公开(公告)号：US20200176226A1

公开(公告)日：2020-06-04

申请号：US16699953

申请日：2019-12-02

Applicant: Tokyo Electron Limited

Inventor： Toshiya Tsukahara ,  Shuhei Yamabe ,  Kota Yachi ,  Tetsuji Sato ,  Yohei Uchida ,  Ayuta Suzuki ,  Yosuke Tamura ,  Hidetoshi Hanaoka ,  Junichi Sasaki

IPC: H01J37/32

Abstract: A plasma processing apparatus includes a processing vessel, a lower electrode, an annular member, an inner upper electrode, an outer upper electrode, a processing gas supply, a first high frequency power supply and a first DC power supply. The lower electrode is configured to place a processing target substrate. The annular member is disposed on an outer peripheral portion of the lower electrode. The inner upper electrode is disposed to face the lower electrode. The outer upper electrode is disposed at an outside of the inner upper electrode. The first high frequency power supply applies a first high frequency power. The first DC power supply applies a first variable DC voltage to the outer upper electrode. At least a part of a surface of the outer upper electrode exposed to the processing space is located higher than a surface of the inner upper electrode exposed to the processing space.

公开(公告)号：US11664200B2

公开(公告)日：2023-05-30

申请号：US16671416

申请日：2019-11-01

Applicant: Tokyo Electron Limited

Inventor： Yasuharu Sasaki ,  Toshiya Tsukahara ,  Mitsuaki Sato

IPC: H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32642 ,  H01J2237/2007

Abstract: A placing table includes an edge ring disposed to surround a substrate, the edge ring having a first recess portion at a lower portion thereof; an electrostatic chuck having a first placing surface on which the substrate is placed, a second placing surface on which the edge ring is placed, and an electrode embedded therein to face the second placing surface; an annular member disposed to surround the electrostatic chuck, the annular member having a second recess portion; and an elastic member disposed in a space surrounded by the first recess portion, the electrostatic chuck and the second recess portion.

公开(公告)号：US20180182635A1

公开(公告)日：2018-06-28

申请号：US15852416

申请日：2017-12-22

Applicant: Tokyo Electron Limited

Inventor： Toshiya Tsukahara ,  Junji Ishibashi ,  Taketoshi Tomioka ,  Yasuharu Sasaki ,  Yohei Uchida

IPC: H01L21/3065 ,  H01L21/67 ,  H01L21/683 ,  H05H1/46 ,  C23C16/458

CPC classification number: H01L21/3065 ,  C23C16/458 ,  C23C16/4585 ,  C23C16/46 ,  C23C16/505 ,  H01J37/32642 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68735 ,  H05H1/46

Abstract: A focus ring that surrounds a periphery of a substrate placed on a stage in a processing chamber of a substrate processing apparatus includes a lower surface to contact a peripheral portion of the stage, the lower surface being inclined such that an outer peripheral side becomes lower than an inner peripheral side in a radial direction.