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公开(公告)号：US20150036109A1
公开(公告)日：2015-02-05
申请号：US14449419
申请日：2014-08-01
Applicant: TOKYO ELECTRON LIMITED
Inventor： Kousuke YOSHIHARA , Hideharu KYOUDA , Koshi MUTA , Taro YAMAMOTO , Yasushi TAKIGUCHI , Masahiro FUKUDA
IPC: G03F7/30
CPC classification number: G03F7/3021 , B05C5/02 , B05C5/027 , B05C11/08 , B05D1/005 , B05D1/26 , G03F7/30 , H01L21/6715
Abstract: A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.
Abstract translation: 显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面， 小于衬底的表面。 根据该方法，能够抑制向基板外侧落下的液体的量。 此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。 此外，可以通过搅拌显影剂来提高生产量。
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公开(公告)号：US20180308719A1
公开(公告)日：2018-10-25
申请号：US16014308
申请日：2018-06-21
Applicant: TOKYO ELECTRON LIMITED
Inventor： Yasushi TAKIGUCHI , Koki YOSHIMURA , Taro YAMAMOTO , Hideharu KYOUDA , Koshi MUTA
IPC: H01L21/67
CPC classification number: H01L21/67051 , H01L21/6715
Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.
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公开(公告)号：US20150027503A1
公开(公告)日：2015-01-29
申请号：US14339539
申请日：2014-07-24
Applicant: TOKYO ELECTRON LIMITED
Inventor： Yasushi TAKIGUCHI , Koki YOSHIMURA , Taro YAMAMOTO , Hideharu KYOUDA , Koshi MUTA
IPC: H01L21/67
CPC classification number: H01L21/67051 , H01L21/6715
Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.
Abstract translation: 一种用于使用处理流体对基板进行液体处理的液体处理装置，包括：沿左右方向并排布置的多个基板保持单元; 喷嘴，被构造成将处理流体供应到保持在每个基板保持单元中的基板; 以及喷嘴移动机构，其构造成使喷嘴在与将基板保持单元的排列方向相交的前后方向向前后方向移动，所述喷嘴移动机构在供给位置和供给位置之间，所述供给位置将所述处理流体供给至包含所述基板的中央部的区域， 限定在与衬底保持单元的行的前侧相对的衬底保持单元的行的后侧处的基准装载和卸载的等待位置。
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公开(公告)号：US20240009697A1
公开(公告)日：2024-01-11
申请号：US18346293
申请日：2023-07-03
Applicant: Tokyo Electron Limited
Inventor： Junghyun KIM , Koshi MUTA , Daiki TAKAHASHI , Kohei KAWAKAMI , Satoshi SHIMMURA , Kenta SHIBASAKI , Shota UEYAMA , Tetsushi MIYAMOTO
IPC: B05C11/08
CPC classification number: B05C11/08 , H01L21/6715
Abstract: A liquid processing apparatus that applies a coating liquid onto a substrate, includes: a substrate holder that holds and rotates the substrate; a coating liquid supplier that supplies the coating liquid to the substrate; a cup provided to surround the substrate; and a solvent supplier that supplies a solvent for the coating liquid to a coating liquid collector. The cup includes: an outer cup arranged outside the substrate holder; an inner cup arranged on an inner peripheral side of the outer cup below the substrate holder and having a downwardly-extending wall; an exhaust path provided between the outer and inner cups; and the coating liquid collector provided with a plurality of openings through which an exhaust flow passes, the coating liquid collector extending downward below the downwardly-extending wall of the inner cup with a gap between the coating liquid collector and a lower end of the downwardly-extending wall.
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公开(公告)号：US20170045821A1
公开(公告)日：2017-02-16
申请号：US15338638
申请日：2016-10-31
Applicant: TOKYO ELECTRON LIMITED
Inventor： Kousuke YOSHIHARA , Hideharu KYOUDA , Koshi MUTA , Taro YAMAMOTO , Yasushi TAKIGUCHI
CPC classification number: G03F7/30 , B05C5/02 , B05C5/0287 , B05C11/08 , B05D1/005 , B05D1/26 , G03F7/3021 , H01L21/6715
Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.
Abstract translation: 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。
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Patent Agency Ranking
公开(公告)号：US20150036110A1
公开(公告)日：2015-02-05
申请号：US14450704
申请日：2014-08-04
Applicant: Tokyo Electron Limited
Inventor： Kousuke YOSHIHARA , Hideharu KYOUDA , Koshi MUTA , Taro YAMAMOTO , Yasushi TAKIGUCHI
IPC: G03F7/30
CPC classification number: G03F7/30 , B05C5/02 , B05C5/0287 , B05C11/08 , B05D1/005 , B05D1/26 , G03F7/3021 , H01L21/6715
Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.
Abstract translation: 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。
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公开(公告)号：US20240012329A1
公开(公告)日：2024-01-11
申请号：US18346287
申请日：2023-07-03
Applicant: Tokyo Electron Limited
Inventor： Junghyun KIM , Koshi MUTA , Daiki TAKAHASHI , Kohei KAWAKAMI , Satoshi SHIMMURA , Kenta SHIBASAKI , Shota UEYAMA , Tetsushi MIYAMOTO
IPC: G03F7/16
CPC classification number: G03F7/162
Abstract: A liquid processing apparatus that applies a coating liquid onto a substrate, includes: a substrate holder that holds and rotates the substrate; a coating liquid supplier that applies the coating liquid to the substrate; a cup provided to surround the substrate; and a solvent supplier that supplies a solvent for the coating liquid to a coating liquid collector. The cup includes: an outer cup arranged outside the substrate holder; an inner cup arranged on an inner peripheral side of the outer cup below the substrate holder and having a downwardly-extending wall; an exhaust path provided between the outer and inner cups; a cylindrical wall portion provided below the inner cup and having an upwardly-opened exhaust port communicating with the exhaust path; and the coating liquid collector arranged below the wall of the inner cup with a gap between the coating liquid collector and a lower end of the wall.
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公开(公告)号：US20170090291A1
公开(公告)日：2017-03-30
申请号：US15374081
申请日：2016-12-09
Applicant: Tokyo Electron Limited
Inventor： Kousuke YOSHIHARA , Hideharu KYOUDA , Koshi MUTA , Taro YAMAMOTO , Yasushi TAKIGUCHI , Masahiro FUKUDA
CPC classification number: G03F7/3021 , B05C5/02 , B05C5/027 , B05C11/08 , B05D1/005 , B05D1/26 , G03F7/30 , H01L21/6715
Abstract: A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.
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9.发明申请公开(公告)号：US20150027492A1
公开(公告)日：2015-01-29
申请号：US14321054
申请日：2014-07-01
Applicant: TOKYO ELECTRON LIMITED
Inventor： Yasushi TAKIGUCHI , Taro YAMAMOTO , Hideharu KYOUDA , Koshi MUTA
CPC classification number: H01L21/67051 , H01L21/67046 , H01L21/68792
Abstract: There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.
Abstract translation: 设置有第一和第二清洁部件，其构造成当由吸收垫保持的晶片水平保持时清洁晶片的后表面中的中心区域，并且被配置为清洁晶片的后表面中的周边区域， 晶片由旋转卡盘保持。 由于提供第一和第二清洁部件，与仅使用一个清洁部件的情况相比，可以提高洗涤性。 第一和第二清洁构件被构造成由公共转动轴水平转动。 当清洁晶片后表面中的中心区时，转轴被定位成与晶片重叠。 由于通过使用晶片的移动区域来定位转动轴，所以可以减小装置的尺寸。
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公开(公告)号：US20190391496A1
公开(公告)日：2019-12-26
申请号：US16560137
申请日：2019-09-04
Applicant: TOKYO ELECTRON LIMITED
Inventor： Koshi MUTA , Hideharu KYODA , Minoru KUBOTA
Abstract: A developing method includes: forming a liquid pool of a diluted developing solution diluted with pure water in a central portion of a substrate; forming a liquid film of the diluted developing solution on a surface of the substrate by accelerating rotation of the substrate to diffuse the liquid pool of the diluted developing solution on the entire surface of the substrate; and then supplying a developing solution onto the substrate. Supplying a developing solution includes: supplying the developing solution from a developing solution supply nozzle having a liquid contact surface while securing a gap having a predetermined size between the developing solution supply nozzle and the substrate; and moving the developing solution supply nozzle in a radial direction passing through a center of the substrate while forming a liquid pool of the developing solution between the substrate and the liquid contact surface of the developing solution supply nozzle.
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