitting part is sequentially blocked at each of the plurality of disc-like substrates, during the plurality of disc-like substrates is collectively transferred while being normally supported by the support part at the predetermined positions.

Abstract translation: 提供了一种基板检测装置，在包括支撑部分的传送装置中，检测基板是否正常地被支撑部分支撑在预定位置，所述传送装置被构造成在多级处理中支撑多个盘状基板 垂直间隔。 基板检测装置包括：多个光学传感器，所述多个光学传感器中的每一个包括被配置为照射光的光传输部和被配置为从所述光透射部接收光的受光部，其中，至少一对 所述多个光学传感器被布置成使得来自所述光透射部分的光在所述多个盘状基板的每一个处顺序地被阻挡，在所述多个盘状基板被共同转印的同时被所述支撑部分 在预定位置。

公开(公告)号：US20150098790A1

公开(公告)日：2015-04-09

申请号：US14507011

申请日：2014-10-06

Applicant: Tokyo Electron Limited

Inventor： Shinji WAKABAYASHI

IPC: H01L21/677 ,  B25J11/00

CPC classification number: B25J11/0095 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67748

Abstract: A substrate transfer method is performed by a transfer unit including a first transfer arm and a second transfer arm which are separately movable and are overlapped with each other. A moving speed of each of the first transfer arm and the second transfer arm that is not transferring a substrate is set to be higher than a moving speed of each of the first transfer arm and the second transfer arm that is transferring a substrate.

Abstract translation: 基板转印方法由包括第一转印臂和第二转印臂的转印单元执行，该转印单元可分开移动并彼此重叠。 将不传送基板的第一传送臂和第二传送臂中的每一个的移动速度设定为高于正在传送基板的第一传送臂和第二传送臂中的每一个的移动速度。

公开(公告)号：US20180033663A1

公开(公告)日：2018-02-01

申请号：US15550870

申请日：2015-12-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shinji WAKABAYASHI ,  Keisuke KONDOH

IPC: H01L21/677

CPC classification number: H01L21/67733 ,  H01L21/6773 ,  H01L21/67736 ,  H01L21/67772 ,  H01L21/67775

Abstract: A carrier transport device capable of delivering a carrier to and from an external transport device which transports the carrier is provided. The carrier transport device includes a housing on which the carrier is mountable, first ports provided in the housing and configured to deliver the carrier to and from the external transport device, second ports provided in the housing and provided with a lid opening/closing mechanism, and a transfer machine provided in the housing and configured to transfer the carrier. The first ports, the transfer machine and the second ports are disposed under a transport path of the external transport device. The first ports and the second ports are disposed on both sides of the transfer machine. The second ports are configured at multiple stages.

公开(公告)号：US20150098788A1

公开(公告)日：2015-04-09

申请号：US14507724

申请日：2014-10-06

Applicant: Tokyo Electron Limited

Inventor： Shinji WAKABAYASHI ,  Keisuke KONDOH ,  Sensho KOBAYASHI

IPC: B65G65/00

CPC classification number: H01L21/67772 ,  B65G2201/0297 ,  H01L21/67769

Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

Abstract translation: 用于从容器卸载基板的基板传送室包括壳体形状的主体和容器连接到的多个容器连接机构。 在主体中，一些容器连接机构在主体的高度方向上相互排列。