公开(公告)号：US20180226268A1

公开(公告)日：2018-08-09

申请号：US15697615

申请日：2017-09-07

申请人： TOSHIBA MEMORY CORPORATION

发明人： Takashi Izumi ,  Fumitoshi Ikegaya

IPC分类号： H01L21/3213 ,  H01L21/67 ,  C25D17/00

CPC分类号： H01L21/32134 ,  C25D5/48 ,  C25D17/001 ,  H01L21/02087 ,  H01L21/67023 ,  H01L21/67051

摘要： A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.

公开(公告)号：US10483126B2

公开(公告)日：2019-11-19

申请号：US15697615

申请日：2017-09-07

申请人： TOSHIBA MEMORY CORPORATION

发明人： Takashi Izumi ,  Fumitoshi Ikegaya

IPC分类号： H01L21/3213 ,  H01L21/67 ,  C25D17/00 ,  C25D5/48 ,  H01L21/02

摘要： A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.

公开(公告)号：US10738389B2

公开(公告)日：2020-08-11

申请号：US14847374

申请日：2015-09-08

申请人： Toshiba Memory Corporation

发明人： Takashi Izumi ,  Fumitoshi Ikegaya

IPC分类号： C25D7/12 ,  C25D3/38 ,  C25D21/14 ,  C25D21/18 ,  C25D21/12 ,  H05K3/42 ,  C25D21/16

摘要： A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.