公开(公告)号：US08558272B2

公开(公告)日：2013-10-15

申请号：US13184320

申请日：2011-07-15

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： H01L33/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US20110273880A1

公开(公告)日：2011-11-10

申请号：US13184320

申请日：2011-07-15

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： F21V7/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US20080055901A1

公开(公告)日：2008-03-06

申请号：US11844037

申请日：2007-08-23

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： F21V7/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US07989840B2

公开(公告)日：2011-08-02

申请号：US11844037

申请日：2007-08-23

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： H01L33/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US08773612B2

公开(公告)日：2014-07-08

申请号：US13202689

申请日：2010-02-26

申请人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

发明人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

IPC分类号： G02F1/1335

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting module (1) comprises a module substrate (2), a light emitting diode string (31), and a sealing member (48). The light emitting diode string (31) includes light emitting diode elements (32) and bonding wires (37) which connect the light emitting diode elements (32). The light emitting diode element (32) has a pair of element electrodes (33, 34) and has a rectangular shape extending in a direction along which the element electrodes (33, 34) are aligned. The sealing member (48) is laminated on the module substrate (2) to seal the light emitting diode string (31). The light emitting diode elements (32) are arranged at intervals in a direction crossing the direction along which the element electrodes (33, 34) are aligned, and the element electrodes (33, 34) with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements (32) between the light emitting diode elements (32) adjacent to each other. Each bonding wire (37) is obliquely wired with respect to the arrangement direction of the light emitting diode elements (32) to connect the element electrodes (33, 34) with different polarities of the light emitting diode elements (32) adjacent to each other.

摘要翻译： 发光模块（1）包括模块基板（2），发光二极管串（31）和密封构件（48）。 发光二极管串（31）包括连接发光二极管元件（32）的发光二极管元件（32）和接合线（37）。 发光二极管元件（32）具有一对元件电极（33,34），并且具有在元件电极（33,34）对齐的方向上延伸的矩形形状。 密封构件（48）层压在模块基板（2）上以密封发光二极管串（31）。 发光二极管元件（32）沿与元件电极（33,34）对准的方向交叉的方向间隔配置，具有相同极性的元件电极（33,34） 在彼此相邻的发光二极管元件（32）之间的发光二极管元件（32）的布置方向上彼此相对。 每个接合线（37）相对于发光二极管元件（32）的布置方向倾斜地连接，以将彼此相邻的发光二极管元件（32）的不同极性的元件电极（33,34）连接 。

公开(公告)号：US20110303927A1

公开(公告)日：2011-12-15

申请号：US13202689

申请日：2010-02-26

申请人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

发明人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

IPC分类号： H01L33/60

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting module (1) comprises a module substrate (2), a light emitting diode string (31), and a sealing member (48). The light emitting diode string (31) includes light emitting diode elements (32) and bonding wires (37) which connect the light emitting diode elements (32). The light emitting diode element (32) has a pair of element electrodes (33, 34) and has a rectangular shape extending in a direction along which the element electrodes (33, 34) are aligned. The sealing member (48) is laminated on the module substrate (2) to seal the light emitting diode string (31). The light emitting diode elements (32) are arranged at intervals in a direction crossing the direction along which the element electrodes (33, 34) are aligned, and the element electrodes (33, 34) with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements (32) between the light emitting diode elements (32) adjacent to each other. Each bonding wire (37) is obliquely wired with respect to the arrangement direction of the light emitting diode elements (32) to connect the element electrodes (33, 34) with different polarities of the light emitting diode elements (32) adjacent to each other.

摘要翻译： 发光模块（1）包括模块基板（2），发光二极管串（31）和密封构件（48）。 发光二极管串（31）包括连接发光二极管元件（32）的发光二极管元件（32）和接合线（37）。 发光二极管元件（32）具有一对元件电极（33,34），并且具有在元件电极（33,34）对齐的方向上延伸的矩形形状。 密封构件（48）层压在模块基板（2）上以密封发光二极管串（31）。 发光二极管元件（32）沿与元件电极（33,34）对准的方向交叉的方向间隔配置，具有相同极性的元件电极（33,34） 在彼此相邻的发光二极管元件（32）之间的发光二极管元件（32）的布置方向上彼此相对。 每个接合线（37）相对于发光二极管元件（32）的布置方向倾斜地连接，以将彼此相邻的发光二极管元件（32）的不同极性的元件电极（33,34）连接 。

公开(公告)号：US08569786B2

公开(公告)日：2013-10-29

申请号：US13105868

申请日：2011-05-11

申请人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

发明人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

IPC分类号： H01L33/62

CPC分类号： F21S8/086 ,  F21K9/23 ,  F21V23/06 ,  F21W2131/103 ,  F21Y2115/10 ,  H01R12/515

摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

摘要翻译： 根据一个实施例，发光器件包括衬底，发光元件和连接器。 基板具有表面和背面，并且在表面上形成电源端子。 发光元件安装在基板的表面上。 连接器包括与基板的表面侧上的电源端子接触的接触部分和具有在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到电线 连接器端子的连接部分。

公开(公告)号：US20110278632A1

公开(公告)日：2011-11-17

申请号：US13105868

申请日：2011-05-11

申请人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

发明人： Haruki Takei ,  Seiko Kawashima ,  Masahiro Izumi ,  Akiko Saito ,  Yusuke Shibahara ,  Tsuyoshi Oyaizu

IPC分类号： H01L33/62

CPC分类号： F21S8/086 ,  F21K9/23 ,  F21V23/06 ,  F21W2131/103 ,  F21Y2115/10 ,  H01R12/515

摘要： According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with, the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

摘要翻译： 根据一个实施例，发光器件包括衬底，发光元件和连接器。 基板具有表面和背面，并且在表面上形成电源端子。 发光元件安装在基板的表面上。 连接器包括与基板表面侧的电源端子接触的接触部分和在基板的背面侧突出的导线连接部分的连接器端子，并且电源线连接到 连接器端子的导线连接部分。

公开(公告)号：USD665518S1

公开(公告)日：2012-08-14

申请号：US29369472

申请日：2010-09-09

申请人： Akimichi Takahashi ,  Kiyoshi Nishimura ,  Akiko Saito ,  Masahiro Izumi ,  Soichi Shibusawa ,  Nobuhiko Betsuda

设计人： Akimichi Takahashi ,  Kiyoshi Nishimura ,  Akiko Saito ,  Masahiro Izumi ,  Soichi Shibusawa ,  Nobuhiko Betsuda

公开(公告)号：USD658599S1

公开(公告)日：2012-05-01

申请号：US29369474

申请日：2010-09-09

申请人： Akimichi Takahashi ,  Kiyoshi Nishimura ,  Akiko Saito ,  Masahiro Izumi ,  Soichi Shibusawa ,  Nobuhiko Betsuda

设计人： Akimichi Takahashi ,  Kiyoshi Nishimura ,  Akiko Saito ,  Masahiro Izumi ,  Soichi Shibusawa ,  Nobuhiko Betsuda