公开(公告)号：US20240012329A1

公开(公告)日：2024-01-11

申请号：US18346287

申请日：2023-07-03

Applicant: Tokyo Electron Limited

Inventor： Junghyun KIM ,  Koshi MUTA ,  Daiki TAKAHASHI ,  Kohei KAWAKAMI ,  Satoshi SHIMMURA ,  Kenta SHIBASAKI ,  Shota UEYAMA ,  Tetsushi MIYAMOTO

IPC: G03F7/16

CPC classification number: G03F7/162

Abstract: A liquid processing apparatus that applies a coating liquid onto a substrate, includes: a substrate holder that holds and rotates the substrate; a coating liquid supplier that applies the coating liquid to the substrate; a cup provided to surround the substrate; and a solvent supplier that supplies a solvent for the coating liquid to a coating liquid collector. The cup includes: an outer cup arranged outside the substrate holder; an inner cup arranged on an inner peripheral side of the outer cup below the substrate holder and having a downwardly-extending wall; an exhaust path provided between the outer and inner cups; a cylindrical wall portion provided below the inner cup and having an upwardly-opened exhaust port communicating with the exhaust path; and the coating liquid collector arranged below the wall of the inner cup with a gap between the coating liquid collector and a lower end of the wall.

公开(公告)号：US20230418166A1

公开(公告)日：2023-12-28

申请号：US18213785

申请日：2023-06-23

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Shota UEYAMA ,  Akihiro TERAMOTO ,  Yuta NISHIYAMA ,  Shinichi HATAKEYAMA

IPC: G03F7/00 ,  B08B13/00 ,  G01F9/00 ,  G03F7/16 ,  G01G21/22 ,  B08B3/02

CPC classification number: G03F7/70491 ,  B08B13/00 ,  G01F9/003 ,  G03F7/16 ,  G01G21/22 ,  B08B3/02

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US20240009697A1

公开(公告)日：2024-01-11

申请号：US18346293

申请日：2023-07-03

Applicant: Tokyo Electron Limited

Inventor： Junghyun KIM ,  Koshi MUTA ,  Daiki TAKAHASHI ,  Kohei KAWAKAMI ,  Satoshi SHIMMURA ,  Kenta SHIBASAKI ,  Shota UEYAMA ,  Tetsushi MIYAMOTO

IPC: B05C11/08

CPC classification number: B05C11/08 ,  H01L21/6715

Abstract: A liquid processing apparatus that applies a coating liquid onto a substrate, includes: a substrate holder that holds and rotates the substrate; a coating liquid supplier that supplies the coating liquid to the substrate; a cup provided to surround the substrate; and a solvent supplier that supplies a solvent for the coating liquid to a coating liquid collector. The cup includes: an outer cup arranged outside the substrate holder; an inner cup arranged on an inner peripheral side of the outer cup below the substrate holder and having a downwardly-extending wall; an exhaust path provided between the outer and inner cups; and the coating liquid collector provided with a plurality of openings through which an exhaust flow passes, the coating liquid collector extending downward below the downwardly-extending wall of the inner cup with a gap between the coating liquid collector and a lower end of the downwardly-extending wall.

公开(公告)号：US20220171294A1

公开(公告)日：2022-06-02

申请号：US17522050

申请日：2021-11-09

Applicant: Tokyo Electron Limited

Inventor： Yuichiro KUNUGIMOTO ,  Shota UEYAMA ,  Akihiro TERAMOTO ,  Yuta NISHIYAMA ,  Shinichi HATAKEYAMA

IPC: G03F7/20 ,  B08B13/00 ,  B08B3/02 ,  G03F7/16 ,  G01G21/22 ,  G01F9/00

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.