公开(公告)号：US09664733B2

公开(公告)日：2017-05-30

申请号：US14833518

申请日：2015-08-24

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yuichi Ozawa ,  Hiroshi Nishimura ,  Seiichi Ohta ,  Yasuhito Iguchi ,  Kunihiko Chiba ,  Ken Kato

IPC: G01R31/308 ,  G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2891 ,  G01R1/07307

Abstract: A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.

公开(公告)号：US09442156B2

公开(公告)日：2016-09-13

申请号：US14833568

申请日：2015-08-24

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yuichi Ozawa ,  Hiroshi Nishimura ,  Seiichi Ohta ,  Yasuhito Iguchi ,  Kunihiko Chiba ,  Ken Kato

IPC: G01R31/00 ,  G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2831 ,  G01R1/0408 ,  G01R31/2891

Abstract: The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.

Abstract translation: 本发明提供一种包括对准效用函数的探针装置。 当用户输入用于探针与每个芯片接触的接触位置的变化量（变化范围）的条件值时，在使用通过测量一个晶片中的每个芯片的位置获取的实际测量数据的模拟中 通过改变执行对准的测量点来计算每个芯片的变化范围，以计算最佳测量点的设置，使得变化范围等于或小于条件值，并且测量点的数量为 最低 然后向用户提供关于最佳测量点的信息。

公开(公告)号：US20150362552A1

公开(公告)日：2015-12-17

申请号：US14833518

申请日：2015-08-24

Applicant: TOKYO SEIMITSU CO., LTD.

Inventor： Yuichi Ozawa ,  Hiroshi Nishimura ,  Seiichi Ohta ,  Yasuhito Iguchi ,  Kunihiko Chiba ,  Ken Kato

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2891 ,  G01R1/07307

Abstract: A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.

Abstract translation: 本发明的探针装置测量要检查的晶片中的每个芯片的位置，以获得作为实际测量数据的位置。 然后，探针装置根据实际的测量数据，计算每个芯片的实际测量位置的变化量或探针与晶片的每个芯片接触的位置的变化量，并允许 显示器，用于显示可视地显示变化量的变化范围显示图像。 在图像中，显示与每个芯片相对应的四边形区域，并且根据变化量在从其中心位置偏移的位置处的每个四边形区域中显示点。

公开(公告)号：US20150362553A1

公开(公告)日：2015-12-17

申请号：US14833568

申请日：2015-08-24

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yuichi Ozawa ,  Hiroshi Nishimura ,  Seiichi Ohta ,  Yasuhito Iguchi ,  Kunihiko Chiba ,  Ken Kato

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2831 ,  G01R1/0408 ,  G01R31/2891

Abstract: The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.

Abstract translation: 本发明提供一种包括对准效用函数的探针装置。 当用户输入用于探针与每个芯片接触的接触位置的变化量（变化范围）的条件值时，在使用通过测量一个晶片中的每个芯片的位置获取的实际测量数据的模拟中 通过改变执行对准的测量点来计算每个芯片的变化范围，以计算最佳测量点的设置，使得变化范围等于或小于条件值，并且测量点的数量为 最低 然后向用户提供关于最佳测量点的信息。