公开(公告)号：US20210134634A1

公开(公告)日：2021-05-06

申请号：US17083726

申请日：2020-10-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takuya UMISE

IPC: H01L21/677 ,  H01L21/67 ,  C23C16/458

Abstract: A substrate accommodating unit is disposed adjacent to each of consecutively arranged vacuum transfer units. The substrate accommodating unit includes a hollow housing having, on one sidewall in an arrangement direction of the vacuum transfer units, a loading/unloading port for loading/unloading a substrate into/from the adjacent vacuum transfer unit, a vertically movable partition member disposed in the housing, and a driving mechanism for vertically moving the partition member. When an inner space of the housing is divided horizontally into a first space on a loading/unloading port side and a second space on an opposite side of the loading/unloading port side, the partition member is vertically moved from a state where the first space and the second space communicate with each other to thereby airtightly separate the first space and the second space with the partition member.

公开(公告)号：US20170162424A1

公开(公告)日：2017-06-08

申请号：US15363141

申请日：2016-11-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takuya UMISE ,  Hiroshi SONE ,  Naoyuki SUZUKI

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: In a processing apparatus according to one embodiment, a stage is installed inside a process chamber. The stage has a plurality of through-holes formed therein, which corresponds to a plurality of lift pins. The plurality of lift pins is supported by a spline shaft through a support body. The spline shaft is supported by a spline bearing such that the spline shaft is vertically moved. The plurality of lift pins is biased upward by a spring member through the spline shaft. The spline shaft, the spline bearing, and the spring member are installed in an outer space separated from a depressurizable inner space of the process chamber.

公开(公告)号：US20220336194A1

公开(公告)日：2022-10-20

申请号：US17642992

申请日：2020-09-04

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki YOKOHARA ,  Koji MAEDA ,  Yasunobu SUZUKI ,  Atsushi SHIMADA ,  Takuya UMISE

IPC: H01J37/32

Abstract: A plasma processing apparatus for performing plasma processing on a substrate includes: a plasma generator configured to generate plasma in a processing container; a support structure configured to mount the substrate on a tilted mounting surface in the processing container and rotatably support the substrate; a first slit plate made of quartz and provided between the plasma generator and the support structure, the first slit plate having first slits formed in the first slit plate; and a second slit plate made of quartz and provided between the plasma generator and the support structure and below the first slit plate, the second slit plate having second slits formed in the second slit plate, wherein the first slits are staggered from adjacent ones of the second slits in a reverse direction of a tilting direction of the mounting surface.

公开(公告)号：US20220328343A1

公开(公告)日：2022-10-13

申请号：US17657962

申请日：2022-04-05

Applicant: Tokyo Electron Limited

Inventor： Takuya UMISE ,  Masato SHINADA ,  Tetsuya MIYASHITA

IPC: H01L21/687

Abstract: A processing method for processing a substrate includes: a first arrangement step of mounting, on a stage provided in a processing container to mount the substrate on the stage, a plate-shaped protective member which is prepared in advance at a location in the processing container different from a location on the stage and which is configured to protect an upper surface of the stage; an adjustment step of adjusting a distance between the stage and an annular cover member provided above an edge portion of the stage to a second distance different from a first distance between the stage and the cover member when the substrate is processed; and a pretreatment step of performing a pretreatment in the processing container to change a state in the processing container to a predetermined state, wherein the protective member has a thickness different from a thickness of the substrate.

公开(公告)号：US20210035838A1

公开(公告)日：2021-02-04

申请号：US16934825

申请日：2020-07-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takuya UMISE

IPC: H01L21/677 ,  H01L21/67

Abstract: A substrate processing apparatus includes a transfer chamber row of transfer chambers arranged linearly, a processing chamber row of processing chambers arranged on one side or both sides of the transfer chamber row, a driving mechanism for rotating/extending/contracting a transfer arm of a substrate transfer mechanism in each transfer chamber, and a controller. A center of a substrate supporting region in the processing chamber is positioned closer to the transfer chamber row than a line connecting a rotation axis of the transfer arm and a center of a gate valve. Further, when loading and unloading a substrate between the processing chamber and the adjacent transfer chamber, the controller controls the driving mechanism such that a center of the substrate held by the transfer arm passes along an outer side of a line that connects a rotation axis of the transfer arm and a center of a substrate supporting region.