公开(公告)号：US20170236729A1

公开(公告)日：2017-08-17

申请号：US15432044

申请日：2017-02-14

Applicant: Tokyo Electron Limited

Inventor： Yosuke Kawabuchi ,  Kouzou Tachibana ,  Mitsunori Nakamori ,  Kotaro Ooishi ,  Keisuke Egashira ,  Koji Tanaka ,  Hiroaki Inadomi ,  Masami Yamashita ,  Yoshiteru Fukuda ,  Koji Yamashita ,  Yu Tsurifune ,  Takuro Masuzumi

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/04 ,  B08B3/10 ,  B08B3/14 ,  H01L21/02 ,  B08B3/08

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/67028

Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.

公开(公告)号：US12036585B2

公开(公告)日：2024-07-16

申请号：US17158354

申请日：2021-01-26

Applicant: Tokyo Electron Limited

Inventor： Tadashi Iino ,  Yoshiteru Fukuda

IPC: H01L21/67 ,  B08B6/00

CPC classification number: B08B6/00 ,  H01L21/67

Abstract: A substrate processing apparatus includes an air supply configured to supply air into a place where a substrate is located; and a rectifying member, having multiple through holes, configured to rectify the air supplied from the air supply. The rectifying member includes a base; and a charge diffusion layer formed on a surface of the base. Electric charges attached to a surface of the rectifying member are diffused along the charge diffusion layer.

公开(公告)号：US20210229135A1

公开(公告)日：2021-07-29

申请号：US17158354

申请日：2021-01-26

Applicant: Tokyo Electron Limited

Inventor： Tadashi Iino ,  Yoshiteru Fukuda

IPC: B08B6/00

Abstract: A substrate processing apparatus includes an air supply configured to supply air into a place where a substrate is located; and a rectifying member, having multiple through holes, configured to rectify the air supplied from the air supply. The rectifying member includes a base; and a charge diffusion layer formed on a surface of the base. Electric charges attached to a surface of the rectifying member are diffused along the charge diffusion layer.