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公开(公告)号：US09548232B2
公开(公告)日：2017-01-17
申请号：US14408903
申请日：2013-05-07
CPC分类号： H01L21/683 , B32B37/0046 , B32B37/10 , B32B37/12 , B32B41/00 , B32B2457/14 , H01L21/67092 , H01L21/67288
摘要： An attaching apparatus, a substrate and a support that can be uniformly attached through an adhesive layer. The attaching apparatus is equipped with a set plate and a press plate formed of ceramics. The set plate and the press plate have a flatness of 1.0 μm or less when not pressed.
摘要翻译： 可以通过粘合剂层均匀地附着的附接装置，基板和支撑体。 安装装置配备有固定板和由陶瓷形成的压板。 固定板和压板在未按压时的平坦度为1.0μm以下。
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公开(公告)号：US09337074B2
公开(公告)日：2016-05-10
申请号：US14431902
申请日：2013-09-05
发明人： Yoshihiro Inao , Shigeru Kato , Shugo Tsushima , Junichi Katsuragawa , Satoshi Kobari , Akihiko Nakamura
IPC分类号： H01L21/68 , H01L21/683 , H01L21/67 , B25J15/00 , H01L21/687 , B25J11/00
CPC分类号： H01L21/6835 , B25J11/0095 , B25J15/0042 , H01L21/67092 , H01L21/687 , H01L21/68721 , H01L2221/68304 , H01L2221/68327 , H01L2221/68381 , Y10T156/10 , Y10T156/17
摘要： An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.
摘要翻译： 配置成通过粘合剂层附接基板和支撑件的附接装置设置有支撑保持构件。 支撑保持构件的保持工具被构造成将支撑件保持在保持工具的倾斜表面部分（接触构件）上，而不与待附接到基板的支撑体的表面接触。 附着装置将表面保持不与其接触的支撑体附接到基板。
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公开(公告)号：US20150262858A1
公开(公告)日：2015-09-17
申请号：US14431902
申请日：2013-09-05
发明人： Yoshihiro Inao , Shigeru Kato , Shugo Tsushima , Junichi Katsuragawa , Satoshi Kobari , Akihiko Nakamura
IPC分类号： H01L21/683
CPC分类号： H01L21/6835 , B25J11/0095 , B25J15/0042 , H01L21/67092 , H01L21/687 , H01L21/68721 , H01L2221/68304 , H01L2221/68327 , H01L2221/68381 , Y10T156/10 , Y10T156/17
摘要： An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.
摘要翻译： 配置成通过粘合剂层附接基板和支撑件的附接装置设置有支撑保持构件。 支撑保持构件的保持工具被构造成将支撑件保持在保持工具的倾斜表面部分（接触构件）上，而不与待附接到基板的支撑体的表面接触。 附着装置将表面保持不与其接触的支撑体附接到基板。
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公开(公告)号：US20150194329A1
公开(公告)日：2015-07-09
申请号：US14409137
申请日：2013-04-30
IPC分类号： H01L21/68 , G06T11/60 , G06T7/00 , H01L21/683 , H01L21/687
CPC分类号： H01L21/681 , G06T7/0004 , G06T11/60 , G06T2207/30108 , H01L21/68 , H01L21/6835 , H01L21/6836 , H01L21/68785 , H01L2221/68318 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381
摘要： An overlapping device which is configured to detect the center positions of a substrate and a support which are held in a center position detecting portion, carry the substrate and the support from the center position detecting portion to an overlapping portion, and overlap the substrate and the support such that the detected center positions of the substrate and the support are overlapped in the overlapping portion.
摘要翻译： 一种重叠装置，被配置为检测保持在中心位置检测部分中的基板和支撑件的中心位置，将基板和支撑件从中心位置检测部分运送到重叠部分，并且重叠基板和 支撑使得检测到的基板和支撑体的中心位置在重叠部分中重叠。
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公开(公告)号：US09911637B2
公开(公告)日：2018-03-06
申请号：US14409137
申请日：2013-04-30
IPC分类号： G06K9/00 , H01L21/68 , G06T7/00 , G06T11/60 , H01L21/683 , H01L21/687
CPC分类号： H01L21/681 , G06T7/0004 , G06T11/60 , G06T2207/30108 , H01L21/68 , H01L21/6835 , H01L21/6836 , H01L21/68785 , H01L2221/68318 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381
摘要： An overlapping device which is configured to detect the center positions of a substrate and a support which are held in a center position detecting portion, carry the substrate and the support from the center position detecting portion to an overlapping portion, and overlap the substrate and the support such that the detected center positions of the substrate and the support are overlapped in the overlapping portion.
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