公开(公告)号：US20220252507A1

公开(公告)日：2022-08-11

申请号：US17617979

申请日：2020-06-09

Applicant: Tokyo Electron Limited

Inventor： Yasuaki NODA

IPC: G01N21/31 ,  G01N21/95 ,  H04N5/232 ,  G06T7/00

Abstract: A substrate processing apparatus includes: a holding unit configured to hold a substrate having a film formed on a surface; an imaging unit configured to acquire image data by imaging the surface of the substrate held by the holding unit; a spectroscopic measuring unit configured to acquire spectroscopic data by dispersing light from the surface of the substrate held by the holding unit; and a control unit configured to control the holding unit, the imaging unit, and the spectroscopic measuring unit.

公开(公告)号：US20240022693A1

公开(公告)日：2024-01-18

申请号：US18475544

申请日：2023-09-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihisa KOGA ,  Tadashi NISHIYAMA ,  Yasuaki NODA

IPC: H04N7/18 ,  H04N23/56 ,  G01N21/88 ,  G06T7/00

CPC classification number: H04N7/183 ,  H04N23/56 ,  G01N21/8806 ,  G06T7/0004 ,  G01N2021/8812 ,  G06T2207/30148

Abstract: In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

公开(公告)号：US20170244936A1

公开(公告)日：2017-08-24

申请号：US15437869

申请日：2017-02-21

Applicant: Tokyo Electron Limited

Inventor： Norihisa KOGA ,  Tadashi NISHIYAMA ,  Yasuaki NODA

IPC: H04N7/18 ,  G06T7/00 ,  G01N21/88 ,  H04N5/225

Abstract: In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

公开(公告)号：US20210185282A1

公开(公告)日：2021-06-17

申请号：US17189669

申请日：2021-03-02

Applicant: Tokyo Electron Limited

Inventor： Norihisa KOGA ,  Tadashi NISHIYAMA ,  Yasuaki NODA

IPC: H04N7/18 ,  G01N21/88 ,  G06T7/00 ,  H04N5/225

Abstract: In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

公开(公告)号：US20190287796A1

公开(公告)日：2019-09-19

申请号：US16433069

申请日：2019-06-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuaki NODA ,  Tadashi Nishiyama

IPC: H01L21/027 ,  B05D1/00 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L21/67 ,  G03F7/20 ,  G03F7/16 ,  G06T7/00 ,  G03F7/26 ,  G06T7/60

Abstract: A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate over the whole periphery of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate over the whole periphery of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.

公开(公告)号：US20230395380A1

公开(公告)日：2023-12-07

申请号：US18453573

申请日：2023-08-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuaki NODA ,  Tadashi NISHIYAMA

IPC: H01L21/027 ,  B05D1/00 ,  H01L21/67 ,  H01L21/68 ,  G06T7/00 ,  G03F7/16 ,  G03F7/20 ,  G03F7/00 ,  G03F7/26 ,  G06T7/60 ,  H01L21/687 ,  H01L21/66

CPC classification number: H01L21/0274 ,  B05D1/005 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/681 ,  G06T7/0008 ,  G03F7/168 ,  G03F7/2028 ,  G03F7/70425 ,  G03F7/20 ,  G03F7/26 ,  G06T7/60 ,  H01L21/67173 ,  H01L21/67288 ,  H01L21/68714 ,  H01L22/20 ,  H01L22/12 ,  G01N21/9503

Abstract: A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.

公开(公告)号：US20170243738A1

公开(公告)日：2017-08-24

申请号：US15437885

申请日：2017-02-21

Applicant: Tokyo Electron Limited

Inventor： Yasuaki NODA ,  Tadashi NISHIYAMA

IPC: H01L21/027 ,  H01L21/67 ,  G06T7/60 ,  G03F7/20 ,  G03F7/26 ,  H01L21/66 ,  H01L21/687

CPC classification number: H01L21/0274 ,  B05D1/005 ,  G03F7/168 ,  G03F7/20 ,  G03F7/2028 ,  G03F7/26 ,  G06T7/0008 ,  G06T7/60 ,  G06T2207/30148 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68714 ,  H01L22/12 ,  H01L22/20

Abstract: A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate over the whole periphery of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate over the whole periphery of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.