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公开(公告)号：US09983256B2
公开(公告)日：2018-05-29
申请号：US14515688
申请日：2014-10-16
Applicant: TOKYO SEIMITSU CO., LTD
Inventor： Yuichi Ozawa , Yasuhito Iguchi , Tetsuo Yoshida , Junzo Koshio
CPC classification number: G01R31/2601 , G01B2210/56 , G01R31/2891
Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other. The device is provided with a microscope 23 for image-capturing the electrode pad and for outputting the external shape of the electrode pad as image data, and a control unit 27 which stores image data of an external shape of the electrode pad prior to the contact with a probe 102, and compares the image data of the external shape thus stored with image data thereof after the contact obtained from the microscope 23, or compares the registered frame of the electrode pad with the outer periphery of the electrode pad detected at the time of inspecting a needle trace, so that the quality of the contact between the electrode pad and the probe 102 is determined.
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公开(公告)号：US20150109625A1
公开(公告)日：2015-04-23
申请号：US14515688
申请日：2014-10-16
Applicant: TOKYO SEIMITSU CO., LTD
Inventor： Yuichi Ozawa , Yasuhito Iguchi , Tetsuo Yoshida , Junzo Koshio
CPC classification number: G01R31/2601 , G01B2210/56 , G01R31/2891
Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other. The device is provided with a microscope 23 for image-capturing the electrode pad and for outputting the external shape of the electrode pad as image data, and a control unit 27 which stores image data of an external shape of the electrode pad prior to the contact with a probe 102, and compares the image data of the external shape thus stored with image data thereof after the contact obtained from the microscope 23, or compares the registered frame of the electrode pad with the outer periphery of the electrode pad detected at the time of inspecting a needle trace, so that the quality of the contact between the electrode pad and the probe 102 is determined.
Abstract translation: 为了提供能够确认电检查是否已经被适当地执行的探测装置和探测方法，其中电极焊盘与预定压力的探头接触，通过利用外部形状的改变 当探针和电极垫彼此按压时，形成在电极焊盘上。 该装置设置有用于图像捕获电极焊盘并用于输出电极焊盘的外部形状的显微镜23作为图像数据，以及控制单元27，其在接触之前存储电极焊盘的外部形状的图像数据 与探针102相比较，并将这样存储的外部形状的图像数据与从显微镜23获得的接触后的图像数据进行比较，或者比较电极焊盘的登记的框架与当时检测到的电极焊盘的外周边 检查针迹，从而确定电极垫和探针102之间的接触质量。
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公开(公告)号：US10481177B2
公开(公告)日：2019-11-19
申请号：US15524925
申请日：2014-11-26
Applicant: TOKYO SEIMITSU CO., LTD.
Inventor： Yuichi Ozawa , Yasuhito Iguchi , Tetsuo Yoshida , Junzo Koshio
Abstract: A wafer inspection method improving inspection accuracy and operation efficiency. A method for performing electrical inspection by bringing into contact with pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads recognizing the positional shifts of the pads due to thermal expansion; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.
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Patent Agency Ranking
公开(公告)号：US09664733B2
公开(公告)日：2017-05-30
申请号：US14833518
申请日：2015-08-24
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Yuichi Ozawa , Hiroshi Nishimura , Seiichi Ohta , Yasuhito Iguchi , Kunihiko Chiba , Ken Kato
IPC: G01R31/308 , G01R31/28 , G01R1/073
CPC classification number: G01R31/2891 , G01R1/07307
Abstract: A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.
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5.发明授权公开(公告)号：US09442156B2
公开(公告)日：2016-09-13
申请号：US14833568
申请日：2015-08-24
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Yuichi Ozawa , Hiroshi Nishimura , Seiichi Ohta , Yasuhito Iguchi , Kunihiko Chiba , Ken Kato
CPC classification number: G01R31/2831 , G01R1/0408 , G01R31/2891
Abstract: The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.
Abstract translation: 本发明提供一种包括对准效用函数的探针装置。 当用户输入用于探针与每个芯片接触的接触位置的变化量（变化范围）的条件值时，在使用通过测量一个晶片中的每个芯片的位置获取的实际测量数据的模拟中 通过改变执行对准的测量点来计算每个芯片的变化范围，以计算最佳测量点的设置，使得变化范围等于或小于条件值，并且测量点的数量为 最低 然后向用户提供关于最佳测量点的信息。
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公开(公告)号：US20150362552A1
公开(公告)日：2015-12-17
申请号：US14833518
申请日：2015-08-24
Applicant: TOKYO SEIMITSU CO., LTD.
Inventor： Yuichi Ozawa , Hiroshi Nishimura , Seiichi Ohta , Yasuhito Iguchi , Kunihiko Chiba , Ken Kato
CPC classification number: G01R31/2891 , G01R1/07307
Abstract: A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.
Abstract translation: 本发明的探针装置测量要检查的晶片中的每个芯片的位置，以获得作为实际测量数据的位置。 然后，探针装置根据实际的测量数据，计算每个芯片的实际测量位置的变化量或探针与晶片的每个芯片接触的位置的变化量，并允许 显示器，用于显示可视地显示变化量的变化范围显示图像。 在图像中，显示与每个芯片相对应的四边形区域，并且根据变化量在从其中心位置偏移的位置处的每个四边形区域中显示点。
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公开(公告)号：US12282061B2
公开(公告)日：2025-04-22
申请号：US18774727
申请日：2024-07-16
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Akira Yamaguchi , Yuta Sato , Naoki Kasai , Naoyuki Yamazoe , Tetsuya Yasunaka , Kazuma Takii , Teppei Aoki , Wataru Kawasaki , Hiroki Ishida , Yasuhito Iguchi
Abstract: The wafer test system includes: a prober including a chuck that holds a semiconductor wafer and a probe card having probe needles thereon, and brings the probe needles in contact with semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips; an overhead hoist transport that delivers the cassette that houses the plurality of semiconductor wafers to be inspected to the prober and withdraws, from the prober, the cassette that houses the semiconductor wafers that have been inspected; a conveying control unit that controls the overhead hoist transport to convey the probe card between a replacement position of the probe card predetermined in the prober and a storage of the probe card located in a place different from the prober; and a card conveying mechanism that conveys the probe card between a holding position in the prober and the replacement position.
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8.发明申请公开(公告)号：US20150362553A1
公开(公告)日：2015-12-17
申请号：US14833568
申请日：2015-08-24
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Yuichi Ozawa , Hiroshi Nishimura , Seiichi Ohta , Yasuhito Iguchi , Kunihiko Chiba , Ken Kato
CPC classification number: G01R31/2831 , G01R1/0408 , G01R31/2891
Abstract: The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.
Abstract translation: 本发明提供一种包括对准效用函数的探针装置。 当用户输入用于探针与每个芯片接触的接触位置的变化量（变化范围）的条件值时，在使用通过测量一个晶片中的每个芯片的位置获取的实际测量数据的模拟中 通过改变执行对准的测量点来计算每个芯片的变化范围，以计算最佳测量点的设置，使得变化范围等于或小于条件值，并且测量点的数量为 最低 然后向用户提供关于最佳测量点的信息。
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