-
公开(公告)号:US11929240B2
公开(公告)日:2024-03-12
申请号:US17494846
申请日:2021-10-06
Applicant: Tokyo Electron Limited
Inventor: Takehiro Ueda
IPC: H01J37/32 , H01L21/687
CPC classification number: H01J37/32724 , H01J37/32642 , H01L21/68735 , H01J2237/334
Abstract: A technique allows control of the etching rate at an outer periphery of a substrate being processed. A substrate support includes a substrate support portion that supports a substrate, and an edge ring support that supports an edge ring surrounding the substrate supported on the substrate support portion. The edge ring support includes a plurality of heating elements arranged in a circumferential direction of the edge ring support and a plurality of heater power feeders. Each of the plurality of heater power feeders is included in a corresponding heating element of the plurality of heating elements to provide power from an external source to the corresponding heating element.
-
2.
公开(公告)号:US20130220545A1
公开(公告)日:2013-08-29
申请号:US13774037
申请日:2013-02-22
Applicant: Tokyo Electron Limited
Inventor: Katsuyuki Koizumi , Takehiro Ueda
IPC: H01L21/683
CPC classification number: H01L21/6833 , H01L21/67103 , H01L21/67109 , H01L21/6831 , Y10T279/23
Abstract: A substrate mounting table and a plasma etching apparatus can supply a power to a temperature controlling heater electrode effectively while preventing atmosphere from being leaked and preventing processing uniformity in a surface of a substrate from being deteriorated. The substrate mounting table and the plasma etching apparatus include an insulating member having therein an electrostatic chuck electrode and a temperature controlling heater electrode; a plate-shaped temperature controlling member having therein a temperature controlling medium path through which a temperature controlling medium is circulated; a cylindrical member made of an insulating material and provided within a through hole formed in the plate-shaped temperature controlling member; and a lead line, provided within the cylindrical member, having one end connected to the temperature controlling heater electrode and the other end connected to a connecting terminal provided at a bottom surface side of the cylindrical member.
Abstract translation: 衬底安装台和等离子体蚀刻装置可以有效地向温度控制加热器电极供电,同时防止气体泄漏,并防止衬底表面的加工均匀性劣化。 衬底安装台和等离子体蚀刻装置包括其中具有静电卡盘电极和温度控制加热器电极的绝缘构件; 其中具有温度控制介质循环的温度控制介质路径的板状温度控制构件; 由绝缘材料制成并设置在形成在板状温度控制构件中的通孔内的圆柱形构件; 以及设置在所述筒状构件内的引线,其一端与所述温度控制加热器电极连接,所述另一端与设置在所述筒状构件的底面侧的连接端子连接。
-
公开(公告)号:US11923228B2
公开(公告)日:2024-03-05
申请号:US17183625
申请日:2021-02-24
Applicant: Tokyo Electron Limited
Inventor: Takehiro Ueda
IPC: H01L21/683 , H01J37/32
CPC classification number: H01L21/6833 , H01J37/32082 , H01J37/3244 , H01J37/32642 , H01J37/32715
Abstract: A stage to be disposed in a chamber of a plasma processing apparatus is provided. The stage includes a chuck with a mounting portion for a substrate and a first hole through the mounting portion. The stage includes a base disposed beneath the chuck, the base including a second hole through the base, and the second hole communicating with the first hole. The base includes a first cylindrical liner disposed in the second hole, the first cylindrical liner having a relative permittivity of 5 or less.
-
公开(公告)号:US11756808B2
公开(公告)日:2023-09-12
申请号:US17386645
申请日:2021-07-28
Applicant: TOKYO ELECTRON LIMITED
Inventor: Takehiro Ueda
IPC: H01L21/67 , H01L21/687 , H01L21/3065 , H01J37/32
CPC classification number: H01L21/67126 , H01J37/3244 , H01J37/32532 , H01L21/3065 , H01L21/68735 , H01L21/68742 , H01L21/68764
Abstract: A plasma processing apparatus includes an insertion member having a first surface facing a vacuum space, a second surface facing a non-vacuum space, and an insertion hole penetrating through the first and second surfaces. A pin is inserted into the insertion hole and moved vertically. A movable member is provided in a recess formed on a wall surface of the insertion hole facing the pin. The movable member has an opening into which the pin is inserted and is movable along a surface of the recess. A first sealing member is provided between the movable member and the pin. A second sealing member is provided between the movable body and the surface of the recess and allows, when a pressing force of the pin that locally compresses the first sealing member acts on the first sealing member, the movable member to move in a direction to release the pressing force.
-
公开(公告)号:US11121010B2
公开(公告)日:2021-09-14
申请号:US16273765
申请日:2019-02-12
Applicant: TOKYO ELECTRON LIMITED
Inventor: Takehiro Ueda
IPC: H01L21/67 , H01L21/687 , H01L21/3065 , H01J37/32
Abstract: A plasma processing apparatus includes an insertion member having a first surface facing a vacuum space, a second surface facing a non-vacuum space, and an insertion hole penetrating through the first and second surfaces. A pin is inserted into the insertion hole and moved vertically. A movable member is provided in a recess formed on a wall surface of the insertion hole facing the pin. The movable member has an opening into which the pin is inserted and is movable along a surface of the recess. A first sealing member is provided between the movable member and the pin. A second sealing member is provided between the movable body and the surface of the recess and allows, when a pressing force of the pin that locally compresses the first sealing member acts on the first sealing member, the movable member to move in a direction to release the pressing force.
-
公开(公告)号:US11037767B2
公开(公告)日:2021-06-15
申请号:US16699268
申请日:2019-11-29
Applicant: Tokyo Electron Limited
Inventor: Takehiro Ueda
IPC: H01L21/687 , H01J37/32
Abstract: In a substrate support according to one exemplary embodiment, an adhesive is provided between an upper surface of a base and a lower surface of the electrostatic chuck. The base, the adhesive, and the electrostatic chuck provide a supply path for supplying a heat transfer gas between the electrostatic chuck and a substrate. The upper surface of the base defines one or more grooves. The one or more grooves are further away from a center of the upper surface than the supply path. The adhesive is provided to cover an upper end opening of each of the one or more grooves. The heat transfer gas is capable of being supplied to the one or more grooves via the supply path or a different flow path. The substrate support further includes a pressure sensor to measure pressure in the one or more grooves.
-
公开(公告)号:US10968925B2
公开(公告)日:2021-04-06
申请号:US16028608
申请日:2018-07-06
Applicant: TOKYO ELECTRON LIMITED
Inventor: Takehiro Ueda , Takeshi Akao
IPC: F15B15/14 , F15B11/036 , H01L21/677 , H01L21/687
Abstract: An air cylinder includes a cylinder, a piston rod, a piston, and a controller. The piston rod has one end disposed in the cylinder and the other end protruding from the cylinder. The piston is provided at the one end of the piston rod and moves the piston rod by moving in the cylinder. The controller supplies gas into one of a space, which is a space in the cylinder directed on the piston rod side with respect to the piston, and a space, which is a space in the cylinder opposite to the space with respect to the piston, and sucks gas from an interior of the other of the spaces.
-
公开(公告)号:US20190273004A1
公开(公告)日:2019-09-05
申请号:US16285482
申请日:2019-02-26
Applicant: Tokyo Electron Limited
Inventor: Takehiro Ueda
Abstract: A processing container includes a processing container including a placement table configured to place a workpiece thereon and a gas supply source configured to supply a processing gas; a plurality of exhaust mechanisms provided around the placement table and configured to control an exhaust amount of the processing gas; a plurality of sensors configured to detect pressure at a plurality of positions distributed within the processing container; and a controller configured to control exhaust amounts of the plurality of exhaust mechanisms based on a result of pressure detection by the plurality of sensors so as to suppress unevenness in a pressure of the processing gas supplied to the workpiece.
-
公开(公告)号:US11532467B2
公开(公告)日:2022-12-20
申请号:US17009908
申请日:2020-09-02
Applicant: Tokyo Electron Limited
Inventor: Takehiro Ueda , Jun Hirose , Kazuyuki Tezuka
Abstract: A maintenance device has a cover and a fixing member. The cover is in a vacuum atmosphere during substrate processing, is formed to have a size corresponding to a boundary line between a first part and a second part of a processing container, which can be separated into the first part and the second part, or an opening surface separating the first part and the second part, and has airtightness, and visual transparency at least in a part. The fixing member fixes in an airtight manner the cover along the boundary line between the first part and the second part of the processing container or to the opening surface separating the first part and the second part.
-
公开(公告)号:US11201039B2
公开(公告)日:2021-12-14
申请号:US16269897
申请日:2019-02-07
Applicant: Tokyo Electron Limited
Inventor: Takehiro Ueda
IPC: H01J37/32 , H01L21/683 , H01L21/687 , C23C16/458 , C23C16/50 , H01L21/67
Abstract: A mounting apparatus for an object to be processed includes a mounting stage, on which an object to be processed is mounted inside a processing container, an edge ring disposed in a peripheral edge portion of the mounting stage, and a spring-like conductive member that includes a first spring-like member contacting the edge ring at a first recess formed in the edge ring, and a second spring-like member contacting the mounting stage at a second recess formed in the mounting stage.
-
-
-
-
-
-
-
-
-