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    MAGNET UNIT FOR MAGNETRON SPUTTERING SYSTEM
    3.
    发明申请
    MAGNET UNIT FOR MAGNETRON SPUTTERING SYSTEM 审中-公开
    磁控溅射系统MAGNET单元

    公开(公告)号：US20090219123A1

    公开(公告)日：2009-09-03

    申请号：US12367222

    申请日：2009-02-06

    申请人： Akihiko Fujisaki ,  Atsushi Furuya ,  Nobuyoshi Yamaoka

    发明人： Akihiko Fujisaki ,  Atsushi Furuya ,  Nobuyoshi Yamaoka

    IPC分类号： H01F7/02

    CPC分类号： H01F7/0284 ,  H01F7/0221 ,  H01J37/3405

    摘要： According to an aspect of an embodiment, a magnet unit for a magnetron sputtering system includes a base board, an inner magnet fixed to the base board and an outer magnet fixed to the base board. The outer magnet is fixed surround the inner magnet. At least one of a portion of the inner magnet or a portion of the outer magnet is displaceable on the base board.

    摘要翻译： 根据实施例的一个方面，磁控溅射系统的磁体单元包括基板，固定到基板的内磁体和固定到基板的外磁体。 外磁体固定在内磁体周围。 内磁体的一部分或外磁体的一部分中的至少一个可在基板上移位。

    Air condition control device and controlling method
    4.
    发明授权
    Air condition control device and controlling method 有权
    空调控制装置及控制方法

    公开(公告)号：US08515585B2

    公开(公告)日：2013-08-20

    申请号：US12878385

    申请日：2010-09-09

    申请人： Yasushi Uraki ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Seiichi Saito

    发明人： Yasushi Uraki ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Seiichi Saito

    IPC分类号： G06F19/00

    CPC分类号： H05K7/20836 ,  F24F11/77

    摘要： An air condition control device for controlling a plurality of air conditioners which cool a plurality of electronic apparatuses respectively, the air condition control device includes a storage section for storing a heating value information related to respective heating values of the electronic apparatuses, and a controller for detecting that a fault has occurred in one of the air conditioners, specifying any of the electronic apparatuses which has been cooled by the one of the air conditioners having occurred the fault when the fault in the one of the air conditioners is detected, determining a heating value of each of the specified electronic apparatuses on the basis of the heating value information, and setting the air flow rate for at least one of the other air conditioners in accordance with the heating values of the specified electronic apparatuses.

    摘要翻译： 一种用于控制分别冷却多个电子设备的多个空调的空调控制装置，所述空调控制装置包括用于存储与所述电子设备的各个发热值相关的发热值信息的存储部，以及用于 检测其中一个空调器发生故障，指定在检测到一个空调器中的故障时已经发生故障的空调中的一个已冷却的任何电子设备，确定加热 根据所述发热值信息，指定电子设备中的每一个的值，并且根据所述指定的电子设备的发热值来设定所述其它空调中的至少一个的空气流量。

    TEMPERATURE PREDICTING APPARATUS AND METHOD
    5.
    发明申请
    TEMPERATURE PREDICTING APPARATUS AND METHOD 审中-公开
    温度预测装置和方法

    公开(公告)号：US20110057803A1

    公开(公告)日：2011-03-10

    申请号：US12874121

    申请日：2010-09-01

    申请人： Nobuyoshi Yamaoka ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Akira Ueda ,  Yasushi Uraki

    发明人： Nobuyoshi Yamaoka ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Akira Ueda ,  Yasushi Uraki

    IPC分类号： G08B17/00 ,  G01K3/00

    CPC分类号： H05K7/20836

    摘要： A temperature predicting apparatus for predicting possible abnormal temperature of air for cooling at least one of electronic devices mounted on a rack, the temperature predicting apparatus includes a storing section for storing temperature information related to at least one temperature measured by a temperature sensor provided on an intake side of the electronic device, and a controller for estimating a change tendency in the temperature on the intake side of the electronic device on the basis of the temperature information stored in the storing section, and predicting the possible abnormal temperature on the basis of the estimated change tendency.

    摘要翻译： 一种温度预测装置，用于预测用于冷却安装在机架上的电子装置中的至少一个的空气的可能的异常温度，所述温度预测装置包括：存储部，用于存储与由设置在所述机架上的温度传感器所测量的至少一个温度有关的温度信息; 电子装置的吸入侧，以及基于存储在存储部中的温度信息来估计电子装置的进气侧的温度的变化趋势的控制器，并且基于 估计变化趋势。

    Temperature control method of solder bumps in reflow furnace, and reflow furnace
    6.
    发明授权
    Temperature control method of solder bumps in reflow furnace, and reflow furnace 失效
    回流炉焊料凸点的温度控制方法和回流炉

    公开(公告)号：US06619531B1

    公开(公告)日：2003-09-16

    申请号：US09506339

    申请日：2000-02-18

    申请人： Nobuyoshi Yamaoka

    发明人： Nobuyoshi Yamaoka

    IPC分类号： B23K3700

    CPC分类号： B23K1/008 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2203/081 ,  H05K2203/163

    摘要： A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.

    摘要翻译： 一种用于确定回流炉状态的方法，以防止半导体元件由于在安装在基板上的半导体元件上的多个芯片模块的单个半导体元件中的不同的焊料凸块的折叠量而被倾斜。 对于使用输送带的回流炉中的输送方向，对前后的焊料凸块进行持续时间的温度分析，然后确定回流炉的状态，以便在两次的时间闭合 达到焊料熔化温度和保持焊料熔化温度的时间。

    Apparatus and method for controlling grille aperture ratios of a plurality of air transfer grilles
    7.
    发明授权
    Apparatus and method for controlling grille aperture ratios of a plurality of air transfer grilles 有权
    用于控制多个空气传送格栅的格栅孔径比的装置和方法

    公开(公告)号：US08768519B2

    公开(公告)日：2014-07-01

    申请号：US12782878

    申请日：2010-05-19

    申请人： Ikuro Nagamatsu ,  Junichi Ishimine ,  Seiichi Saito ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki

    发明人： Ikuro Nagamatsu ,  Junichi Ishimine ,  Seiichi Saito ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki

    IPC分类号： G05D23/00 ,  H05K7/20

    CPC分类号： H05K7/20836

    摘要： An apparatus for controlling grille aperture ratios of a plurality of air transfer grilles which are installed in a room, includes a determining unit for determining target grille air volumes of air blowing to the racks, for determining simulation air volumes of air blowing from the air transfer grilles on the basis of the target grille air volumes so that each of air of the target grille air volumes are blown to the racks, and for determining grille aperture ratios for each of the air transfer grilles on the basis of the plurality of simulation air volumes so that each of the amounts of air blowing from the air transfer grilles is replaced by each of the simulation air volumes, and a controller for controlling each of the grille aperture ratios of the air transfer grilles on the basis of each of the determined grille aperture ratios.

    摘要翻译： 一种用于控制安装在房间中的多个空气传送格栅的格栅孔径比的装置，包括：确定单元，用于确定向机架吹送的空气的目标格栅空气体积，用于确定从空气传送中吹出的空气的模拟空气体积 基于目标格栅空气体积格栅，使得目标格栅空气体积的每个空气被吹送到机架，并且基于多个模拟空气体积确定每个空气传送格栅的格栅孔径比 使得从空气传送格栅吹出的每个空气量被每个模拟空气量所取代;以及控制器，用于基于每个确定的格栅孔径来控制空气传送格栅的每个格栅孔径比 比率。

    Thermal-fluid-simulation analyzing apparatus
    10.
    发明申请
    Thermal-fluid-simulation analyzing apparatus 有权
    热流体仿真分析仪

    公开(公告)号：US20110060571A1

    公开(公告)日：2011-03-10

    申请号：US12805591

    申请日：2010-08-06

    申请人： Akira Ueda ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Nobuyoshi Yamaoka ,  Yasushi Uraki

    发明人： Akira Ueda ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Nobuyoshi Yamaoka ,  Yasushi Uraki

    IPC分类号： G06G7/48

    CPC分类号： G06F17/50 ,  G06F17/5004 ,  G06F17/5018 ,  G06F2217/16 ,  G06F2217/80 ,  H05K7/20609 ,  H05K7/20836

    摘要： A thermal-fluid-simulation analyzing apparatus includes an execution unit that generates an analysis model using analysis conditions to conduct a first thermal fluid simulation analysis based on the generated analysis model, an analysis-condition collecting unit that collects analysis conditions when a predetermined period passes after the first thermal fluid simulation analysis, a condition extracting unit that extracts a boundary condition from the analysis conditions collected by the analysis-condition collecting unit, and a re-execution unit that selects a region corresponding to the boundary condition extracted by the condition extracting unit from regions of the analysis model generated by the execution unit, updates the selected region with the boundary condition, and conducts a second thermal fluid simulation analysis for the updated analysis model.

    摘要翻译： 热流体模拟分析装置包括执行单元，其使用分析条件生成分析模型，以基于所生成的分析模型进行第一热流体模拟分析;分析条件收集单元，其在预定时间段通过时收集分析条件 在第一热流体模拟分析之后，条件提取单元从分析条件收集单元收集的分析条件中提取边界条件，以及重新执行单元，其选择与条件提取所提取的边界条件相对应的区域 由执行单元生成的分析模型的区域的单位，更新所选择的区域与边界条件，并对更新的分析模型进行第二热流体模拟分析。