Low-temperature co-fired ceramics material and multilayer wiring board using the same
    2.
    发明申请
    Low-temperature co-fired ceramics material and multilayer wiring board using the same 有权
    低温共烧陶瓷材料和使用其的多层线路板

    公开(公告)号:US20050288167A1

    公开(公告)日:2005-12-29

    申请号:US11166367

    申请日:2005-06-27

    摘要: Objects of the present invention are to provide a low-temperature co-fired ceramic material having a coefficient of linear thermal expansion controlled and has a high dielectric constant, and to reduce the warpage of a fired product even if it has an unsymmetrical lamination structure in a multilayer wiring board in which glass-ceramic mixed layers of different compositions are laminated. A low-temperature co-fired ceramic material in accordance with the present invention includes: SiO2—B2O3—Al2O3-alkaline earth metal oxide based glass, alumina, titania, and cordierite; glass, titania, and cordierite; or glass, titania, and mullite. When a multilayer wiring board is made of the low-temperature co-fired ceramic material, the content of cordierite or mullite of the substrate material is adjusted to control a difference in a coefficient of linear thermal expansion between the layers of the substrate material to not more than 0.25×10−6/° C.

    摘要翻译: 本发明的目的是提供一种具有控制线性热膨胀系数并具有高介电常数的低温共烧陶瓷材料,并且即使其具有不对称层压结构也能减少烧制产品的翘曲 层叠不同组成的玻璃 - 陶瓷混合层的多层布线基板。 根据本发明的低温共烧陶瓷材料包括:SiO 2 -S 2 O 3 O 3 -Al < 碱土金属氧化物基玻璃,氧化铝,二氧化钛和堇青石; 玻璃,二氧化钛和堇青石; 或玻璃,二氧化钛和莫来石。 当由低温共烧陶瓷材料制成多层布线板时,调整基板材料的堇青石或莫来石的含量,以控制基板材料层之间的线性热膨胀系数的差异 大于0.25×10 -6 /℃

    Low-temperature co-fired ceramics material and multilayer wiring board using the same
    9.
    发明授权
    Low-temperature co-fired ceramics material and multilayer wiring board using the same 有权
    低温共烧陶瓷材料和使用其的多层线路板

    公开(公告)号:US07307032B2

    公开(公告)日:2007-12-11

    申请号:US11166367

    申请日:2005-06-27

    IPC分类号: C03C14/00 B32B17/06

    摘要: Objects of the present invention are to provide a low-temperature co-fired ceramic material having a coefficient of linear thermal expansion controlled and has a high dielectric constant, and to reduce the warpage of a fired product even if it has an unsymmetrical lamination structure in a multilayer wiring board in which glass-ceramic mixed layers of different compositions are laminated.A low-temperature co-fired ceramic material in accordance with the present invention includes: SiO2—B2O3—Al2O3— alkaline earth metal oxide based glass, alumina, titania, and cordierite; glass, titania, and cordierite; or glass, titania, and mullite. When a multilayer wiring board is made of the low-temperature co-fired ceramic material, the content of cordierite or mullite of the substrate material is adjusted to control a difference in a coefficient of linear thermal expansion between the layers of the substrate material to not more than 0.25×10−6/° C.

    摘要翻译: 本发明的目的是提供一种具有控制线性热膨胀系数并具有高介电常数的低温共烧陶瓷材料,并且即使其具有不对称层压结构也能减少烧制产品的翘曲 层叠不同组成的玻璃 - 陶瓷混合层的多层布线基板。 根据本发明的低温共烧陶瓷材料包括:SiO 2 -S 2 O 3 O 3 -Al 碱土金属氧化物基玻璃,氧化铝,二氧化钛和堇青石; 玻璃,二氧化钛和堇青石; 或玻璃,二氧化钛和莫来石。 当由低温共烧陶瓷材料制成多层布线板时,调整基板材料的堇青石或莫来石的含量,以控制基板材料层之间的线性热膨胀系数的差异 大于0.25×10 -6 /℃