公开(公告)号：US20220237770A1

公开(公告)日：2022-07-28

申请号：US17615442

申请日：2020-05-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuji IWANAGA ,  Tadashi NISHIYAMA

IPC: G06T7/00

Abstract: A substrate inspection apparatus for inspecting a substrate, includes: an acquisition part configured to acquire an estimated image of an inspection target substrate after a process by a substrate processing apparatus, based on an image estimation model created by a machine learning by using a captured image before the process by the substrate processing apparatus and a captured image after the process by the substrate processing apparatus for each of a plurality of substrates, and a captured image of the inspection target substrate before the process by the substrate processing apparatus; and a determination part configured to determine the presence or absence of a defect in the inspection target substrate, based on a captured image of the inspection target substrate and the estimated image of the inspection target substrate after the process by the substrate processing apparatus.

公开(公告)号：US20210166365A1

公开(公告)日：2021-06-03

申请号：US17252151

申请日：2019-06-10

Applicant: Tokyo Electron Limited

Inventor： Shin INOUE ,  Kazuya HISANO ,  Akiko KIYOTOMI ,  Tadashi NISHIYAMA

IPC: G06T7/00 ,  G03F7/16

Abstract: A method for inspecting defects of substrates when executing a job in which a treatment recipe for the substrates and the substrates being treatment objects are designated to perform predetermined treatments on the substrates, includes: an imaging step of successively imaging the substrates; a first determination step of decomposing, in order from the substrate being a head of the job, a planar distribution of pixel values in a substrate image captured at the imaging step into a plurality of pixel value distribution components using a Zernike polynomial, calculating Zernike coefficients of the pixel value distribution components corresponding to defects to be detected, and determining presence or absence of a defect of the substrate based on the calculated Zernike coefficients; and a second determination step of determining, from predetermined timing after at least one substrate is determined to have no defect at the first determination step, presence or absence of a defect of the substrate being a determination object based on the substrate image determined to have no defect at the first determination step.

公开(公告)号：US20240022693A1

公开(公告)日：2024-01-18

申请号：US18475544

申请日：2023-09-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihisa KOGA ,  Tadashi NISHIYAMA ,  Yasuaki NODA

IPC: H04N7/18 ,  H04N23/56 ,  G01N21/88 ,  G06T7/00

CPC classification number: H04N7/183 ,  H04N23/56 ,  G01N21/8806 ,  G06T7/0004 ,  G01N2021/8812 ,  G06T2207/30148

Abstract: In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

公开(公告)号：US20230197480A1

公开(公告)日：2023-06-22

申请号：US18110419

申请日：2023-02-16

Applicant: Tokyo Electron Limited

Inventor： Akiko KIYOTOMI ,  Masato HOSAKA ,  Tadashi NISHIYAMA ,  Kazuya HISANO

IPC: H01L21/67 ,  G03F7/20 ,  G06V10/44 ,  G06Q20/08 ,  G06Q20/22 ,  G06V10/98

CPC classification number: H01L21/67178 ,  G03F7/7065 ,  H01L21/67259 ,  G06V10/44 ,  G06Q20/08 ,  G06Q20/22 ,  G06V10/98

Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a film is formed, and an inspection recipe; an edge detector configured to detect a target edge as an edge of an inspection target film on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage; a periphery calculator configured to calculate a position of a theoretical periphery of the substrate; and a width calculator configured to calculate a width between the theoretical periphery of the substrate and the target edge on the basis of position data of the theoretical periphery of the substrate obtained by the periphery calculator and position data of the target edge obtained by the edge detector.

公开(公告)号：US20170244936A1

公开(公告)日：2017-08-24

申请号：US15437869

申请日：2017-02-21

Applicant: Tokyo Electron Limited

Inventor： Norihisa KOGA ,  Tadashi NISHIYAMA ,  Yasuaki NODA

IPC: H04N7/18 ,  G06T7/00 ,  G01N21/88 ,  H04N5/225

Abstract: In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

公开(公告)号：US20250045903A1

公开(公告)日：2025-02-06

申请号：US18924338

申请日：2024-10-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuji IWANAGA ,  Tadashi NISHIYAMA

IPC: G06T7/00

Abstract: A substrate inspection apparatus for inspecting a substrate, includes: an acquisition part configured to acquire an estimated image of an inspection target substrate after a process by a substrate processing apparatus, based on an image estimation model created by a machine learning by using a captured image before the process by the substrate processing apparatus and a captured image after the process by the substrate processing apparatus for each of a plurality of substrates, and a captured image of the inspection target substrate before the process by the substrate processing apparatus; and a determination part configured to determine the presence or absence of a defect in the inspection target substrate, based on a captured image of the inspection target substrate and the estimated image of the inspection target substrate after the process by the substrate processing apparatus.

公开(公告)号：US20230333531A1

公开(公告)日：2023-10-19

申请号：US18337222

申请日：2023-06-19

Applicant: Tokyo Electron Limited

Inventor： Takuya MORI ,  Tadashi NISHIYAMA ,  Akiko KIYOTOMI ,  Hiroshi TOMITA

IPC: G05B19/042 ,  H01L21/67 ,  G03F7/38 ,  G03F7/20 ,  G03F7/34

CPC classification number: G05B19/042 ,  H01L21/67225 ,  G03F7/38 ,  G03F7/20 ,  G03F7/34 ,  G03F7/162

Abstract: This method includes: a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate; a step of calculating a deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate; a step of calculating a correction amount of the treatment condition based on a correlation model acquired in advance and on the deviation amount in the color information; and a step of setting the treatment condition based on the correction amount, wherein steps other than the step of acquiring a captured image of the reference substrate are performed for each of the treatment apparatuses.

公开(公告)号：US20210185282A1

公开(公告)日：2021-06-17

申请号：US17189669

申请日：2021-03-02

Applicant: Tokyo Electron Limited

Inventor： Norihisa KOGA ,  Tadashi NISHIYAMA ,  Yasuaki NODA

IPC: H04N7/18 ,  G01N21/88 ,  G06T7/00 ,  H04N5/225

Abstract: In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

公开(公告)号：US20230395380A1

公开(公告)日：2023-12-07

申请号：US18453573

申请日：2023-08-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuaki NODA ,  Tadashi NISHIYAMA

IPC: H01L21/027 ,  B05D1/00 ,  H01L21/67 ,  H01L21/68 ,  G06T7/00 ,  G03F7/16 ,  G03F7/20 ,  G03F7/00 ,  G03F7/26 ,  G06T7/60 ,  H01L21/687 ,  H01L21/66

CPC classification number: H01L21/0274 ,  B05D1/005 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/681 ,  G06T7/0008 ,  G03F7/168 ,  G03F7/2028 ,  G03F7/70425 ,  G03F7/20 ,  G03F7/26 ,  G06T7/60 ,  H01L21/67173 ,  H01L21/67288 ,  H01L21/68714 ,  H01L22/20 ,  H01L22/12 ,  G01N21/9503

Abstract: A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.

公开(公告)号：US20170243738A1

公开(公告)日：2017-08-24

申请号：US15437885

申请日：2017-02-21

Applicant: Tokyo Electron Limited

Inventor： Yasuaki NODA ,  Tadashi NISHIYAMA

IPC: H01L21/027 ,  H01L21/67 ,  G06T7/60 ,  G03F7/20 ,  G03F7/26 ,  H01L21/66 ,  H01L21/687

CPC classification number: H01L21/0274 ,  B05D1/005 ,  G03F7/168 ,  G03F7/20 ,  G03F7/2028 ,  G03F7/26 ,  G06T7/0008 ,  G06T7/60 ,  G06T2207/30148 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68714 ,  H01L22/12 ,  H01L22/20

Abstract: A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate over the whole periphery of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate over the whole periphery of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.